MPC8541ECPXALF vs MPC8541EPXALF 对比

详细并排对比 MPC8541ECPXALF 出自 NXP Semiconductors 和 MPC8541EPXALF 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8541ECPXALF MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF ✓ 量产中
NXP Semiconductors
MPC8541EPXALF MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP

MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP

MPC8541EPXALF ⚠ 最后一次采购

规格对比

参数 MPC8541ECPXALF MPC8541EPXALF
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 最后采购期
Core Architecture PowerPC e500 (Book-E enhanced) PowerPC e500, 32-bit
Maximum Core Frequency 667 MHz —
数据总线宽度 64-bit 64-bit
Instruction Set 32-bit Power Architecture —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 256 KB 256 KB unified with ECC
Core Supply Voltage 1.2 V (typical) —
I/O Supply Voltage 3.3 V —
Ethernet Controllers 4x eTSEC (Gigabit) + 2x 10/100 Ethernet (FCC) 3 x eTSEC (10/100/1000 Mbps)
Memory Controller DDR/DDR2 with ECC 64-bit DDR/DDR2 with ECC
PCI Express PCIe x1 / x2 —
Security Engine SEC 3.0 (DES, 3DES, AES, SHA, MD5, RSA, Kasumi) SEC 2.0 (DES/3DES/AES/SHA)
封装 783-FCBGA (29 x 29 mm, 1 mm pitch, flip chip) —
工作温度 -40C to +105C 0C to +105C
安装类型 Surface Mount Surface Mount (Flip-Chip BGA)
RoHS Compliance Compliant (lead-free) —
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — PowerQUICC III (MPC85xx)
Core Frequency — 667 MHz
电源电压 — 1.2 V (core); 2.5 V / 3.3 V (I/O)
Package Type — FCBGA-783 (29 x 29 mm, 1 mm pitch, Flip-Chip)
引脚数量 — 783
L1 Cache — 32 KB instruction + 32 KB data
RoHS 状态 — Compliant
Lead Free — Yes

数据手册与资源

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