MT53E256M16D1FW-046 vs H5CG46AGBDX017 对比

详细并排对比 MT53E256M16D1FW-046 出自 Micron Technology 和 H5CG46AGBDX017 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT53E256M16D1FW-046 MT53E256M16D1FW-046 - 4Gb LPDDR4X SDRAM 2133MHz | Micron

MT53E256M16D1FW-046 - 4Gb LPDDR4X SDRAM 2133MHz | Micron

MT53E256M16D1FW-046 ✓ 量产中
SK hynix
H5CG46AGBDX017 H5CG46AGBDX017 - 16Gb DDR5 5600Mbps SDRAM | SK hynix

H5CG46AGBDX017 - 16Gb DDR5 5600Mbps SDRAM | SK hynix

H5CG46AGBDX017 ✓ 量产中

规格对比

参数 MT53E256M16D1FW-046 H5CG46AGBDX017
品牌 Micron Technology SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $7.20 $92.10
存储器类型 SDRAM - Mobile LPDDR4X DDR5 SDRAM
Density 4 Gbit 16 Gb
存储组织 256M x 16 1G x 16
数据速率 2133 Mbps/pin (2.133 GHz) 5600 Mbps/pin
Clock Cycle Time 3.5 ns —
Core Supply Voltage (VDD) 1.1 V —
I/O Supply Voltage (VDDQ) 0.6 V (LPDDR4X) —
接口 Parallel DDR5 (Double Data Rate 5)
封装 200-TFBGA (10 x 14.5 mm) FBGA (surface mount)
安装类型 Surface Mount (BGA soldered) Surface Mount
Technology LPDDR4X LPDRAM —
Speed Grade -046 (2133 MHz class) —
Temperature Grade (WT suffix) [DATA_NEEDED: operating temperature range for WT grade] —
Ball Count 200 [DATA_NEEDED: package ball count]
Package Dimensions 10 mm x 14.5 mm —
Low Power Modes Self-refresh, deep power-down, DPD —
RoHS 状态 [DATA_NEEDED: RoHS status from datasheet] Compliant (per JLCPCB listing)
Supply Voltage (VDD) — [DATA_NEEDED: VDD nominal, expected 1.1 V per DDR5 JEDEC class]
On-Die ECC — [DATA_NEEDED: on-die ECC support confirmation]
工作温度 — [DATA_NEEDED: operating temperature range]
Refresh — [DATA_NEEDED: refresh scheme]
Generation — DDR5
Manufacturer Part Status — In stock at multiple distributors
Typical Applications — Data storage, firmware boot, embedded logging, industrial controllers, computing modules

数据手册与资源

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