10AX115H3F34I2SG - Arria 10 GX FPGA 1.15M LE | Intel
料号： 10AX115H3F34I2SG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4085 | $40,850.00 |
| 25 | $3960 | $99,000.00 |
| 50 | $3820 | $191,000.00 |
| 100 | $3675 | $367,500.00 |
10AX115H3F34I2SG 概述
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that implements custom digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and high-speed transceivers. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which themselves belong to the integrated circuit family used for digital signal processing, hardware acceleration, and prototyping. The Arria 10 GX family specifically targets mid-range applications requiring transceivers up to 14.1 Gbps alongside hardened memory controllers and PCI Express Gen3 IP.
Key features of the 10AX115H3F34I2SG include 1,150,000 logic elements, 68,857,856 bits (approximately 8.4 MB) of embedded memory, 504 maximum user I/O, transceiver support, hard memory controllers, and DSP blocks for high-performance arithmetic. The FCBGA-1152 package exposes differential pairs and high-speed serial links that enable protocols such as PCI Express Gen3, 10 Gigabit Ethernet, and JESD204B. Hardware hardening of floating-point multipliers and memory interfaces reduces soft logic utilization and improves system-level throughput.
The architecture combines a 20nm-equivalent process node with hardened variable-precision DSP blocks, partial reconfiguration support, and security features such as bitstream encryption. The Arria 10 GX family introduces hardened floating-point operators and embedded Multi-Port Memory structures, allowing deterministic latency and deterministic throughput for signal-processing pipelines that benefit from simultaneous data-plane and control-plane execution on a single die.
Typical applications include high-speed data acquisition systems, wireline telecom backhaul, broadcast video processing, medical imaging accelerators, military radar front-ends, ASIC prototyping, and FPGA-based hardware acceleration in HPC and datacenter fabrics. The 504 I/O count and transceiver density also suit test-and-measurement instrumentation, software-defined radio platforms, and industrial machine vision requiring low-latency parallel processing.
When designing with this device, plan PCB layout for the FCBGA-1152 footprint, which requires high-density via arrays and controlled-impedance routing for transceiver channels. Use the Intel Quartus Prime design suite for synthesis, place-and-route, and timing closure; the device supports partial reconfiguration and remote system update via on-chip configuration logic.
This page synthesizes distributor pricing, drop-in alternative inventory, and practical design notes not found in the manufacturer datasheet, enabling faster sourcing decisions.
直接替换替代料： 10AX115H3F34I2SG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AX115H3F34I2SG （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, DSP Blocks, Transceivers, Process Technology.
快速对比工具——选择替代料号进行并排对比：
10AX115H3F34I2LG
✅ 直接替换✓ 有现货
$6800 / 个
查看数据手册 →10AX115H3F34E2LG
✅ 直接替换✓ 有现货
$6550 / 个
查看数据手册 →10AX115H2F34I2SG
✅ 直接替换✓ 有现货
$3640 / 个
查看数据手册 →10AX115H2F34I2LG
✅ 直接替换✓ 有现货
$4995 / 个
查看数据手册 →10AX115H1F34I1SG
✅ 直接替换✓ 有现货
$6500 / 个
查看数据手册 →10AX090U3F45I2SG
✅ 直接替换✓ 有现货
$7450 / 个
查看数据手册 →10AX115H3F34I2SG 最大额定值与电气特性
| Series | Arria 10 GX |
| Family | 10AX115 |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (~8.4 MByte) |
| Number of I/O | 504 |
| Core Voltage | 0.87 V to 0.93 V |
| 封装 | 1152-BBGA, FCBGA |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to 100C (TJ) |
| Grade | Industrial |
| Process Technology | 20 nm Tri-Gate |
| Supplier Device Package | 1152-FCBGA |
| Configuration Method | SRAM-based, volatile |
| Transceivers | Yes (GX variant, up to 14.1 Gbps) |
10AX115H3F34I2SG 1152-fcbga 引脚配置指南
10AX115H3F34I2SG（1152-fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AX115H3F34I2SG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AX115H3F34I2SG 适用于 7 应用s: High-Speed Telecom Backhaul, Broadcast Video Processing, ASIC Prototyping, Software Defined Radio (SDR), Medical Imaging Acceleration, Industrial Machine Vision, Test and Measurement Instrumentation.
