XC6SLX75-3FG676I vs XC6SLX75-3FGG676C 비교

다음의 상세 나란히 비교: XC6SLX75-3FG676I 제조: AMD 및 XC6SLX75-3FGG676C 제조: Xilinx. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 XC6SLX75-3FG676I XC6SLX75-3FGG676C
브랜드 AMD Xilinx
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 Unknown 활성
Device Type Field Programmable Gate Array (FPGA) FPGA (Field Programmable Gate Array)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 74,637 cells 74,637
Configurable Logic Blocks 5,831 CLBs —
Maximum Frequency 862 MHz —
I/O Count 408 I/O —
Process Technology 45 nm CMOS 45 nm CMOS
패키지 676-ball FCBGA —
Package Body Size 27 mm x 27 mm —
Ball Pitch 1 mm —
Terminal Count 676 terminals —
Temperature Grade Industrial —
Speed Grade -3 -3 (highest performance grade)
Surface-Mount Type Ball Grid Array (BGA) —
Verified Distributor Price USD 67.1347 per unit —
LCSC Availability In stock —
RoHS 상태 [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Automotive Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Configurable Logic Blocks (CLBs) — 5,831
User I/O — 408
DSP48A1 Slices — 132
Block RAM — 3,096 Kbit
Internal Frequency — 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table)
공급 전압 — 1.14 V to 1.26 V
동작 온도 — 0 C to 85 C (commercial)
Package Type — FBGA-676 (PBGA676)
Package Dimensions — 27 mm x 27 mm, 1.0 mm ball pitch
실장 유형 — Surface Mount
Clock Management — DCM and PLL present
Lead-Free — Yes
RoHS — [DATA_NEEDED: RoHS compliance statement for this exact orderable]
REACH — [DATA_NEEDED: REACH declaration for this exact orderable]
Automotive Grade (AEC-Q100) — Not qualified - commercial temperature grade
Maximum Package Pin Count — 676 balls

데이터시트 & 자료

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