MC9S12P128MQK vs MC9S12DT256CPVE 对比

详细并排对比 MC9S12P128MQK 出自 NXP Semiconductors 和 MC9S12DT256CPVE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12P128MQK MC9S12P128MQK - 16-Bit 128KB Flash S12 MCU | NXP | QFP-80

MC9S12P128MQK - 16-Bit 128KB Flash S12 MCU | NXP | QFP-80

MC9S12P128MQK ✓ 量产中
NXP Semiconductors
MC9S12DT256CPVE MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE Nrnd

规格对比

参数 MC9S12P128MQK MC9S12DT256CPVE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $6.10 $20.85
Core Architecture HCS12 / CPU12 (16-bit) —
Program Memory 128 KB Flash —
Data RAM 6 KB —
Maximum CPU Frequency 32 MHz —
数据总线宽度 16-bit 16-bit
Number of I/Os 64 I/O —
ADC Resolution 12-bit —
电源电压 3.15 V to 5.5 V 2.35 V to 2.75 V (core), 5 V I/O tolerant typical
工作温度 -40 °C to +125 °C (Automotive) -40C to +85C (industrial, per 'P' suffix family)
安装方式 SMD/SMT —
封装 QFP-80 (LQFP-80, 14x14 mm) 112-pin LQFP (20x20 mm)
Terminal Form GULL WING —
Communications CAN, SCI, SPI —
Programming Interface Background Debug Mode (BDM) —
Temperature Grade Automotive —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status from manufacturer]
Core Processor — HCS12 (CPU12 CISC)
Core Size — 16-bit
最大时钟频率 — 25 MHz
Program Memory Size — 256 KB (256K x 8) Flash
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Pins — 91
ADC — 2x 8-channel, 10-bit
PWM Channels — 8 channels
Connectivity — CAN, I2C, SCI (UART), SPI
Timers — 8-channel Enhanced Capture Timer (ECT)
安装类型 — Surface Mount
Debug Interface — BDM (Background Debug Mode)
Watchdog — COP (Computer Operating Properly) watchdog

数据手册与资源

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