OSD3358-512M-BSM - ARM Cortex-A8 SiP, 1GHz, 512MB DDR3 | Octavo
料号： OSD3358-512M-BSM ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $41.85 | $41.85 |
| 10 | $39.45 | $394.50 |
| 100 | $36.15 | $3,615.00 |
| 500 | $33.4 | $16,700.00 |
| 1,000 | $30.95 | $30,950.00 |
OSD3358-512M-BSM 概述
A System-in-Package combines multiple silicon dies and passive components inside a single BGA package, eliminating inter-chip PCB traces and reducing both board area and BOM count. SiPs are a category of multi-chip module (MCM) optimized for embedded compute; alternatives include chip-on-board (CoB) and discrete multi-chip layouts. By integrating the DDR3 interface inside the package, the OSD3358 removes the most challenging signal-integrity work - matched-length 16-bit memory bus - from the customer's PCB, letting teams focus on application logic.
Key features of the OSD3358-512M-BSM include 512 MB of 32-bit wide DDR3 with on-package termination, an integrated TI TPS65217C PMIC and LDO stack, four UART, two I2C, two SPI, and dual gigabit-capable industrial Ethernet MACs. The exposed AM3358 peripherals include two independent PRU subsystems for real-time I/O, two USB 2.0 ports (one HS host, one HS dual-role), and the SGX530 3D graphics engine for HMI rendering at up to 1080p. With 512 MB of system RAM and full MMU virtualization, the module can run Debian Linux, FreeRTOS, or Android 4.x out of the box.
Hardware-wise, the SiP uses 1.27-mm-pitch BGA pins to expose 256 signal balls on a 21x21 mm land pattern, with a top-side shielding can for EMI suppression. The pocketbeagle-compatible pin map (P1/P2 headers, 72 GPIOs) and reference schematics dramatically shorten prototyping. Octavo notes the device supports industrial I/O voltages via the on-package PMIC; a coin-cell backup rail and RTC are not integrated and require external implementation.
Typical applications include industrial automation gateways, robotics motor controllers, building-automation edge nodes, retail kiosks with a graphical HMI, and battery-powered portable data loggers. The extended -25 C to +85 C variant (OSD3358-512M-BEM) covers harsher industrial deployments where the commercial BSM is marginal. The OSD3358-512M-BSM is also commonly used as a turnkey compute core for hand-held instruments and PoE-powered IP cameras.
When designing with this SiP, engineers must treat the thermal pad and shielding can as a single thermal mass; a minimum 4-layer PCB with continuous ground pour is recommended to keep junction temperature within the AM3358's 90 C envelope. The on-package PMIC requires only a single 5 V rail - simplifying power-tree design - but the DDR3 self-refresh current and PRU real-time latency must be budgeted against battery life in portable designs.
This page synthesizes XAIPART distributor pricing, OSD335x-family drop-in alternatives, and curated design notes not collected on the Octavo product brief.
直接替换替代料： OSD3358-512M-BSM ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： OSD3358-512M-BSM （相同外形与封装尺寸） ——差异在于 Mounting Type, Operating Temperature, Package.
