XC6SLX75-3FG676I vs XC6SLX75-3FGG676C 比較

詳細な並列比較: XC6SLX75-3FG676I メーカー: AMD および XC6SLX75-3FGG676C メーカー: Xilinx。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。

仕様比較

パラメータ XC6SLX75-3FG676I XC6SLX75-3FGG676C
ブランド AMD Xilinx
カテゴリ FPGA & CPLD FPGA & CPLD
ライフサイクル状態 Unknown 有効
Device Type Field Programmable Gate Array (FPGA) FPGA (Field Programmable Gate Array)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 74,637 cells 74,637
Configurable Logic Blocks 5,831 CLBs —
Maximum Frequency 862 MHz —
I/O Count 408 I/O —
Process Technology 45 nm CMOS 45 nm CMOS
パッケージ 676-ball FCBGA —
Package Body Size 27 mm x 27 mm —
Ball Pitch 1 mm —
Terminal Count 676 terminals —
Temperature Grade Industrial —
Speed Grade -3 -3 (highest performance grade)
Surface-Mount Type Ball Grid Array (BGA) —
Verified Distributor Price USD 67.1347 per unit —
LCSC Availability In stock —
RoHS ステータス [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Automotive Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Configurable Logic Blocks (CLBs) — 5,831
User I/O — 408
DSP48A1 Slices — 132
Block RAM — 3,096 Kbit
Internal Frequency — 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table)
電源電圧 — 1.14 V to 1.26 V
動作温度 — 0 C to 85 C (commercial)
Package Type — FBGA-676 (PBGA676)
Package Dimensions — 27 mm x 27 mm, 1.0 mm ball pitch
実装タイプ — Surface Mount
Clock Management — DCM and PLL present
Lead-Free — Yes
RoHS — [DATA_NEEDED: RoHS compliance statement for this exact orderable]
REACH — [DATA_NEEDED: REACH declaration for this exact orderable]
Automotive Grade (AEC-Q100) — Not qualified - commercial temperature grade
Maximum Package Pin Count — 676 balls

データシート&リソース

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