10AX090U2F45E2SG - Arria 10 GX FPGA 900K LE 1932-FCBGA | Intel
料号： 10AX090U2F45E2SG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7610.3 | $7,610.30 |
| 10 | $7230 | $72,300.00 |
| 100 | $6850 | $685,000.00 |
| 500 | $6420 | $3,210,000.00 |
| 1,000 | $5995 | $5,995,000.00 |
10AX090U2F45E2SG 概述
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O cells can be configured after manufacture to implement arbitrary digital circuits, DSP pipelines, memory controllers, and high-speed serial interfaces. Within Intel's product hierarchy, the Arria 10 family sits in the mid-range transceiver-rich segment, between the lower-power Cyclone series and the high-end Stratix family, targeting applications that combine DSP throughput, high-speed transceivers, and moderate power budgets.
Key features of the 10AX090U2F45E2SG include the Arria 10 adaptive logic module (ALM) fabric, on-chip variable-precision DSP blocks, embedded 20nm SRAM blocks supporting single-port, dual-port, and FIFO configurations, and dedicated high-speed serial transceivers. The 1932-ball FC-FBGA package provides a high pin-count matrix suitable for high-bandwidth memory interfaces and multi-gigabit transceiver I/O, while the 0.9V core voltage aligns with the Arria 10 family's power architecture.
Architecturally, the Arria 10 device integrates hard IP for PCI Express Gen3, 10GbE and 40GbE MACs, external memory interfaces (DDR4, DDR3, QDR II+, RLDRAM III), and a high-performance core fabric with redundant logic for SEU mitigation. The E2 speed grade offers a balance between timing margin and power consumption suitable for production deployments.
Typical applications include wireless baseband processing, radar signal processing, military and aerospace secure communications, medical imaging accelerators, broadcast video processing, high-performance computing (HPC) coprocessors, and test-and-measurement ASIC prototyping where the high logic density and integrated transceivers reduce external component count.
When designing with the 10AX090U2F45E2SG, careful attention must be paid to PCB stack-up, power-rail sequencing, and thermal management. The FC-FBGA package requires microvia stack-up, and the high-density transceiver count demands controlled impedance routing. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in Arria 10 family alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： 10AX090U2F45E2SG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AX090U2F45E2SG （相同外形与封装尺寸） ——差异在于 Speed Grade, Logic Elements, Package, Operating Temperature Grade, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
10AX090U2F45E2LG
✅ 直接替换✓ 有现货
$3647.5 / 个
查看数据手册 →10AX090U2F45E1SG
✅ 直接替换✓ 有现货
$5895 / 个
查看数据手册 →10AX090U2F45E1LG
✅ 直接替换📋 参考替代料（不在目录中）
10AX090U1F45E1SG
✅ 直接替换✓ 有现货
$8750 / 个
查看数据手册 →10AX090U1F45I1SG
✅ 直接替换✓ 有现货
$9750 / 个
查看数据手册 →10AX090U2F45E2SG 最大额定值与电气特性
| Family | Arria 10 GX |
| Logic Elements | 900000 |
| Embedded Memory (bits) | 59234304 |
| User I/O Count | 480 |
| 封装 | 1932-BBGA, FCBGA |
| Package Type | FC-FBGA (F45) |
| Speed Grade | -E2 |
| Temperature Grade | Industrial (S) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Device Family Variant | 10AX090 |
| Ordering Code Suffix | U2F45E2SG |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| 安装类型 | Surface Mount |
10AX090U2F45E2SG 引脚配置
| 引脚 1 | VCC — Core/auxiliary supply (refer to F45 ballout for exact rail assignment) |
| 引脚 2 | GND — Common ground return |
| 引脚 3 | IO_BANK_1A — User I/O bank 1A (LVDS/CMOS programmable) |
| 引脚 4 | GXB_TX — Transceiver transmit differential pair |
| 引脚 5 | GXB_RX — Transceiver receive differential pair |
| 引脚 6 | REFCLK — Reference clock input for transceiver/PLL |
| 引脚 7 | CONFIG_DONE — Configuration complete status output |
| 引脚 8 | nSTATUS — Configuration status flag (active low) |
| 引脚 9 | nCONFIG — Configuration initiate (active low) |
| 引脚 10 | MSEL — Configuration mode select |
典型应用
10AX090U2F45E2SG 适用于 7 应用s: Wireless Baseband Processing, Radar Signal Processing, Medical Imaging Acceleration, Broadcast Video Processing, High-Performance Computing (HPC) Coprocessor, ASIC Prototyping, Test & Measurement Instrumentation.
Wireless Baseband Processing
The 10AX090U2F45E2SG's 900K logic elements, integrated DSP blocks, and high-speed transceivers up to 28 Gbps make it well-suited for 4G/5G baseband digital up/down-conversion, CFR/DPD signal processing, and multi-antenna MIMO pipelines. The 59.2 Mbits embedded SRAM buffers FFT working sets without external memory stalls, while the 480 user I/O interfaces to analog RF front-ends and external DDR4 buffers.
推荐
Radar Signal Processing
Military and weather radar systems rely on the 10AX090U2F45E2SG's 20nm process for high MTBF and its industrial temperature grade for field deployment. The variable-precision DSP blocks accelerate pulse-compression, MTI filtering, and CFAR detection pipelines, while the transceiver count handles multi-channel ADC data ingest up to 6.144 Gbps per lane. The 1932-ball FC-FBGA's thermal performance is critical for sustained compute loads in airborne platforms.
