MT40A512M16LY-075:E vs H5AN8G6NDJR-XNC 对比

详细并排对比 MT40A512M16LY-075:E 出自 Micron Technology 和 H5AN8G6NDJR-XNC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT40A512M16LY-075:E MT40A512M16LY-075:E - 8Gb DDR4 SDRAM 2666MT/s | Micron

MT40A512M16LY-075:E - 8Gb DDR4 SDRAM 2666MT/s | Micron

MT40A512M16LY-075:E ✓ 量产中
SK hynix
H5AN8G6NDJR-XNC H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC ✓ 量产中

规格对比

参数 MT40A512M16LY-075:E H5AN8G6NDJR-XNC
品牌 Micron Technology SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $5.80 $55.68
存储器类型 DDR4 SDRAM DDR4 SDRAM
存储容量 8 Gbit (512M x 16) 8 Gb
数据速率 2666 MT/s 3200 Mbps
Clock Frequency 1.33 GHz —
CAS 延迟 19 —
Supply Voltage (VDD/VDDQ) 1.2V ±60mV —
VPP Supply 2.5V (-125mV, +250mV) —
接口 Parallel —
封装 96-FBGA (7.5x13.5mm) FBGA-96 (13x7.5 mm)
工作温度范围 0°C to +95°C —
Refresh Time 64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C to 105°C —
Internal Banks (x16) 8 banks (4 groups of 2) —
I/O Type 1.2V pseudo open-drain —
RoHS Compliant Compliant
安装类型 Surface Mount —
Memory Organization — 512M x16
Supply Voltage (VDD) — 1.2 V (max 1.26 V)
Number of Terminals — 96
Maximum Operating Temperature — 85 °C
Input/Output Type — COMMON
Lead-Free — Yes
无卤 — Yes
Auto Self-Refresh — Yes
Auto Precharge — Yes
Data Mask — Yes
Dynamic On-Chip Termination — Yes
ZQ Calibration — Yes
CRC Function — Yes
Write Leveling — Yes
Asynchronous Reset — Yes

数据手册与资源

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