XC6SLX75-3FG676I vs XC6SLX75-3FGG676C 对比

详细并排对比 XC6SLX75-3FG676I 出自 AMD 和 XC6SLX75-3FGG676C 出自 Xilinx。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 XC6SLX75-3FG676I XC6SLX75-3FGG676C
品牌 AMD Xilinx
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Unknown 有效
Device Type Field Programmable Gate Array (FPGA) FPGA (Field Programmable Gate Array)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 74,637 cells 74,637
Configurable Logic Blocks 5,831 CLBs —
Maximum Frequency 862 MHz —
I/O Count 408 I/O —
Process Technology 45 nm CMOS 45 nm CMOS
封装 676-ball FCBGA —
Package Body Size 27 mm x 27 mm —
Ball Pitch 1 mm —
Terminal Count 676 terminals —
Temperature Grade Industrial —
Speed Grade -3 -3 (highest performance grade)
Surface-Mount Type Ball Grid Array (BGA) —
Verified Distributor Price USD 67.1347 per unit —
LCSC Availability In stock —
RoHS 状态 [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Automotive Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Configurable Logic Blocks (CLBs) — 5,831
User I/O — 408
DSP48A1 Slices — 132
Block RAM — 3,096 Kbit
Internal Frequency — 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table)
电源电压 — 1.14 V to 1.26 V
工作温度 — 0 C to 85 C (commercial)
Package Type — FBGA-676 (PBGA676)
Package Dimensions — 27 mm x 27 mm, 1.0 mm ball pitch
安装类型 — Surface Mount
Clock Management — DCM and PLL present
Lead-Free — Yes
RoHS — [DATA_NEEDED: RoHS compliance statement for this exact orderable]
REACH — [DATA_NEEDED: REACH declaration for this exact orderable]
Automotive Grade (AEC-Q100) — Not qualified - commercial temperature grade
Maximum Package Pin Count — 676 balls

数据手册与资源

浏览全部产品 创建 BOM 获取报价