MPC8360EZUAGDGA vs MPC8358EVVAGDGA 비교

다음의 상세 나란히 비교: MPC8360EZUAGDGA 제조: NXP Semiconductors 및 MPC8358EVVAGDGA 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MPC8360EZUAGDGA MPC8360EZUAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360EZUAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360EZUAGDGA ✓ 활성
NXP Semiconductors
MPC8358EVVAGDGA MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP

MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP

MPC8358EVVAGDGA ✗ 단종

사양 비교

파라미터 MPC8360EZUAGDGA MPC8358EVVAGDGA
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 활성 수명 종료
Architecture PowerPC e300 (Power Architecture) RISC (PowerPC e300)
Core Count 1 —
데이터 버스 폭 32-bit 32-Bit
Core Clock Speed 400 MHz —
공급 전압 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown] —
Memory Interface DDR1 / DDR2 —
Ethernet 1 Gbit (10/100/1000) —
PCI Interface 32-bit PCI —
USB USB 2.0 full/low-speed USB 2.0 FS device/host
TDM / ATM Yes (TDM and ATM) —
Security Accelerator SEC (crypto engine) —
패키지 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch —
Package Height 1.46 mm —
Lead-Free / RoHS Lead-free (per datasheet) Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data
동작 온도 0 C to 105 C 0 °C to +105 °C
실장 유형 Surface Mount —
Product Family MPC83xx PowerQUICC II Pro —
Series MPC8360E —
Core Frequency — 400 MHz
Number of Cores — 1
Core Process Technology — 0.13 µm CMOS
Core Supply Voltage — 1.2 V
I/O Supply Voltage — 1.8 V / 2.5 V / 3.3 V
Package Type — TBGA-740
Package Dimensions — 37.5 x 37.5 mm, 1.46 mm height
Ball Pitch — 1.0 mm
핀 수 — 740
Integrated Memory Controller — DDR1 / DDR2 SDRAM with ECC
Ethernet Interfaces — Gigabit (10/100/1000 Mbps)
PCI — PCI 2.2
Security Engine — SEC (DES/3DES/AES/SHA)

데이터시트 & 자료

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