XC6SLX45T-3FG484C vs XC6SLX45-3FG484C Comparison

Detailed side-by-side comparison of XC6SLX45T-3FG484C by AMD and XC6SLX45-3FG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX45-3FG484C XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD

XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD

XC6SLX45-3FG484C ✓ Active

Specification Comparison

Parameter XC6SLX45T-3FG484C XC6SLX45-3FG484C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LXT Field Programmable Gate Array (FPGA) Spartan-6 LX Field Programmable Gate Array (FPGA)
Logic Cells 43,661 cells 43,661 cells
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V 1.2 V
I/O Count 296 I/O —
Package Pin Count 484 pins —
Package Type 484-BBGA (FG484C) —
Mounting Type Surface mount Surface Mount
Speed Grade -3 -3
FPGA Family Spartan-6 LXT —
Programmable Logic Type SRAM-configurable FPGA —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Supply Current [DATA_NEEDED: core and I/O supply current] —
Package Dimensions [DATA_NEEDED: FBGA package dimensions] 15 mm × 15 mm
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] REACH unaffected
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Adaptive Logic Modules — 6,822 ALM
Embedded Memory — 2.04 Mbit
User I/O — 316 I/O
Internal Frequency — 500 MHz
Temperature Grade — Commercial
Operating Temperature — 0 °C to 85 °C
Package — 484-BBGA
Package Ball Pitch — 0.80 mm
Catalog Package Detail — MO-275, CSBGA-324
Catalog Pin Count — 324 pins
Lead-Free Packaging — Lead free

Datasheets & Resources

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