MC9S12XDT256CAG vs MC9S12XDT256MAA 对比

详细并排对比 MC9S12XDT256CAG 出自 NXP Semiconductors 和 MC9S12XDT256MAA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12XDT256CAG MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

MC9S12XDT256CAG ⚠ 最后一次采购
NXP Semiconductors
MC9S12XDT256MAA MC9S12XDT256MAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256MAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256MAA Nrnd

规格对比

参数 MC9S12XDT256CAG MC9S12XDT256MAA
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $17.40 $0.00
Core HCS12X (16-bit CISC with XGATE co-processor) —
Program Memory 256 KB Flash —
RAM 16 KB —
EEPROM 4 KB —
Maximum CPU Frequency 80 MHz —
Supply Voltage - Core 2.35 V to 2.75 V —
Supply Voltage - I/O 4.5 V to 5.5 V —
I/O Pins 119 —
工作温度 -40C to +85C —
封装 144-pin LQFP (20x20 mm) 80-QFP (14x14 mm)
CAN Controllers (MSCAN) 5 (CAN 2.0 A/B) —
SCI / SPI Yes —
ADC 16-channel, 10-bit —
PWM Channels 8 —
Timers ECT (Enhanced Capture Timer) —
安装类型 Surface Mount Surface Mount
MSL 等级 [DATA_NEEDED: MSL level] —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Debug Interface BDM (Background Debug Mode) —
生命周期状态 No Longer Manufactured (per NXP product page) —
Core Processor — HCS12X
Core Size — 16-Bit
Core Architecture — CISC
Maximum Clock Speed — 80 MHz
Program Memory Size — 256KB (256K x 8)
Program Memory Type — FLASH
RAM Size — 16KB
电源电压 — 2.5V/5V
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 59
Terminal Form — Gull Wing
Packaging — Tray
Temperature Grade — Automotive
Part Status — NRND (Not Recommended for New Designs)
工作温度范围 — [DATA_NEEDED: operating temperature range]

数据手册与资源

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