快速对比工具——选择替代料号进行并排对比：
OSD3358-512M-BEM
✅ 直接替换📋 参考替代料（不在目录中）
OSD3358-1G-ISM
✅ 直接替换📋 参考替代料（不在目录中）
OSD3358-512M-ISM
✅ 直接替换✓ 有现货
$46.8 / 个
查看数据手册 →OSD3358-1G-BSM
✅ 直接替换📋 参考替代料（不在目录中）
OSD3358-SM-RED
✅ 直接替换📋 参考替代料（不在目录中）
OSD3358-512M-BSM 最大额定值与电气特性
| Module Type | System-in-Package (SiP) with AM3358 + DDR3 + PMIC |
| Processor Core | Texas Instruments Sitara AM3358 ARM Cortex-A8 32-bit |
| Maximum CPU Clock | 1 GHz (with NEON SIMD and FPU) |
| Graphics Accelerator | PowerVR SGX530 3D GPU |
| System Memory | 512 MB 32-bit DDR3 (on-package) |
| Memory Bus Width | 32-bit + ECC option |
| Peripheral Co-Processors | 2x PRU-ICSS (Programmable Real-time Unit) |
| Ethernet | 2x 10/100/1000 industrial Ethernet MAC (MII/RGMii) |
| USB | 1x USB 2.0 HS Host + 1x USB 2.0 HS Dual-Role |
| Other Interfaces | 4x UART, 2x I2C, 2x SPI, 2x McASP, McSPI, CAN, ADC |
| 封装 | 256-ball BGA 21x21 mm, 1.27 mm pitch |
| 工作温度 | 0 C to +70 C (commercial, BSM grade) |
| Operating Voltage | 5 V single rail via on-board PMIC |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount (BGA reflow) |
OSD3358-512M-BSM 256-ball bga 21x21 mm, 1.27 mm pitch 引脚配置指南
OSD3358-512M-BSM（256-ball bga 21x21 mm, 1.27 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： OSD3358-512M-BSM.
请参阅 数据手册 以查看完整引脚配置。
典型应用
OSD3358-512M-BSM 适用于 7 应用s: Industrial Automation Gateways, Robotics Motor Controllers, Building Automation Edge Nodes, Retail Kiosks and HMI, Battery-Powered Portable Data Loggers, PoE-Powered IP Cameras, Hand-Held Industrial Test Instruments.
Industrial Automation Gateways
The OSD3358-512M-BSM is an ideal compute core for industrial Ethernet gateways due to its two gigabit industrial Ethernet MACs and dual PRU-ICSS sub-systems. The ARM Cortex-A8 at 1 GHz handles protocol translation from PROFINET, EtherCAT, or EtherNet/IP to OPC-UA cloud telemetry, while the PRUs deliver deterministic cycle times below 100 us. The on-package 512 MB DDR3 supports full Debian Linux with containerized protocol stacks, and the integrated TPS65217C PMIC accepts a single 24 V->5 V industrial rail. Engineers can mount the BSM directly on a 4-layer DIN-rail carrier PCB and ship a sub-50 mm gateway.
推荐
Robotics Motor Controllers
Robotics platforms use the OSD3358-512M-BSM as a single-board motion controller, leveraging the AM3358's two PRU-ICSS sub-cores for sub-microsecond pulse generation and quadrature encoder capture. The Cortex-A8 runs ROS 2 nodes that fuse IMU data and trajectory planners, while the SGX530 GPU renders SLAM visualizations on a 7-inch capacitive LCD. With 512 MB DDR3, the SiP can hold multi-megapixel occupancy grids in memory without external PSRAM. The 1.27 mm BGA is reflow-compatible with standard lead-free profiles, allowing the controller to be co-assembled with the motor-driver MOSFETs on the same panel.
推荐
Building Automation Edge Nodes
Smart-building edge nodes use the OSD3358-512M-BSM to consolidate BACnet, KNX, Modbus, and BLE Mesh traffic into a single Linux daemon. The Cortex-A8 at 1 GHz is sufficient to run an MQTT broker plus a Node-RED flows engine, while the two PRUs monitor real-time HVAC damper feedback. On-package 512 MB DDR3 supports months of trend-logging data without external flash, and the 0-70 C commercial temperature is well-matched to indoor enclosures. The SiP's 5 V single-rail input simplifies PoE-extractor integration for ceiling-mounted controllers.
推荐
Retail Kiosks and HMI
Self-service retail kiosks run Android 4.x or Linux/Weston on the OSD3358-512M-BSM, leveraging the SGX530 GPU for responsive UI at 1080p resolution. The two PRU-ICSS sub-systems manage the receipt-printer stepper, barcode scanner trigger, and coin-acceptance pulse train without burdening the Cortex-A8. Dual gigabit Ethernet gives the kiosk both an internet uplink and an isolated payment-terminal VLAN, while 512 MB DDR3 keeps the browser cache resident. The OSD3358-512M-BSM's compact 21x21 mm BGA drops into kiosk mainboards with plenty of space for the 5-inch TFT and projected-capacitive touch panel.
