MPC8314CVRAGDA vs MPC8314ECVRAFDA 对比
详细并排对比 MPC8314CVRAGDA 出自 NXP Semiconductors 和 MPC8314ECVRAFDA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8314CVRAGDA - PowerQUICC II Pro 400MHz SoC | NXP | 620-HBGA
MPC8314CVRAGDA ⚠ 最后一次采购NXP Semiconductors
MPC8314ECVRAFDA - PowerQUICC II Pro SoC, 333MHz, 620-HBGA | NXP
MPC8314ECVRAFDA ✓ 量产中规格对比
| 参数 | MPC8314CVRAGDA | MPC8314ECVRAFDA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $19.20 | $25.40 |
| Core Architecture | PowerPC e300c3 | Power Architecture e300c3 |
| Core Count | 1 | — |
| 数据总线宽度 | 32 bit | 32-bit |
| 最大时钟频率 | 400 MHz | — |
| Instruction Cache | 16 KB | — |
| Data Cache | 16 KB | — |
| Memory Controller | DDR1/DDR2, 32-bit | DDR1 and DDR2 SDRAM |
| PCI Interface | PCI v2.3, 32-bit, up to 66 MHz | 32-bit PCI v2.3 + PCI Express |
| Ethernet | 2x 10/100/1000 Mbps GMII / RGMII | — |
| USB | USB 2.0 (Host/Device/OTG) | — |
| TDM Interface | TDM (T1/E1) | Yes (TDM) |
| Encryption Engine | Not present (C-variant, non-encrypt) | — |
| Process Technology | 90 nm CMOS | — |
| 封装 | 620-HBGA (HCTE-BGA, 29x29 mm) | 620-HBGA (29x29 mm) |
| 工作温度 | -40C to +105C | — |
| 电源电压 | Core 1.0 V, I/O 3.3 V (typical) | — |
| 安装类型 | Surface Mount, 1.0 mm ball pitch | Surface Mount (BGA) |
| MSL 等级 | 3 (per JEDEC J-STD-020) | — |
| RoHS 状态 | Compliant | See _validation_note |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Type | — | PowerQUICC II Pro Communications Processor |
| Maximum CPU Clock Frequency | — | 333 MHz |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| Gigabit Ethernet MACs | — | 2 (RGMII, MII/RGMII) |
| USB Interface | — | USB 2.0 Full-Speed / Low-Speed |
| Security Engine | — | SEC 2.0 (DES/3DES/AES/SHA) |
| 工作温度范围 | — | -40C to +105C (junction) |
| Silicon Revision | — | Rev 1 |