XC6SLX25-3FG484I vs XC6SLX25-2FG484C 对比
详细并排对比 XC6SLX25-3FG484I 出自 AMD 和 XC6SLX25-2FG484C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX25-3FG484I | XC6SLX25-2FG484C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Device Type | Field Programmable Gate Array (FPGA) | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 24,051 cells | 24,051 cells |
| I/O Count | 266 I/O | — |
| Internal Frequency | 500 MHz | 500 MHz |
| Speed Grade | -3 | -2 |
| Process Technology | 45 nm CMOS | — |
| Package Type | 484-BBGA | 484-pin FBGA |
| Package Pin Count | 484 pins | — |
| Package Body Size | 15 mm x 15 mm | — |
| Ball Pitch | 0.80 mm | — |
| 工作温度 | 0°C to 85°C | 0°C to 85°C |
| Lead-Free Status | Lead-free package | Lead-free |
| Terminal Form | BGA balls | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | 1.2 V |
| Power Consumption | [DATA_NEEDED: typical and maximum power consumption] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | RoHS compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Number of I/O | — | 266 I/O |
| Technology | — | 45 nm CMOS |
| Number of Package Balls | — | 484 balls |
| Terminal Type | — | Ball |
| Package Shape | — | Square |
| 安装类型 | — | Surface mount |