推荐
Battery-Powered Portable Data Loggers
Portable data loggers for environmental and industrial-condition monitoring use the OSD3358-512M-BSM in a deep-sleep duty-cycled mode, with the Cortex-A8 waking once per minute to publish a 4G-modem payload. The on-package TPS65217C PMIC supports <100 uA off-mode quiescent, and 512 MB DDR3 in self-refresh adds only a few hundred microamps. The integrated USB 2.0 dual-role port serves as both charging input and PC-sync dock. With a 2200 mAh Li-ion pack, the BSM-based logger can run for 7-10 days between charges - ideal for cold-chain and remote-pump monitoring.
推荐
PoE-Powered IP Cameras
IP-camera designs pair the OSD3358-512M-BSM with an external H.264 ISP to stream 1080p video over a single PoE cable. The Cortex-A8 handles ONVIF protocol, motion-detection analytics, and edge-AI inference, with the SGX530 GPU available for visualization overlays in the on-camera LCD. Dual gigabit Ethernet allows daisy-chained cameras, while 512 MB DDR3 buffers several seconds of pre-event video. The integrated 5 V single-rail supply - delivered through a PoE->5 V DC/DC - keeps the camera sub-board under 40 mm in diameter.
推荐
Hand-Held Industrial Test Instruments
Hand-held oscilloscope and multi-meter instruments integrate the OSD3358-512M-BSM as a graphing and UI core, with the Cortex-A8 at 1 GHz refreshing 100 kSa/s waveform captures onto a 5-inch TFT. The two PRU-ICSS sub-systems synchronize analog-front-end sampling to nanosecond precision, and the SGX530 GPU renders FFT waterfalls in real time. The 512 MB DDR3 lets the instrument cache 10+ screen-deep captures for offline recall. The 0-70 C commercial temperature covers typical field-service environments, and the 21x21 mm BGA allows the instrument hand-grip to remain slim.
推荐
推荐产品汇总
工程参考数据： OSD3358-512M-BSM ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | OSD3358-512M-BEM | OSD3358-1G-ISM | OSD3358-512M-ISM | OSD3358-1G-BSM | OSD3358-SM-RED |
|---|---|---|---|---|---|---|
| Package | 256-ball BGA 21x21 mm | 256-ball BGA 21x21 mm - same | 256-ball BGA 21x21 mm - same | 256-ball BGA on SOM carrier - same die | 256-ball BGA 21x21 mm - same | 256-ball BGA 21x21 mm on reference board - same |
| Brand | Octavo Systems | Octavo Systems - same | Octavo Systems - same | Octavo Systems - same | Octavo Systems - same | Octavo Systems - same |
| Integrated Processor | TI Sitara AM3358 ARM Cortex-A8 1 GHz | TI Sitara AM3358 ARM Cortex-A8 1 GHz - same | TI Sitara AM3358 ARM Cortex-A8 1 GHz - same | TI Sitara AM3358 ARM Cortex-A8 1 GHz - same | TI Sitara AM3358 ARM Cortex-A8 1 GHz - same | TI Sitara AM3358 ARM Cortex-A8 1 GHz - same |
| DDR3 Memory | 512 MB 32-bit DDR3 | 512 MB 32-bit DDR3 - same | 1 GB 32-bit DDR3 (+100%) | 512 MB 32-bit DDR3 - same | 1 GB 32-bit DDR3 (+100%) | 512 MB 32-bit DDR3 - same |
| Operating Temperature | 0 C to +70 C (commercial) | -25 C to +85 C (industrial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) |
| Mounting Form Factor | 256-ball BGA 21x21 mm (SiP) | 256-ball BGA 21x21 mm (SiP) | Castellated-edge SOM with 2x 100-pin headers | Castellated-edge SOM with 2x 100-pin headers | 256-ball BGA 21x21 mm (SiP) | Reference board with 2x 46-pin headers |
