MPC8358ECZQAGDGA vs MPC8358EZQAGDDA 对比
详细并排对比 MPC8358ECZQAGDGA 出自 NXP Semiconductors 和 MPC8358EZQAGDDA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8358ECZQAGDGA - PowerQUICC II Pro MPU 400MHz 668-BGA | NXP
MPC8358ECZQAGDGA Obsolete
规格对比
| 参数 | MPC8358ECZQAGDGA | MPC8358EZQAGDDA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 有效 |
| Core Processor | PowerPC e300 | — |
| Number of Cores | 1 | — |
| Bus Width | 32-bit | — |
| Core Speed | 400 MHz | — |
| Series | MPC83xx | — |
| Co-Processors / DSP | Communications; QUICC Engine, Security; SEC | — |
| RAM Controllers | DDR, DDR2 | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | [DATA_NEEDED] | — |
| Ethernet | 10/100/1000 Mbps (GMII/RGMII/TBI) | Up to 3 x 10/100/1000 Mbit (via QUICC Engine) |
| USB | USB 2.0 FS/HS | USB 2.0 (Full/High Speed) |
| PCI | Yes (32-bit) | PCI 2.2, 32-bit, up to 66 MHz |
| 工作温度 | -40C to +105C | 0 C to +105 C (junction) |
| 封装 / 外壳 | 668-BBGA Exposed Pad (PBGA-PGE, 29x29 mm) | — |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Contains Lead | — |
| Part Status | Obsolete | — |
| Voltage | 1.2 V (core) / 1.8 V / 2.5 V / 3.3 V (I/O) | — |
| Process Technology | 0.13 um | — |
| Core Architecture | — | PowerPC e300 (single core) |
| 数据总线宽度 | — | 32-bit |
| Maximum Core Frequency | — | 400 MHz |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | 668-pin TE-PBGA-PGE (29x29 mm) |
| Memory Interface | — | DDR1/DDR2 with ECC |
| Serial Protocols | — | ATM, HDLC, TDM, UART |
| Security Engine | — | SEC 2.0 (IPSec/SSL/3GPP acceleration) |
| Local Bus | — | 8 chip selects, SRAM/Flash/NOR |
| Lead-Free / RoHS | — | Lead-free finish; RoHS compliant |
| MSL 等级 | — | [DATA_NEEDED: MSL moisture sensitivity level] |