MPC755CPX400LE vs MPC755BPX350LE 对比
详细并排对比 MPC755CPX400LE 出自 NXP Semiconductors 和 MPC755BPX350LE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC755CPX400LE | MPC755BPX350LE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $82.50 | $49.90 |
| Manufacturer | NXP Semiconductors (formerly Motorola/Freescale) | — |
| Part Family | MPC7xx PowerPC G3 | — |
| Core Architecture | PowerPC 32-bit RISC, 64-bit external bus | — |
| Core Clock Speed | 400 MHz | — |
| 数据总线宽度 | 64-bit | 64-Bit |
| Address Bus Width | 32-bit | — |
| On-chip L2 Cache | 256 KB unified with ECC | — |
| Floating Point Unit | Double-precision IEEE-754 FPU | — |
| Supply Voltage - Core | 2.5 V | — |
| Supply Voltage - I/O | 3.3 V | — |
| Process Technology | 0.22 um CMOS, 5 metal layers | 0.22 micrometer CMOS |
| 封装 | 360-FCBGA (25 mm x 25 mm) | 360-FCPBGA (25x25 mm, 1.27 mm pitch) |
| 安装类型 | Surface Mount (Flip-Chip BGA) | — |
| 工作结温 | 0 C to +105 C | — |
| Weight / Tray Qty | [DATA_NEEDED: tray quantity] | — |
| Lead Free / RoHS | SnPb solder balls - NOT RoHS compliant | — |
| 引脚数量 | 360 | — |
| Addressable Memory | Up to 2 GB via 32-bit address bus | — |
| 生命周期状态 | Obsolete - last time-buy programs are closed | — |
| Product Type | — | Microprocessor (MPU) |
| Architecture | — | RISC, PowerPC MPC7xx |
| Core Count | — | 1 |
| Clock Speed (Core) | — | 350 MHz |
| Supply Voltage (Core) | — | 2 V |
| I/O Supply Voltage | — | 3.3 V |
| Terminal Form | — | Ball |
| Number of Terminals | — | 360 |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| 湿敏等级（MSL） | — | 3 |
| Package Type | — | FCBGA-360, Plastic, 25x25 mm, 2.77 mm height |
| RoHS 状态 | — | [DATA_NEEDED: RoHS compliance] |