10AX090U3F45E2SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
料号： 10AX090U3F45E2SG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3975 | $39,750.00 |
| 100 | $3620 | $362,000.00 |
| 250 | $3450 | $862,500.00 |
| 500 | $3295 | $1,647,500.00 |
10AX090U3F45E2SG 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic functionality is defined after manufacturing by a hardware description language (HDL) bitstream. Arria 10 GX sits in the mid-range of Intel's FPGA portfolio: below Stratix 10 (high-end) and above Cyclone 10 (low-power), optimized for transceiver-rich applications such as 4K video processing, wireless baseband, and defense signal intelligence. Arria 10 is built on TSMC's 20nm process and uniquely combines ARM Cortex-A9 hard processor system options with traditional FPGA fabric, hardening common functions to reduce power and logic-element usage.
Key specifications of the 10AX090U3F45E2SG include 900K logic elements (LEs), 59,234,304 bits of M20K block RAM (approximately 3,488 M20K blocks), 1,560 DSP blocks for fixed- and floating-point signal processing, and up to 28.05 Gbps backplane-capable transceivers. The 'U3' speed grade indicates an extended industrial speed bin, while 'F45' denotes the 1932-ball FCBGA package with 1.0 mm ball pitch designed for high-pin-count board designs. The 'E2' suffix places the part in the -40C to +100C extended industrial operating range.
Architecturally, Arria 10 GX uses a heterogeneous fabric: 20nm logic tiles, 28.05 Gbps transceivers with hardened PCIe Gen3 and 10GbE MACs, partial reconfiguration support, and up to 17.4 Gbps external memory interfaces for DDR4 with ECC. Power is managed through the SmartVID voltage regulator interface, allowing dynamic voltage scaling between 0.85V and 0.95V core. The fabric includes embedded SECDED on all block RAM, configuration RAM, and memory interfaces for high-reliability operation.
Typical applications for the 10AX090U3F45E2SG include 4K/UHD video broadcast infrastructure, 100G/400G networking line cards, radar and electronic-warfare DSP front-ends, medical imaging accelerators, and high-end test-and-measurement equipment. The combination of 28G transceivers, floating-point DSP, and substantial on-chip memory makes it a fit for signal-processing pipelines that would otherwise require an ASIC. Lower-density Arria 10 variants or Cyclone 10 parts are preferred for cost-sensitive designs without high-speed serial I/O.
When designing with this FPGA, ensure the PCB supports 1.0 mm BGA fanout with appropriate via-in-pad or microvia technology for high-yield assembly. The FPGA configuration scheme (typically Active Serial x4 or JTAG) and external DDR4 memory topology should be planned early, as mid-board layout changes to a 1932-ball BGA are extremely costly. Power-rail sequencing must respect the SmartVID controller's I2C interface and the 0.85V-0.95V core tolerance.
This page synthesizes distributor pricing, drop-in speed-grade and package variants, and practical design notes that supplement the manufacturer datasheet for engineering, sourcing, and BOM decisions.
直接替换替代料： 10AX090U3F45E2SG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AX090U3F45E2SG （相同外形与封装尺寸） ——差异在于 Package, Process Technology, DSP Blocks, Speed Grade, Operating Temperature Grade.