推荐
Medical Imaging Acceleration
CT, MRI, and ultrasound imaging systems use the 10AX090U2F45E2SG to accelerate back-projection, beamforming, and image-reconstruction algorithms. The 900K logic elements and 59.2 Mbits embedded SRAM allow real-time 3D rendering, while the PCI Express Gen3 hard IP connects to host CPUs over standard PCIe backplanes. The industrial temperature range supports operating-room and mobile-clinic deployment without thermal derating.
推荐
Broadcast Video Processing
The 10AX090U2F45E2SG supports 4K/UHD video processing including scaling, deinterlacing, color-space conversion, and HDR tone mapping in broadcast infrastructure. Its transceiver count handles 12G-SDI ingest at 11.88 Gbps per link, and the M20K memory blocks implement line buffers and motion-estimation windows. The 480 user I/O interfaces to HDMI 2.0, SDI, and DisplayPort 1.4 conversion ASICs.
推荐
High-Performance Computing (HPC) Coprocessor
HPC clusters use the 10AX090U2F45E2SG as a co-processor for FPGA-accelerated genomics, financial Monte Carlo, and machine-learning inference. PCI Express Gen3 x8 hard IP enables host coupling at 8 GB/s, and the DSP fabric implements custom-precision floating-point operators. The 900K logic elements allow whole genomes or risk models to be staged on-chip, eliminating DRAM round-trips.
推荐
ASIC Prototyping
Pre-silicon ASIC validation teams use the 10AX090U2F45E2SG to prototype designs approaching 900K ASIC gates on a reprogrammable platform, catching logic bugs before mask-set commitment. The F45 1932-ball FC-FBGA footprint, abundant transceivers, and Quartus Prime prototyping flow shorten bring-up cycles. Multiple Arria 10 boards can be ganged for multi-FPGA ASIC prototypes exceeding 5M gates.
推荐
Test & Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators integrate the 10AX090U2F45E2SG for real-time signal acquisition, triggering, and DSP. The transceiver count handles 25+ Gbps protocol decoding for PCIe 4.0 and USB 3.1 Gen2 analysis. Industrial temperature screening supports bench-to-rack test equipment operating in uncontrolled environments, while Quartus Prime enables rapid protocol firmware updates.
推荐
推荐产品汇总
工程参考数据： 10AX090U2F45E2SG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AX090U2F45E2LG | 10AX090U2F45E1SG | 10AX090U2F45E1LG | 10AX090U1F45E1SG | 10AX090U1F45I1SG |
|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 900000 | 900000 | 900000 | 900000 | 900000 | 900000 |
| Embedded Memory (Mbits) | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 |
| Speed Grade | -E2 | -E2 | -E1 (faster) | -E1 (faster) | -E1 (faster) | -I1 (industrial) |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial | Industrial |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
关键差异点
- Identical silicon to 10AX090U2F45E1SG with E2 speed bin selection （对比 10AX090U2F45E1SG)
- Same package as 10AX090U2F45E2LG with SG terminal finish （对比 10AX090U2F45E2LG)
- Industrial-grade screening over U1F45 commercial variant （对比 10AX090U1F45E1SG)
- Mid-range Arria 10 density tier with balanced DSP and transceiver mix （对比 10AX115 (higher density tier))
设计说明
The 1932-ball FC-FBGA package with 1.0mm ball pitch requires an 8-12 layer PCB stack-up with stacked microvias (laser-drilled) for inner ball connections. Use low-loss (Df < 0.005) high-Tg FR-4 or mid-loss Nelco N4000-13EP for the core. Maintain a 50Ω single-ended and 100Ω differential controlled impedance for transceiver channels. Place 0402 or 0201 decoupling capacitors on every VCC ball within 1mm trace length.
Estimate: the 10AX090U2F45E2SG core rail draws approximately 3-8A at 0.9V under typical utilization. Total device power can exceed 25W when transceivers are fully active. Use a multi-phase buck regulator (e.g., 4-phase ISL8225M) feeding the core rail, and route analog/digital supplies separately. Enable Intel's SmartVoltage ID and power-management features in Quartus to reduce dynamic power by 30-50% on lightly-loaded regions.
Estimated: at 25W total power dissipation and 31.4 C/W theta_JA for the F45 FC-FBGA, the junction rises 785C above ambient - exceeding silicon limits. A heatsink with thermal resistance under 1 C/W, plus 200 LFM forced airflow, is required for production deployment. The exposed-die FC-FBGA attaches directly to a heat spreader via thermal interface material (TIM). Use Intel's Arria 10 thermal estimator spreadsheet for board-level simulation before tape-out.
Route GXB (transceiver) channels first with length matching to within 0.127mm (5 mils) for lanes within a quad, and reference over a continuous ground plane. Use stitched ground vias every 2mm along the channel to suppress common-mode resonance. Separate analog PLL supplies from digital supplies with their own ferrite-bead-filtered rails. Avoid routing any signal traces under BGA balls on internal layers.
Common pitfalls include: (1) using Quartus II instead of Quartus Prime Pro - the older software cannot synthesize Arria 10 silicon; (2) omitting the .qsf pin assignments file before compilation; (3) underestimating configuration time for 20nm SRAM configuration bitstream > 100 Mbit; (4) failing to instantiate the Altera PHYLite or External Memory Interface IP for DDR4 - free IP is required for legal PHY; (5) ignoring SDC timing constraints for inter-clock-domain paths leads to silent functional failures.
合规信息
RoHS and REACH compliant per Intel Arria 10 product family declaration. AEC-Q100 is not applicable - this is an FPGA, not an automotive-qualified IC; AEC-Q100 qualification must be done at the system level for the OEM. Lead-free ball finish standard on SG/LG suffixes.