MT40A256M16GE-075E:B vs MT40A256M16GE-083E 对比

详细并排对比 MT40A256M16GE-075E:B 出自 Micron Technology 和 MT40A256M16GE-083E 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT40A256M16GE-075E:B MT40A256M16GE-075E:B - 4Gb DDR4 SDRAM 2666 MT/s | Micron

MT40A256M16GE-075E:B - 4Gb DDR4 SDRAM 2666 MT/s | Micron

MT40A256M16GE-075E:B ✓ 量产中
Micron Technology
MT40A256M16GE-083E MT40A256M16GE-083E - DDR4 4Gb 256Mx16 2400MHz DRAM | Micron

MT40A256M16GE-083E - DDR4 4Gb 256Mx16 2400MHz DRAM | Micron

MT40A256M16GE-083E ✗ 停产

规格对比

参数 MT40A256M16GE-075E:B MT40A256M16GE-083E
品牌 Micron Technology Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 停产
库存状态 有库存 有库存
单价(USD) $3.95 $2.20
存储器类型 DDR4 SDRAM DDR4 SDRAM
存储容量 4 Gbit —
存储组织 256M x 16 256M x 16
Memory Interface Parallel —
Clock Frequency 1.33 GHz 1200 MHz (DDR4-2400)
数据速率 2666 MT/s (DDR4-2666) —
VDD / VDDQ 1.2 V +/-60 mV —
VPP 2.5 V, -125 mV/+250 mV —
Internal Banks 16 —
Refresh 64 ms / 8192-cycle; 32 ms / 8192-cycle at 95C [DATA_NEEDED: refresh rate]
I/O Type 1.2 V pseudo open-drain —
VREFDQ On-die, internal, adjustable generation —
Special Features Temperature controlled refresh (TCR) —
封装 96-FBGA (9 x 14 mm) 96-ball FBGA, 9 x 14 mm
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range for standard grade] [DATA_NEEDED: operating temperature range]
Access Time [DATA_NEEDED: CAS latency / access time] —
Density — 4 Gbit
电源电压 — 1.2 V
接口 — Parallel
Technology — CMOS DRAM
ECCN — EAR99
Country of Origin — China
无卤 — Compliant
Lead Free — Yes
Introduction Date — August 2017
Lifecycle — Obsolete / End of Life (per distributor cross-reference data)
CAS 延迟 — [DATA_NEEDED: CAS latency at DDR4-2400]

数据手册与资源

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