P1022NXE2LFB vs P1022NXN2LFB 对比
详细并排对比 P1022NXE2LFB 出自 NXP Semiconductors 和 P1022NXN2LFB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking
P1022NXN2LFB ⚠ 最后一次采购规格对比
| 参数 | P1022NXE2LFB | P1022NXN2LFB |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $73.40 | $78.40 |
| Family | QorIQ P1 | — |
| Architecture | PowerPC e500v2 (32-bit) | Power Architecture e500 dual-core (RISC, 32-bit) |
| Number of Cores | 2 | — |
| Maximum Core Frequency | 1.055 GHz | — |
| L1 Cache per Core | 32 KB I-cache + 32 KB D-cache | — |
| Coherency Fabric | CoreNet | — |
| Memory Controller | DDR2 / DDR3 with ECC, 16-bit / 32-bit, 800 MHz data rate | DDR2/DDR3 with ECC support, up to 32-bit |
| Ethernet MACs | Two 10/100/1000 Mbps (RGMII / SGMII) | 3 x 10/100/1000 Mbps Gigabit |
| PCI Express | Three controllers, Gen 1 / Gen 2 | — |
| USB Controllers | Two USB 2.0 (host + device / dual host) | — |
| Security Engine | SEC with DES / 3DES / AES, public-key accelerator | Integrated (symmetric/asymmetric crypto acceleration) |
| LCD Controller | Yes (integrated) | — |
| Packaging | 689-TEPBGA II (Plastic Enhanced BGA, 31 x 31 mm, lead-free) | — |
| Terminal Pitch | 1 mm | — |
| 工作温度 | -40C to +125C (industrial, E grade) | -40 °C to +125 °C (industrial) |
| Process Technology | 65 nm CMOS | — |
| RoHS 状态 | Lead-free ball finish (FB suffix), RoHS compliant | — |
| Clock Speed (Core) | — | 1.067 GHz |
| Platform Version | — | 1067/533/667 ET NE r1.1 |
| Core Count | — | 2 |
| Package Type | — | TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) |
| Package Dimensions | — | 31 x 31 mm, 2.23 mm height |
| 引脚数量 | — | 689 |
| 电源电压 | — | 3.13 V to 3.47 V |
| PCIe Interfaces | — | 3 x PCIe Gen1 |
| USB | — | USB 2.0 host/device |
| Display Controller | — | 32-bit LCD controller |
| RoHS Compliance | — | Yes (halogen-free) |
| 安装类型 | — | Surface Mount (BGA, requires thermal via array under die) |