XC6SLX75-3FGG676C vs XC6SLX75-3FG676I 비교

다음의 상세 나란히 비교: XC6SLX75-3FGG676C 제조: Xilinx 및 XC6SLX75-3FG676I 제조: AMD. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 XC6SLX75-3FGG676C XC6SLX75-3FG676I
브랜드 Xilinx AMD
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 Unknown
Device Type FPGA (Field Programmable Gate Array) Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 74,637 74,637 cells
Configurable Logic Blocks (CLBs) 5,831 —
User I/O 408 —
DSP48A1 Slices 132 —
Block RAM 3,096 Kbit —
Internal Frequency 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table) —
공급 전압 1.14 V to 1.26 V —
Process Technology 45 nm CMOS 45 nm CMOS
Speed Grade -3 (highest performance grade) -3
동작 온도 0 C to 85 C (commercial) —
Package Type FBGA-676 (PBGA676) —
Package Dimensions 27 mm x 27 mm, 1.0 mm ball pitch —
실장 유형 Surface Mount —
Clock Management DCM and PLL present —
Lead-Free Yes —
RoHS [DATA_NEEDED: RoHS compliance statement for this exact orderable] —
REACH [DATA_NEEDED: REACH declaration for this exact orderable] —
Automotive Grade (AEC-Q100) Not qualified - commercial temperature grade —
Maximum Package Pin Count 676 balls —
Configurable Logic Blocks — 5,831 CLBs
Maximum Frequency — 862 MHz
I/O Count — 408 I/O
패키지 — 676-ball FCBGA
Package Body Size — 27 mm x 27 mm
Ball Pitch — 1 mm
Terminal Count — 676 terminals
Temperature Grade — Industrial
Surface-Mount Type — Ball Grid Array (BGA)
Verified Distributor Price — USD 67.1347 per unit
LCSC Availability — In stock
RoHS 상태 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
Lead-Free Status — [DATA_NEEDED: lead-free status]
Automotive Qualification — [DATA_NEEDED: AEC-Q100 qualification]

데이터시트 & 자료

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