W971GG6SB25I vs MT47H64M16HR-25E IT:H 对比
详细并排对比 W971GG6SB25I 出自 Winbond 和 MT47H64M16HR-25E IT:H 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Micron Technology
MT47H64M16HR-25E IT:H - 1Gb DDR2 SDRAM 400MHz 84-FBGA | Micron
MT47H64M16HR-25E IT:H ✓ 量产中规格对比
| 参数 | W971GG6SB25I | MT47H64M16HR-25E IT:H |
|---|---|---|
| 品牌 | Winbond | Micron Technology |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1.48 | $2.21 |
| 存储器类型 | Volatile, DDR2 SDRAM | DDR2 SDRAM (volatile) |
| Density | 1 Gbit (1,073,741,824 bits) | — |
| 存储组织 | 8M words × 8 banks × 16 bits | 8 Meg x 16 x 8 banks |
| Maximum Data Rate | 400 MT/s (DDR2-800) | — |
| Clock Frequency | 200 MHz | 400 MHz |
| Random Access Time | 57.5 ns | — |
| Bus Width | 16 bits | — |
| Supply Voltage (VDD / V_DDQ) | 1.8 V (JEDEC SSTL-18) | — |
| 接口类型 | Parallel, SSTL-18 | — |
| 工作温度 | -40 °C to +85 °C (industrial) | -40C to +85C (Industrial, IT:H) |
| Package Type | 84-WBGA / 84-TFBGA, 8.0 × 12.5 mm | — |
| 安装类型 | Surface Mount | — |
| Number of Pins / Balls | 84 | — |
| Bank Count | 8 | — |
| On-Die Termination (ODT) | Yes (per JEDEC DDR2) | — |
| Refresh | Auto-refresh and self-refresh | — |
| Speed Grade Suffix | 25I (DDR2-800 6-6-6, industrial) | — |
| Compliance | JEDEC DDR2 standard | — |
| RoHS 状态 | Compliant (lead-free) | Compliant (lead-free) |
| 存储容量 | — | 1 Gbit (64M x 16) |
| Access Time | — | 400 ps |
| Data Rate (effective) | — | 800 MT/s |
| 接口 | — | Parallel (byte-wide) |
| Prefetch Architecture | — | 4n-bit |
| Supply Voltage VDD | — | 1.8 V ±0.1 V |
| Supply Voltage VDDQ | — | 1.8 V ±0.1 V (SSTL_18) |
| I/O Standard | — | JEDEC SSTL_18-compatible |
| Data Strobe | — | Differential (DQS, DQS#) |
| 封装 | — | 84-TFBGA (8 mm x 12.5 mm) |