MPC8360EZUAGDGA vs MPC8358EVVAGDGA 对比
详细并排对比 MPC8360EZUAGDGA 出自 NXP Semiconductors 和 MPC8358EVVAGDGA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPC8358EVVAGDGA ✗ 停产规格对比
| 参数 | MPC8360EZUAGDGA | MPC8358EVVAGDGA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 停产 |
| Architecture | PowerPC e300 (Power Architecture) | RISC (PowerPC e300) |
| Core Count | 1 | — |
| 数据总线宽度 | 32-bit | 32-Bit |
| Core Clock Speed | 400 MHz | — |
| 电源电压 | 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] | — |
| Memory Interface | DDR1 / DDR2 | — |
| Ethernet | 1 Gbit (10/100/1000) | — |
| PCI Interface | 32-bit PCI | — |
| USB | USB 2.0 full/low-speed | USB 2.0 FS device/host |
| TDM / ATM | Yes (TDM and ATM) | — |
| Security Accelerator | SEC (crypto engine) | — |
| 封装 | 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch | — |
| Package Height | 1.46 mm | — |
| Lead-Free / RoHS | Lead-free (per datasheet) | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data |
| 工作温度 | 0 C to 105 C | 0 °C to +105 °C |
| 安装类型 | Surface Mount | — |
| Product Family | MPC83xx PowerQUICC II Pro | — |
| Series | MPC8360E | — |
| Core Frequency | — | 400 MHz |
| Number of Cores | — | 1 |
| Core Process Technology | — | 0.13 µm CMOS |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | TBGA-740 |
| Package Dimensions | — | 37.5 x 37.5 mm, 1.46 mm height |
| Ball Pitch | — | 1.0 mm |
| 引脚数量 | — | 740 |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM with ECC |
| Ethernet Interfaces | — | Gigabit (10/100/1000 Mbps) |
| PCI | — | PCI 2.2 |
| Security Engine | — | SEC (DES/3DES/AES/SHA) |