MPC860DPZQ66D4 vs MPC860PCVR66D4 对比
详细并排对比 MPC860DPZQ66D4 出自 NXP Semiconductors 和 MPC860PCVR66D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC860DPZQ66D4 | MPC860PCVR66D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $25.28 | $68.90 |
| Processor Type | MPC8xx PowerQUICC 32-Bit RISC MPU | — |
| Core | 1 Core, 32-Bit PowerPC | — |
| Operating Frequency | 66 MHz | — |
| Core / I/O Voltage | 3.3 V | — |
| L1 Instruction Cache | 4 Kbyte | — |
| L1 Data Cache | 4 Kbyte | — |
| On-chip RAM (per data sheet) | [DATA_NEEDED: internal SRAM size] | — |
| Co-Processor / DSP | Communications Processor Module (CPM) | — |
| Ethernet | 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) | — |
| DRAM Controller | Yes, up to 256 Mbyte addressable | — |
| Address Bus Width | 32-Bit | — |
| 封装 / 外壳 | 357-Ball PBGA, 25 x 25 mm | 357-BBGA (PBGA, 25x25 mm) |
| Packaging | Tray | — |
| Lead-Free Status | Contains Lead | — |
| RoHS 状态 | Non-RoHS (legacy BGA, contains lead) | RoHS Compliant |
| 工作温度 | 0C to +70C (commercial grade) | -40C to +95C |
| Part Status | Not For New Designs | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | MPC8xx PowerQUICC |
| Core Architecture | — | PowerPC |
| Core Count | — | 1 (plus CPM RISC engine) |
| 数据总线宽度 | — | 32-bit |
| 最大时钟频率 | — | 66 MHz |
| 工作电源电压 | — | 3.3 V nominal |
| 安装类型 | — | Surface Mount (BGA) |
| MSL 等级 | — | 3 (168 hours) |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| Lead Free Status | — | Lead Free |
| REACH Status | — | REACH Unaffected |
| HTSUS | — | 8542.31.0001 |
| Lifecycle | — | End of Life (NXP product page marks EOL) |