XC6SLX9-2FTG256C vs XC6SLX9-2FT256C 对比
详细并排对比 XC6SLX9-2FTG256C 出自 AMD 和 XC6SLX9-2FT256C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX9-2FTG256C | XC6SLX9-2FT256C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | Unknown |
| Series | Spartan-6 LX | — |
| Device Logic Cells | 9,152 LE | — |
| Adaptive Logic Modules (ALMs) | 1,430 ALM | — |
| Configurable Logic Blocks (CLBs) | 715 CLB | — |
| Embedded Block RAM | 576 Kbits | — |
| Distributed RAM | 32 Kbits | — |
| DSP / Multiplier Blocks | 16 (18 x 18 multipliers) | — |
| Maximum User I/Os | 186 | — |
| Speed Grade | -2 (commercial) | -2 |
| Internal Performance | Up to 667 MHz | — |
| Process Technology | 45 nm low-power CMOS | — |
| 封装 | 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch | — |
| 工作温度 | 0 C to 85 C (commercial) | — |
| 电源电压 | 1.2 V core / 1.2 V-3.3 V I/O (per DS160) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | Compliant (lead-free FTBGA) | [DATA_NEEDED: RoHS status] |
| Configuration Modes | SPI, JTAG, BPI, Master Serial | — |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| FPGA Family | — | Spartan-6 LX |
| Logic Cells | — | 9,152 cells |
| I/O Count | — | 186 I/O |
| Internal Frequency | — | 667 MHz |
| Technology | — | 45 nm CMOS |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | FTBGA-256 |
| Package Dimensions | — | 17 mm × 17 mm |
| Package Pitch | — | 1 mm |
| Package Outline | — | MS-034 |
| Ball Count | — | 256 balls |
| 工作温度范围 | — | 0°C to 85°C |
| Temperature Grade | — | Commercial |
| Configuration | — | Programmable FPGA |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |
| DSP Resources | — | [DATA_NEEDED: DSP resource count] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |