XC6SLX75-3FGG484C vs XC6SLX100T-3FGG484C 对比
详细并排对比 XC6SLX75-3FGG484C 出自 AMD 和 XC6SLX100T-3FGG484C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX75-3FGG484C | XC6SLX100T-3FGG484C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Spartan-6 LX | — |
| Logic Cells | 74,637 | 101261 |
| User I/O Count | 280 | — |
| Package Type | 484-ball FBGA (MS-034) | — |
| Package Body Size | 23 x 23 mm | — |
| Package Pitch | 1.0 mm | — |
| Internal Clock Frequency | 667 MHz | — |
| Speed Grade | -3 (highest performance in Spartan-6 LX family) | -3 |
| 工作温度范围 | 0 °C to 85 °C (commercial grade) | — |
| 安装类型 | Surface Mount (SMD) | Surface Mount |
| 电源电压 | [DATA_NEEDED: supply voltage range] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | 4939776 bits |
| DSP Slices | [DATA_NEEDED: DSP48A slice count] | [DATA_NEEDED: DSP48A1 slice count] |
| Configuration Memory | [DATA_NEEDED: configuration memory type] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards per bank] | — |
| Manufacturer | AMD (formerly Xilinx) | — |
| RoHS 状态 | unknown | Compliant |
| Order Code Suffix | C = commercial temperature grade | — |
| Family | — | Spartan-6 LXT |
| Number of I/O | — | 296 |
| 封装 | — | 484-BBGA (FBGA) |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 45 nm low-power copper |
| 工作温度 | — | 0C to +85C (commercial) |
| 引脚数 | — | 484 |
| Configuration Interfaces | — | JTAG, SPI, BPI |
| Transceivers | — | Up to 3.125 Gbps (LXT) |