XC6SLX75-3FGG676C vs XC6SLX75-3FG676I 对比

详细并排对比 XC6SLX75-3FGG676C 出自 Xilinx 和 XC6SLX75-3FG676I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 XC6SLX75-3FGG676C XC6SLX75-3FG676I
品牌 Xilinx AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 Unknown
Device Type FPGA (Field Programmable Gate Array) Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 74,637 74,637 cells
Configurable Logic Blocks (CLBs) 5,831 —
User I/O 408 —
DSP48A1 Slices 132 —
Block RAM 3,096 Kbit —
Internal Frequency 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) —
电源电压 1.14 V to 1.26 V —
Process Technology 45 nm CMOS 45 nm CMOS
Speed Grade -3 (highest performance grade) -3
工作温度 0 C to 85 C (commercial) —
Package Type FBGA-676 (PBGA676) —
Package Dimensions 27 mm x 27 mm, 1.0 mm ball pitch —
安装类型 Surface Mount —
Clock Management DCM and PLL present —
Lead-Free Yes —
RoHS [DATA_NEEDED: RoHS compliance statement for this exact orderable] —
REACH [DATA_NEEDED: REACH declaration for this exact orderable] —
Automotive Grade (AEC-Q100) Not qualified - commercial temperature grade —
Maximum Package Pin Count 676 balls —
Configurable Logic Blocks — 5,831 CLBs
Maximum Frequency — 862 MHz
I/O Count — 408 I/O
封装 — 676-ball FCBGA
Package Body Size — 27 mm x 27 mm
Ball Pitch — 1 mm
Terminal Count — 676 terminals
Temperature Grade — Industrial
Surface-Mount Type — Ball Grid Array (BGA)
Verified Distributor Price — USD 67.1347 per unit
LCSC Availability — In stock
RoHS 状态 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
Lead-Free Status — [DATA_NEEDED: lead-free status]
Automotive Qualification — [DATA_NEEDED: AEC-Q100 qualification]

数据手册与资源

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