MPC8306VMABDCA vs MPC8306SVMABDCA 对比
详细并排对比 MPC8306VMABDCA 出自 NXP Semiconductors 和 MPC8306SVMABDCA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8306SVMABDCA - PowerQUICC II Pro MPU, e300, 133MHz | NXP
MPC8306SVMABDCA ⚠ 最后一次采购规格对比
| 参数 | MPC8306VMABDCA | MPC8306SVMABDCA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $16.10 | $17.00 |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | — |
| 数据总线宽度 | 32 bit | 32-bit |
| Core Frequency | 133 MHz | 133 MHz |
| Memory Controller | DDR2 with ECC | DDR2 up to 333 MHz data rate |
| Co-Processor / DSP | QUICC Engine (communications offload) | — |
| Ethernet | 2x 10/100 MAC with R/MII, IEEE 1588 v2 | Dual 10/100 MAC with MII/RMII |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| CAN | CAN 2.0 | — |
| Serial Protocols | HDLC, TDM (time-slot) | — |
| Graphics Acceleration | No | — |
| 封装 | 369-LFBGA (19x19 mm) | 369-MAPBGA (19x19 mm, 0.8 mm pitch) |
| 安装类型 | Surface Mount (BGA) | — |
| 工作温度 | 0 °C to +105 °C | 0C to +105C |
| RoHS 状态 | [DATA_NEEDED: rohs status] | Compliant (lead-free) |
| Series | MPC83xx / PowerQUICC II Pro | — |
| Core Architecture | — | PowerPC e300c3 (Power Architecture) |
| Core Count | — | 1 |
| On-chip Cache | — | 32 KB instruction / 32 KB data |
| Connectivity | — | QUICC Engine (HDLC, TDM), 2x UART |
| 电源电压 | — | 1.0 V core / 1.8 V, 2.5 V, 3.3 V I/O |
| Lead-Free | — | Yes |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |