XC6SLX75-3FGG676C vs XC6SLX75-3FG676I 比較

詳細な並列比較: XC6SLX75-3FGG676C メーカー: Xilinx および XC6SLX75-3FG676I メーカー: AMD。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。

仕様比較

パラメータ XC6SLX75-3FGG676C XC6SLX75-3FG676I
ブランド Xilinx AMD
カテゴリ FPGA & CPLD FPGA & CPLD
ライフサイクル状態 有効 Unknown
Device Type FPGA (Field Programmable Gate Array) Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 74,637 74,637 cells
Configurable Logic Blocks (CLBs) 5,831 —
User I/O 408 —
DSP48A1 Slices 132 —
Block RAM 3,096 Kbit —
Internal Frequency 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) —
電源電圧 1.14 V to 1.26 V —
Process Technology 45 nm CMOS 45 nm CMOS
Speed Grade -3 (highest performance grade) -3
動作温度 0 C to 85 C (commercial) —
Package Type FBGA-676 (PBGA676) —
Package Dimensions 27 mm x 27 mm, 1.0 mm ball pitch —
実装タイプ Surface Mount —
Clock Management DCM and PLL present —
Lead-Free Yes —
RoHS [DATA_NEEDED: RoHS compliance statement for this exact orderable] —
REACH [DATA_NEEDED: REACH declaration for this exact orderable] —
Automotive Grade (AEC-Q100) Not qualified - commercial temperature grade —
Maximum Package Pin Count 676 balls —
Configurable Logic Blocks — 5,831 CLBs
Maximum Frequency — 862 MHz
I/O Count — 408 I/O
パッケージ — 676-ball FCBGA
Package Body Size — 27 mm x 27 mm
Ball Pitch — 1 mm
Terminal Count — 676 terminals
Temperature Grade — Industrial
Surface-Mount Type — Ball Grid Array (BGA)
Verified Distributor Price — USD 67.1347 per unit
LCSC Availability — In stock
RoHS ステータス — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
Lead-Free Status — [DATA_NEEDED: lead-free status]
Automotive Qualification — [DATA_NEEDED: AEC-Q100 qualification]

データシート&リソース

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