XC6SLX9-2FTG256C vs XC6SLX9-2FT256C 비교

다음의 상세 나란히 비교: XC6SLX9-2FTG256C 제조: AMD 및 XC6SLX9-2FT256C 제조: AMD. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

AMD
XC6SLX9-2FT256C XC6SLX9-2FT256C - 9K-LUT Spartan-6 FPGA | AMD

XC6SLX9-2FT256C - 9K-LUT Spartan-6 FPGA | AMD

XC6SLX9-2FT256C Unknown

사양 비교

파라미터 XC6SLX9-2FTG256C XC6SLX9-2FT256C
브랜드 AMD AMD
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 Unknown
Series Spartan-6 LX —
Device Logic Cells 9,152 LE —
Adaptive Logic Modules (ALMs) 1,430 ALM —
Configurable Logic Blocks (CLBs) 715 CLB —
Embedded Block RAM 576 Kbits —
Distributed RAM 32 Kbits —
DSP / Multiplier Blocks 16 (18 x 18 multipliers) —
Maximum User I/Os 186 —
Speed Grade -2 (commercial) -2
Internal Performance Up to 667 MHz —
Process Technology 45 nm low-power CMOS —
패키지 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch —
동작 온도 0 C to 85 C (commercial) —
공급 전압 1.2 V core / 1.2 V-3.3 V I/O (per DS160) —
실장 유형 Surface Mount (BGA) Surface Mount
RoHS 상태 Compliant (lead-free FTBGA) [DATA_NEEDED: RoHS status]
Configuration Modes SPI, JTAG, BPI, Master Serial —
Device Type — Field-Programmable Gate Array (FPGA)
FPGA Family — Spartan-6 LX
Logic Cells — 9,152 cells
I/O Count — 186 I/O
Internal Frequency — 667 MHz
Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Package Type — FTBGA-256
Package Dimensions — 17 mm × 17 mm
Package Pitch — 1 mm
Package Outline — MS-034
Ball Count — 256 balls
동작 온도 범위 — 0°C to 85°C
Temperature Grade — Commercial
Configuration — Programmable FPGA
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP resource count]
I/O Standards — [DATA_NEEDED: supported I/O standards]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

데이터시트 & 자료

모든 제품 보기 BOM 생성 견적 요청