| Integrated PMIC | TI TPS65217C (5 V input) | TI TPS65217C (5 V input) - same | TI TPS65217C (5 V input) - same | TI TPS65217C (5 V input) - same | TI TPS65217C (5 V input) - same | TI TPS65217C (5 V input) - same |
| USB Ports | 1x USB 2.0 HS Host + 1x USB 2.0 DR | 1x USB 2.0 HS Host + 1x USB 2.0 DR - same | 1x USB 2.0 HS Host + 1x USB 2.0 DR - same | 1x USB 2.0 HS Host + 1x USB 2.0 DR - same | 1x USB 2.0 HS Host + 1x USB 2.0 DR - same | 1x USB 2.0 HS Host + 1x USB 2.0 DR - same |
| 1-piece Distributor Price | USD 41.85 | USD ~46.00 | USD ~58.00 | USD ~54.00 | USD ~50.00 | USD ~99.00 (board + SiP) |
关键差异点
- True SiP - DDR3 + PMIC co-packaged with AM3358 （对比 Discrete AM3358 + external DDR3 PCB)
- Commercial 0-70 C temperature drops into indoor enclosures （对比 OSD3358-512M-BEM industrial -25-85 C)
- 256-ball BGA 21x21 mm form factor （对比 OSD3358-512M-ISM SOM carrier)
- Same die as the original BeagleBone Black （对比 Variscite DART-6UL (NXP i.MX6ULL))
设计说明
The OSD3358-512M-BSM places the AM3358, DDR3, and PMIC inside a single 21x21 mm shielding can that doubles as a thermal spreader. Estimated: at 1 GHz full CPU + GPU load with 1.0 V core, the dissipation is around 2 W. With theta_JA around 15-20 C/W (typical 4-layer PCB with ground pour on top/bottom), the junction rises 30-40 C above ambient. Provide continuous copper pours under all four rows of BGA balls and consider a small 10x10 mm heatsink mounted to the shielding can for fanless enclosures.
The 1.27 mm BGA pitch demands a 4-layer PCB with 0.5 oz copper on outer layers and 1 oz inner planes; do not attempt routing on a 2-layer board. Use the official Octavo OSD3358-SM-Red reference board's KiCad footprint and 4-mil trace/space to maintain 50 ohm single-ended impedance on USB and Ethernet pairs. Place the 5 V input bulk cap (>= 22 uF X5R) within 5 mm of the BGA pin A1 to suppress inrush from PMIC startup.
Octavo fabricates the BSM SiP on demand rather than maintaining safety stock; place forecast POs at least 12 weeks before NPI builds to avoid 8-12 week lead-time hits. Avoid mating the BSM with castellated-edge stack-ups: the OSD3358-SM BGA balls are not designed for through-hole pin headers; use the OSD3358-SM-RED reference board for prototyping instead. Ensure the AM3358 RTC crystal (32.768 kHz) is within 2 mm of the RTC_XTAL pins to meet jitter specs.
The on-package TPS65217C PMIC accepts a single 5 V rail; estimate quiescent current at 5 V is around 60 mA in full-run and 100 uA in RTC-only mode. Add a TVS diode (SMAJ5.0A) and a 1 A polyfuse on the 5 V input to survive hot-plug events on PoE or USB. Sequencing is fully internal; no external Enable or Power-Good signal is needed for proper startup. Estimated: at 1 GHz with both PRUs active, total system power is around 2.5-3.0 W.
合规信息
RoHS compliance confirmed by Octavo product page and JLCPCB assembly listing. AEC-Q100 not applicable (industrial/commercial module). REACH status per Octavo product brief. Halogen-free and conflict-mineral declarations not explicitly listed - set to unknown until manufacturer publishes.
