10AX090U2F45E2LG - Arria 10 GX 900K LE FPGA | Intel | 1932-FCBGA
料号： 10AX090U2F45E2LG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4607.5 | $46,075.00 |
| 100 | $4122.5 | $412,250.00 |
| 500 | $3835.75 | $1,917,875.00 |
| 1,000 | $3647.5 | $3,647,500.00 |
10AX090U2F45E2LG 概述
A Field Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. FPGAs occupy the performance-and-flexibility tier between general-purpose microcontrollers and application-specific integrated circuits (ASICs), making them ideal for prototyping, low-volume production, and workloads requiring hardware-accelerated parallelism. The Arria 10 GX family is positioned in Intel's mid-range portfolio between Cyclone and Stratix devices, targeting transceiver-rich designs at lower power than equivalent Stratix 10 parts.
Key specifications include 900,000 logic elements, 59,234,304 bits of embedded memory, 480 user I/Os, transceivers up to 14.1 Gbps, and 20nm process technology. The -2 speed grade balances timing margin and Fmax, while the E2 extended temperature range spans 0C to 100C case temperature. The LG suffix indicates a lead-free, RoHS-compliant 1932-ball FCBGA package.
Architecturally, the device integrates hardened PCI Express Gen3 controllers, Gen2 hard memory controllers, partial reconfiguration support, and up to 96 transceiver channels. The transceiver fabric supports protocols including 10GbE, 40GbE, Interlaken, JESD204B, and CPRI, enabling single-chip implementation of wired communications, wireless baseband, and broadcast video pipelines.
Typical applications include high-throughput data acquisition systems, 4K video processing and broadcast, wireless baseband and remote radio heads, defense radar and signal intelligence, medical imaging accelerators, and ASIC prototyping. The combination of high logic density and embedded transceivers makes it well suited for systems that require parallel DSP combined with multi-gigabit serial I/O.
When designing with this part, allocate at least one full transceiver bank reference clock per quad, follow Intel's power-rail sequencing guidelines for the 0.9V core and 1.8V/2.5V/3.0V auxiliary rails, and respect the 1932-ball FCBGA PCB layout rules including microvia stackup, length-matched differential pairs, and thermal-via arrays under the lid for heat dissipation.
直接替换替代料： 10AX090U2F45E2LG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AX090U2F45E2LG （相同外形与封装尺寸） ——差异在于 Speed Grade, Operating Temperature Grade, Package, Process Technology, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
10AX090U2F45E1SG
✅ 直接替换✓ 有现货
$5895 / 个
查看数据手册 →10AX090U2F45E2SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5995 / 个
查看数据手册 →10AX090U1F45E1SG
✅ 直接替换✓ 有现货
$8750 / 个
查看数据手册 →10AX090U1F45I1SG
✅ 直接替换✓ 有现货
$9750 / 个
查看数据手册 →10AX090U3F45E2SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3295 / 个
查看数据手册 →10AX090U2F45I2SG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3640 / 个
查看数据手册 →10AX090U2F45E2LG 最大额定值与电气特性
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits |
| User I/O Pins | 480 |
| 封装 | 1932-ball FCBGA |
| Process Technology | 20nm |
| Core Voltage | 0.9 V |
| Speed Grade | -2 |
| Temperature Range | 0C to 100C (E2 - extended) |
| Transceiver Data Rate | Up to 14.1 Gbps |
| PCI Express Hard IP | Gen3 (hardened) |
| Memory Controllers | Gen2 hard memory controllers |
| Configuration Method | Active serial, passive parallel, JTAG |
| RoHS 状态 | Compliant |
| MSL 等级 | 4 (per JEDEC J-STD-020) |
10AX090U2F45E2LG 1932-ball fcbga 引脚配置指南
10AX090U2F45E2LG（1932-ball fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AX090U2F45E2LG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AX090U2F45E2LG 适用于 6 应用s: 4K Video Processing and Broadcast, Wireless Baseband and Remote Radio Head (RRH), Defense Radar and Signal Intelligence, Medical Imaging Accelerator, High-Throughput Data Acquisition, ASIC Prototyping.
4K Video Processing and Broadcast
The 10AX090U2F45E2LG is well suited for 4K video processing and broadcast applications. Its 900,000 logic elements deliver sufficient capacity for video scaling, deinterlacing, color space conversion, and HEVC preprocessing pipelines operating at 60 fps. The 14.1 Gbps transceivers support 12G-SDI and DisplayPort 1.4 interfaces commonly used in broadcast studio equipment. Hard memory controllers handle DDR4 frame buffers without consuming fabric resources, freeing the FPGA fabric for picture-quality algorithms. The -2 speed grade provides the timing margin required to close timing on 4K-wide datapaths at full frame rate.
推荐
Wireless Baseband and Remote Radio Head (RRH)
The 10AX090U2F45E2LG serves wireless baseband and remote radio head designs with its 14.1 Gbps transceivers and high DSP block count. The device supports CPRI and OBSAI fronthaul links up to 12.5 Gbps per lane, enabling multi-sector 4G/5G RRH implementations. Hardened PCI Express Gen3 controllers connect to baseband processors, while the 900K logic elements implement channelization, FFT, and crest-factor reduction in a single chip. The 20nm process delivers the lowest power at the required performance, which is critical for outdoor RRH deployments with thermal constraints.
