MPC8358ECZQAGDGA vs MPC8358EZQAGDDA 비교
다음의 상세 나란히 비교: MPC8358ECZQAGDGA 제조: NXP Semiconductors 및 MPC8358EZQAGDDA 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MPC8358ECZQAGDGA - PowerQUICC II Pro MPU 400MHz 668-BGA | NXP
MPC8358ECZQAGDGA Obsolete
사양 비교
| 파라미터 | MPC8358ECZQAGDGA | MPC8358EZQAGDDA |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | Obsolete | 활성 |
| Core Processor | PowerPC e300 | — |
| Number of Cores | 1 | — |
| Bus Width | 32-bit | — |
| Core Speed | 400 MHz | — |
| Series | MPC83xx | — |
| Co-Processors / DSP | Communications; QUICC Engine, Security; SEC | — |
| RAM Controllers | DDR, DDR2 | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | [DATA_NEEDED] | — |
| Ethernet | 10/100/1000 Mbps (GMII/RGMII/TBI) | Up to 3 x 10/100/1000 Mbit (via QUICC Engine) |
| USB | USB 2.0 FS/HS | USB 2.0 (Full/High Speed) |
| PCI | Yes (32-bit) | PCI 2.2, 32-bit, up to 66 MHz |
| 동작 온도 | -40C to +105C | 0 C to +105 C (junction) |
| 패키지 / 케이스 | 668-BBGA Exposed Pad (PBGA-PGE, 29x29 mm) | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Contains Lead | — |
| Part Status | Obsolete | — |
| Voltage | 1.2 V (core) / 1.8 V / 2.5 V / 3.3 V (I/O) | — |
| Process Technology | 0.13 um | — |
| Core Architecture | — | PowerPC e300 (single core) |
| 데이터 버스 폭 | — | 32-bit |
| Maximum Core Frequency | — | 400 MHz |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | 668-pin TE-PBGA-PGE (29x29 mm) |
| Memory Interface | — | DDR1/DDR2 with ECC |
| Serial Protocols | — | ATM, HDLC, TDM, UART |
| Security Engine | — | SEC 2.0 (IPSec/SSL/3GPP acceleration) |
| Local Bus | — | 8 chip selects, SRAM/Flash/NOR |
| Lead-Free / RoHS | — | Lead-free finish; RoHS compliant |
| MSL 레벨 | — | [DATA_NEEDED: MSL moisture sensitivity level] |