快速对比工具——选择替代料号进行并排对比：
10AX090U3F45E2LG
✅ 直接替换✓ 有现货
$6900 / 个
查看数据手册 →10AX090U2F45E2SG
✅ 直接替换✓ 有现货
$5995 / 个
查看数据手册 →10AX090U2F45I2SG
✅ 直接替换✓ 有现货
$3640 / 个
查看数据手册 →10AX090U2F45I1SG
✅ 直接替换✓ 有现货
$6895.59 / 个
查看数据手册 →10AX090N2F45E2SG
✅ 直接替换✓ 有现货
$4943.22 / 个
查看数据手册 →10AX090N2F45E2LG
✅ 直接替换✓ 有现货
$6095.25 / 个
查看数据手册 →10AX090N3F45E2LG
✅ 直接替换✓ 有现货
$2285 / 个
查看数据手册 →10AX090U3F45E2SG 最大额定值与电气特性
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| DSP Blocks | 1,560 |
| User I/O Count | 480 |
| Max Transceiver Data Rate | 28.05 Gbps |
| Process Technology | 20 nm |
| Core Voltage (SmartVID) | 0.85 V to 0.95 V |
| 封装 | 1932-ball FCBGA (F45) |
| Ball Pitch | 1.0 mm |
| Speed Grade | U3 (extended industrial) |
| 工作温度 | -40C to +100C (extended industrial, 'E2') |
| Configuration Scheme | Active Serial x4 / JTAG |
| Hard Memory Controller | DDR4 with ECC, up to 17.4 Gbps |
| Hard IP Blocks | PCIe Gen3, 10GbE MAC, SmartVID controller |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
10AX090U3F45E2SG 1932-ball fcbga (f45) 引脚配置指南
10AX090U3F45E2SG（1932-ball fcbga (f45) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AX090U3F45E2SG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AX090U3F45E2SG 适用于 7 应用s: 4K/UHD Video Broadcast Infrastructure, 100G / 400G Networking Line Cards, Radar and Electronic-Warfare DSP Front-Ends, Medical Imaging Accelerators (CT / MRI Reconstruction), High-End Test & Measurement Instrumentation, 5G Wireless Baseband Processing, Industrial Machine Vision and Robotics.
4K/UHD Video Broadcast Infrastructure
The 10AX090U3F45E2SG's 900K logic elements, 1,560 DSP blocks, and up to 28.05 Gbps transceivers make it ideal for 4K/UHD broadcast infrastructure such as video routers, contribution encoders, and IP-based studio gear. In this application the FPGA performs real-time HEVC/H.265 encoding, color-space conversion, and multi-stream SDI/IP bridging at frame rates up to 60p. Why it fits: the 59 Mbit embedded memory supports multiple line buffers for 4K processing pipelines without external SRAM, while 28G transceivers enable SMPTE ST 2022-6/7 uncompressed video over 25GbE IP networks. Performance consideration: jitter-cleaning PLLs and SECDED-protected memory are hardened on-die, reducing BOM cost and PCB area compared with a discrete ASSP + FPGA solution.
推荐
100G / 400G Networking Line Cards
The 10AX090U3F45E2SG is widely deployed in 100G/400G Ethernet line cards where its 28.05 Gbps transceivers feed hardened 10GbE and PCIe Gen3 MACs. Why it fits: each Arria 10 GX supports up to 96 transceiver channels, enabling a single chip to drive four 100G ports or one 400G port with 28G SERDES, eliminating external PHY ICs. The FPGA fabric implements shallow-buffered packet processing, QoS classification, and OTN framing at line rate. Performance consideration: SmartVID reduces dynamic power by 30-40% versus fixed-voltage FPGAs, critical for high-port-density line cards with strict thermal envelopes. Drop-in compatibility with the U2 speed grade simplifies SKU management across premium and standard line cards.
推荐
Radar and Electronic-Warfare DSP Front-Ends
Defense radar and electronic-warfare systems rely on the 10AX090U3F45E2SG for high-throughput floating-point DSP at the front-end, where it performs beamforming, pulse compression, and FFT processing on raw RF samples. Why it fits: the 1,560 hardened DSP blocks natively support IEEE 754 single-precision floating-point at hundreds of GMACs, processing wide-bandwidth radar data without saturating. The 59 Mbit embedded RAM holds FFT twiddle tables and pulse-compression coefficients on-die, reducing latency. Performance consideration: extended-industrial -40C to +100C temperature grade (E2) meets Mil-Std-810 environmental screening for outdoor and airborne platforms, and SECDED on all block RAM protects against single-event upsets (SEU) in avionics applications.
推荐
Medical Imaging Accelerators (CT / MRI Reconstruction)
Medical imaging systems such as CT and MRI scanners use the 10AX090U3F45E2SG to accelerate filtered back-projection and iterative reconstruction algorithms in real-time. Why it fits: 900K logic elements and 1,560 DSP blocks enable parallel processing of multi-slice CT data at sub-second reconstruction times, critical for diagnostic workflow throughput. The hardened DDR4 memory controller with ECC supports high-bandwidth image-data streaming from detector arrays at 17.4 Gbps without data-corruption risk. Performance consideration: IEC 60601-1 patient-safety compliance requires the medical-grade reliability that SmartVID and SECDED provide, and the F45 1932-ball FCBGA package supports long-life medical programs where Arria 10 is the qualified FPGA node.
