XC3S200-4FT256C vs XC3S200-4FTG256I 对比
详细并排对比 XC3S200-4FT256C 出自 AMD 和 XC3S200-4FTG256I 出自 Xilinx。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC3S200-4FT256C | XC3S200-4FTG256I |
|---|---|---|
| 品牌 | AMD | Xilinx |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Device Type | FPGA | — |
| FPGA Family | Spartan-3 | — |
| System Gates | 200000 | 200,000 |
| Logic Cells | 4320 | 4,320 |
| Configurable Logic Blocks | 480 | — |
| 最大时钟频率 | 630 MHz | — |
| Nominal Core Supply Voltage | 1.2 V | — |
| Maximum Supply Voltage | 1.26 V | — |
| Process Technology | 90 nm | 90 nm |
| 封装 | 256-LBGA | 256-ball FTBGA (FTG256), 17 x 17 mm |
| Number of Terminals | 256 | — |
| Terminal Form | Ball | Ball |
| Package Shape | Square | — |
| 工作温度 | 0°C to 85°C | -40C to +100C (Industrial) |
| Speed Grade | -4 | -4 |
| Temperature Grade | Commercial | — |
| Lead-Free Status | Lead free | — |
| Typical Application | Cost-sensitive high-performance programmable logic | — |
| I/O Standard Support | [DATA_NEEDED: supported I/O standards] | — |
| Core Current | [DATA_NEEDED: core current] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory] | — |
| Family | — | Spartan-3 |
| Slices | — | 2,160 |
| Block RAM | — | 216 Kbit (12 blocks x 18 Kbit) |
| Dedicated Multipliers | — | 4 (18x18) |
| DCM (Digital Clock Manager) | — | 4 |
| Maximum User I/O | — | 173 |
| Core Voltage | — | 1.2 V |
| 安装类型 | — | Surface Mount (BGA) |
| Peak Reflow Time | — | 30 s |
| RoHS 状态 | — | Compliant (G suffix = lead-free) |