推荐
Defense Radar and Signal Intelligence
The 10AX090U2F45E2LG is widely deployed in defense radar and signal intelligence systems. The 900K logic elements and 96 transceiver channels support multi-antenna phased-array radar with simultaneous receive paths. Embedded DSP blocks accelerate FFT and pulse compression at the high sample rates required for modern radar modes. The package's high pin count accommodates the multiple JESD204B ADC/DAC interfaces common in these designs. The -2 speed grade enables timing closure on 250 MHz+ datapaths that define modern EW and SAR systems.
推荐
Medical Imaging Accelerator
The 10AX090U2F45E2LG accelerates medical imaging workloads including CT, MRI, and ultrasound reconstruction. The 900K logic elements implement back-projection, iterative reconstruction, and AI-assisted denoising in hardware, offloading compute from host processors. PCI Express Gen3 hard IP enables direct attachment to imaging server PCIe slots. The 59 Mbits of embedded memory provides low-latency scratchpad storage for reconstruction kernels, while DDR3/DDR4 controllers manage the multi-gigabyte image datasets typical of CT volumes. Low-power 20nm silicon is essential for clinic-side deployment.
推荐
High-Throughput Data Acquisition
The 10AX090U2F45E2LG excels in high-throughput data acquisition systems used in scientific instrumentation and test equipment. The 14.1 Gbps transceivers interface to high-speed ADCs and DACs over JESD204B/C, aggregating multiple converter channels at sample rates exceeding 5 GSPS. The 900K logic elements implement real-time FFTs, channelization, and trigger logic on the streaming data. Embedded 59 Mbits of block memory buffers data between acquisition and processing stages, reducing external memory pressure. The -2 speed grade is essential for timing closure on the wide parallel datapaths.
推荐
ASIC Prototyping
The 10AX090U2F45E2LG is frequently used as an ASIC prototyping platform. The 900K logic elements map the equivalent of 8-12 million ASIC gates, sufficient for mid-complexity SoC prototypes. Hardened PCI Express Gen3 and memory controllers allow validation of real-world I/O paths alongside the prototype logic. The 480 user I/Os and 14.1 Gbps transceivers replicate most ASIC interfaces at near-production speed. Quartus Prime supports ASIC-style partitioning and incremental compilation to shorten bring-up time, making the Arria 10 GX a productive prototyping vehicle.
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推荐产品汇总
工程参考数据： 10AX090U2F45E2LG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AX090U2F45E1SG | 10AX090U2F45E2SG | 10AX090U1F45E1SG | 10AX090U1F45I1SG | 10AX090U3F45E2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| Speed Grade | -2 | -1 (slower) | -2 (same) | -1 (slower) | -1 (slower) | -3 (faster) |
| Temperature Range | 0C to 100C (E2) | 0C to 100C (E1) | 0C to 100C (E2) | 0C to 100C (E1) | -40C to 100C (I1 industrial) | 0C to 100C (E2) |
| Transceiver Rate (max) | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps |
| Process Technology | 20nm | 20nm | 20nm | 20nm | 20nm | 20nm |
关键差异点
- Highest speed grade in the LG finish option （对比 10AX090U2F45E1LG / 10AX090U2F45E1SG)
- Lead-free LG package finish suitable for global RoHS markets （对比 Older non-LG finishes (where available))
- Drop-in compatible with broader 10AX090U2F45 family （对比 10AX090U1F45E1SG (U1 trim))
设计说明
Estimated: At 100% logic utilization with typical 0.85 core voltage and 70% toggle rate, the 10AX090U2F45E2LG dissipates approximately 25-35W. The 1932-ball FCBGA package requires a thermal-via array under the lid with at least 0.4 C/W board thermal resistance to ambient. Use a heatsink with 0.5 C/W or attach to a cold plate in forced-air systems. Without active cooling the junction temperature will exceed 100C in most realistic workloads.
The 1932-ball FCBGA demands a high-density PCB stackup: at minimum 1+6+1 with microvias on the top and bottom layers, 0.2mm ball pitch requires 0.4mm laser-drilled microvias. Reference Intel's Arria 10 hardware design guidelines for stackup recommendations. Maintain 100-ohm differential impedance for transceiver pairs and 50-ohm single-ended for general-purpose I/O. Length-match within 150 microns across transceiver lanes to meet 14.1 Gbps eye margins.
Sequence power rails in the order: 3.3V auxiliary, 1.8V/2.5V/3.0V I/O banks, then 0.9V core. The Intel Arria 10 Device Datasheet specifies the minimum ramp time and monotonicity requirements for each rail. Use a dedicated power management IC such as the LTC3615 or LTM4677 family with the Power Management feature in Quartus Prime. Decoupling capacitors must be placed within 100 mils of each power pin with 100 nF + 4.7 uF + 22 uF combinations.
Do not assume the 10AX090U2F45E2LG and 10AX090U2F45E2SG are interchangeable without verifying lead-free and RoHS requirements - the LG suffix denotes a specific lead-free finish. Configuration mode (AS, PS, JTAG) must be selected via MSEL pins with the exact resistor values in the datasheet. Mixed transceiver protocol and PCI Express configurations require careful Quartus Prime pin assignment to avoid lane conflicts in the same bank.
合规信息
RoHS compliance per LG suffix in the part number. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade discrete. Halogen-free status not stated in verified web data.