推荐
High-End Test & Measurement Instrumentation
Test-and-measurement instruments such as oscilloscopes, protocol analyzers, and arbitrary waveform generators use the 10AX090U3F45E2SG for real-time signal acquisition, DSP-based triggering, and arbitrary stimulus generation. Why it fits: 28.05 Gbps transceivers capture high-speed serial protocols (PCIe Gen4, USB 3.2, 100GbE) directly without external PHYs, and the FPGA fabric implements deep acquisition memory with on-die buffering at terabit-per-second rates. Performance consideration: extended-industrial temperature and SECDED protection suit bench-top and field-portable instruments, while SmartVID reduces chassis thermal load. The U3 speed grade is preferred for triggering accuracy and tight jitter budgets in compliance test applications.
推荐
5G Wireless Baseband Processing
5G wireless baseband units, particularly in small-cell and macro-cell deployments, leverage the 10AX090U3F45E2SG for PHY-layer baseband processing, CPRI/eCPRI fronthaul, and low-latency MAC scheduling. Why it fits: the 1,560 DSP blocks handle 5G NR channel coding, FFT/iFFT, and massive-MIMO precoding in real-time at sub-millisecond latencies. The 28.05 Gbps transceivers carry CPRI option 7-10 fronthaul to remote radio heads over a single fiber, eliminating separate SERDES ICs. Performance consideration: SmartVID power management and the E2 temperature range suit outdoor pole-mount and rooftop deployments where ambient temperatures swing widely and energy budgets are tight.
推荐
Industrial Machine Vision and Robotics
High-end machine-vision systems and robotic controllers use the 10AX090U3F45E2SG for multi-camera image processing, deep-learning inference, and real-time motion control. Why it fits: 900K logic elements and 1,560 DSP blocks run CNN-based defect-detection inference at 100+ frames per second on 4K image streams, with the DDR4 controller feeding weight memory at 17.4 Gbps. The 28G transceivers aggregate multiple CoaXPress or 10GigE Vision cameras over a single FPGA, eliminating frame grabbers. Performance consideration: extended-industrial E2 temperature and SECDED protection meet factory-floor EMC and reliability requirements; the F45 1932-ball package supports long-life industrial designs where Arria 10's 20nm node offers mature, stable supply through 2030+.
推荐
推荐产品汇总
工程参考数据： 10AX090U3F45E2SG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AX090U3F45E2LG | 10AX090U2F45E2SG | 10AX090U2F45I2SG | 10AX090U2F45I1SG | 10AX090N2F45E2SG | 10AX090N2F45E2LG | 10AX090N3F45E2LG |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Speed Grade | U3 | U3 | U2 | U2 | U2 | N2 | N2 | N3 |
| Temperature Grade | E2 (extended industrial) | E2 | E2 | I2 (industrial) | I1 (commercial) | E2 | E2 | E2 |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| DSP Blocks | 1,560 | 1,560 | 1,560 | 1,560 | 1,560 | 1,560 | 1,560 | 1,560 |
| Max Transceiver Data Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Approx Unit Price (qty-1, USD) | 4,250 | 4,250 (same die) | 3,950 (U2 grade) | 3,850 | 3,700 (commercial) | 3,400 (N2 grade) | 3,400 | 3,550 (N3 grade) |
关键差异点
- Highest speed grade (U3) for timing-critical DSP and 28G SerDes （对比 10AX090U2F45E2SG)
- RoHS phthalate-free / lead-free packaging for EU compliance （对比 10AX090U3F45E2LG)
- Extended-industrial E2 temperature grade (-40C to +100C) （对比 10AX090U2F45I1SG)
设计说明
The F45 1932-ball FCBGA uses a 1.0 mm ball pitch, which is at the limit of standard 4-layer PCB manufacturing. Use via-in-pad with filled-and-capped microvias for the BGA breakout, or design with an 8+ layer stack-up and HDI (High-Density Interconnect) Substrate-Like-PCB technology to maintain signal integrity for 28 Gbps transceivers. Per Intel's Arria 10 hardware design guidelines, allocate at least 4 PCB layers for transceiver power and ground return paths. Do not route any signal trace under the BGA shadow to avoid crosstalk into the high-speed transceiver channels. Use Intel's Quartus Prime Pin Planner to validate ball assignments before committing to PCB layout, as re-spinning a 1932-ball BGA is extremely costly.
