P1022NXE2LFB vs P1022NXN2LFB 비교

다음의 상세 나란히 비교: P1022NXE2LFB 제조: NXP Semiconductors 및 P1022NXN2LFB 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
P1022NXE2LFB P1022NXE2LFB - QorIQ Dual-Core 1GHz SoC | NXP

P1022NXE2LFB - QorIQ Dual-Core 1GHz SoC | NXP

P1022NXE2LFB ⚠ 최종 구매
NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ 최종 구매

사양 비교

파라미터 P1022NXE2LFB P1022NXN2LFB
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 최종 구매 최종 구매
재고 상태 In Stock In Stock
단가 (USD) $73.40 $78.40
Family QorIQ P1 —
Architecture PowerPC e500v2 (32-bit) Power Architecture e500 dual-core (RISC, 32-bit)
Number of Cores 2 —
Maximum Core Frequency 1.055 GHz —
L1 Cache per Core 32 KB I-cache + 32 KB D-cache —
Coherency Fabric CoreNet —
Memory Controller DDR2 / DDR3 with ECC, 16-bit / 32-bit, 800 MHz data rate DDR2/DDR3 with ECC support, up to 32-bit
Ethernet MACs Two 10/100/1000 Mbps (RGMII / SGMII) 3 x 10/100/1000 Mbps Gigabit
PCI Express Three controllers, Gen 1 / Gen 2 —
USB Controllers Two USB 2.0 (host + device / dual host) —
Security Engine SEC with DES / 3DES / AES, public-key accelerator Integrated (symmetric/asymmetric crypto acceleration)
LCD Controller Yes (integrated) —
Packaging 689-TEPBGA II (Plastic Enhanced BGA, 31 x 31 mm, lead-free) —
Terminal Pitch 1 mm —
동작 온도 -40C to +125C (industrial, E grade) -40 °C to +125 °C (industrial)
Process Technology 65 nm CMOS —
RoHS 상태 Lead-free ball finish (FB suffix), RoHS compliant —
Clock Speed (Core) — 1.067 GHz
Platform Version — 1067/533/667 ET NE r1.1
Core Count — 2
Package Type — TEPBGA-689 (Plastic, halogen-free, RoHS-compliant)
Package Dimensions — 31 x 31 mm, 2.23 mm height
핀 수 — 689
공급 전압 — 3.13 V to 3.47 V
PCIe Interfaces — 3 x PCIe Gen1
USB — USB 2.0 host/device
Display Controller — 32-bit LCD controller
RoHS Compliance — Yes (halogen-free)
실장 유형 — Surface Mount (BGA, requires thermal via array under die)

데이터시트 & 자료

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