XC6SLX45T-3FG484C vs XC6SLX45-3FG484C 对比
详细并排对比 XC6SLX45T-3FG484C 出自 AMD 和 XC6SLX45-3FG484C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX45T-3FG484C | XC6SLX45-3FG484C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Device Type | Spartan-6 LXT Field Programmable Gate Array (FPGA) | Spartan-6 LX Field Programmable Gate Array (FPGA) |
| Logic Cells | 43,661 cells | 43,661 cells |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| I/O Count | 296 I/O | — |
| Package Pin Count | 484 pins | — |
| Package Type | 484-BBGA (FG484C) | — |
| 安装类型 | Surface mount | Surface Mount |
| Speed Grade | -3 | -3 |
| FPGA Family | Spartan-6 LXT | — |
| Programmable Logic Type | SRAM-configurable FPGA | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| 最大时钟频率 | [DATA_NEEDED: maximum clock frequency] | — |
| 工作温度范围 | [DATA_NEEDED: operating temperature range] | — |
| 电源电流 | [DATA_NEEDED: core and I/O supply current] | — |
| Package Dimensions | [DATA_NEEDED: FBGA package dimensions] | 15 mm × 15 mm |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | REACH unaffected |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Adaptive Logic Modules | — | 6,822 ALM |
| Embedded Memory | — | 2.04 Mbit |
| User I/O | — | 316 I/O |
| Internal Frequency | — | 500 MHz |
| Temperature Grade | — | Commercial |
| 工作温度 | — | 0 °C to 85 °C |
| 封装 | — | 484-BBGA |
| Package Ball Pitch | — | 0.80 mm |
| Catalog Package Detail | — | MO-275, CSBGA-324 |
| Catalog Pin Count | — | 324 pins |
| Lead-Free Packaging | — | Lead free |