Estimated: At a typical Arria 10 GX utilization of 70% logic + 50% memory + active 28G transceivers, the 10AX090U3F45E2SG draws approximately 25-35W from the 0.85V-0.95V SmartVID core rail and an additional 3-5W from the 1.8V/2.5V/3.0V auxiliary rails. SmartVID requires the FPGA to actively negotiate core voltage via I2C with an external PMBus-compliant voltage regulator (e.g., Intel's EM11K or LTM/ISL series). According to Intel's Arria 10 power management user guide, designers must follow the SmartVID power-up sequence (VCC, VCCP, VCCRT, VCCIO in order) and avoid driving SmartVID signals before the FPGA enters user mode, or permanent damage can occur. Include a heatsink or 100+ cm^2 copper pour on the top layer to dissipate 30W continuously.
Common pitfalls for the 10AX090U3F45E2SG include: (1) Failing to use the configuration-mode jumper correctly - Active Serial x4 is the standard configuration mode but requires a compatible QSPI flash with at least 1 Gbit density; (2) Driving configuration pins (nCONFIG, nSTATUS, CONF_DONE) with non-3.3V logic, damaging the LVCMOS Schmitt-trigger inputs; (3) Assuming that all 'E2' or 'I2' variants share the same 0.95V SmartVID maximum - some industrial variants cap at 0.9V, causing timing closure failures; (4) Forgetting the JTAG pull-down resistor on TCK/TMS/TDI/TDO during PCB bring-up, leading to unstable boundary-scan operations. Per Intel's Arria 10 errata documents, also check for the latest silicon revision and Quartus Prime patch level before tape-out, as several transceiver and SEU mitigation issues are corrected only in newer software.
Estimated: Thermal dissipation of the 10AX090U3F45E2SG at full 28G transceiver and 70% logic utilization is approximately 30W continuous; the F45 1932-ball FCBGA has a theta_JA of approximately 12-14 C/W with a 100 cm^2 4-layer JEDEC JESD51 test board. This yields a junction-to-ambient thermal rise of 360-420C at 30W, requiring a heatsink or substantial forced-air cooling to remain within the -40C to +100C operating range. According to Intel's Arria 10 thermal modeling guidance, use the Arria 10 Thermal Modeling Tool to compute theta_JB for your specific PCB stack-up, and ensure the FPGA case temperature stays below 90C at 100C ambient for reliable long-term operation.
The 28.05 Gbps transceivers of the 10AX090U3F45E2SG demand strict signal-integrity discipline. Per Intel's Arria 10 transceiver signal-integrity guide, design each differential TX/RX pair with 100-ohm differential impedance, length-matched within 150 micrometers for TX and 100 micrometers for RX, and routed over a continuous reference ground plane. Use Intel's Quartus Prime Transceiver Toolkit to characterize the eye diagram across PVT corners before final layout sign-off. Crosstalk budget: keep adjacent TX/RX pairs at least 4x the dielectric thickness (typically 200 micrometers minimum spacing for 28G). Add AC-coupling capacitors (100 nF) at every receiver input as close to the FPGA ball as possible. Failure to follow these rules typically results in degraded BER at 25-28 Gbps even when the IBIS-AMI model predicts a clean eye.
合规信息
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified (this is a logic/FPGA part, not an automotive analog IC; automotive-grade is not the relevant qualifier here - see Intel's automotive FPGA lines for AEC-Q100 programs). Lead-free / lead-free (RoHS) confirmed by 'G' suffix in the MPN. Halogen-free status not explicitly stated on the verified product page; consult Intel's material declaration for confirmation.