High-Speed Telecom Backhaul
The 10AX115H3F34I2SG's 1.15M logic elements and Arria 10 GX transceivers up to 14.1 Gbps make it ideal for telecom backhaul line cards. Placed on a CFP/CFP2 pluggable backplane, the FPGA performs packet classification, traffic shaping, and OTN/SONET framer logic with deterministic latency. The 504 user I/O support 10G Ethernet, CPRI, and OBSAI interfaces simultaneously. Hard IP cores for 10G Ethernet MAC and PCI Express Gen3 offload common protocol functions, freeing soft logic for customer-differentiated features. The 20 nm process and hardened DSP blocks keep typical backhaul designs under 30 W.
推荐
Broadcast Video Processing
The 10AX115H3F34I2SG drives 4K/UHD video processing pipelines with sufficient logic capacity for color-space conversion, scaling, deinterlacing, and HDR metadata insertion. The 504 user I/O aggregate SDI, HDMI, and DisplayPort streams at up to 12G-SDI rates. Hardened memory controllers feed multiple DDR3/DDR4 banks with low latency. The GX transceivers accept uncompressed video over 10G Ethernet links for contribution feeds. Industrial temperature grade suits 24/7 broadcast rack environments. The same device can simultaneously implement video processing and overlay graphics.
推荐
ASIC Prototyping
The 10AX115H3F34I2SG provides 1.15M logic elements for prototyping mid-complexity ASICs before tape-out, enabling software bring-up and verification on real hardware months before silicon return. The 504 I/O map to FMC connectors and high-speed Mezzanine cards for full ASIC peripheral emulation. Hardened DDR3/DDR4 controllers replicate production memory timing. Quartus Prime supports incremental synthesis to accelerate design iterations. Multiple FPGAs can be chained via the transceivers to partition large ASIC designs.
推荐
Software Defined Radio (SDR)
The 10AX115H3F34I2SG's hardened DSP blocks and up to 14.1 Gbps transceivers enable wideband SDR platforms covering LTE, 5G NR sub-6 GHz, and tactical radio waveforms. The 504 I/O connect to RF ADC/DAC daughtercards via JESD204B/C links. Floating-point hardened operators accelerate channel estimation, FFT, and turbo decoding in soft logic. Industrial temperature grade suits outdoor base station and tactical radio enclosures. Partial reconfiguration enables runtime swapping of waveform personalities without rebooting.
推荐
Medical Imaging Acceleration
The 10AX115H3F34I2SG accelerates CT, MRI, and ultrasound image reconstruction pipelines with its 1.15M logic elements and DSP blocks. The 504 user I/O accept raw sensor data at multi-Gbps rates via LVDS and sub-LVDS, while transceivers aggregate 10G Ethernet for distribution to PACS archives. Hardened floating-point operators speed up back-projection, iterative reconstruction, and beamforming. Industrial temperature and reliability qualifications support medical device regulatory submissions. Long-term availability through Intel's embedded roadmap supports multi-year product lifecycles.
推荐
Industrial Machine Vision
The 10AX115H3F34I2SG drives multi-camera machine vision inspection lines with sub-millisecond latency. The 504 I/O interface to Camera Link, CoaXPress, and GigE Vision cameras via hard IP cores. Logic capacity supports simultaneous defect detection, OCR, and 3D point-cloud processing per camera stream. Transceivers aggregate multiple 10G links to central servers for archival and AI inference. Industrial temperature and ECC-protected memory make the device suitable for 24/7 factory floor operation.
推荐
Test and Measurement Instrumentation
The 10AX115H3F34I2SG's 14.1 Gbps transceivers and 504 user I/O enable high-end oscilloscope, protocol analyzer, and arbitrary waveform generator designs. Logic capacity implements deep acquisition memory, trigger logic, and DSP post-processing simultaneously. Hard IP cores handle PCI Express Gen3 host connectivity for streaming captured data to analysis PCs. The 20 nm process keeps per-channel power low for dense channel-count modules. Industrial temperature and long-term availability suit ATE platform roadmaps.
推荐
推荐产品汇总
工程参考数据： 10AX115H3F34I2SG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AX115H3F34I2LG | 10AX115H3F34E2LG | 10AX115H2F34I2SG | 10AX115H1F34I1SG | 10AX090U3F45I2SG |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Speed Grade | -3 (fastest) | -3 | -2 | -2 | -1 (slowest) | -3 |
| Temperature Grade | Industrial (-40C to 100C) | Industrial | Extended | Industrial | Industrial | Industrial |
| Number of I/O | 504 | 504 | 504 | 504 | 504 | 504 |
| Packing Media | Tray | Tape-and-Reel | Tape-and-Reel | Tray | Tray | Tray |
| Family Variant | 10AX115 | 10AX115 | 10AX115 | 10AX115 | 10AX115 | 10AX090 |
关键差异点
- Highest speed grade in the 10AX115 family （对比 10AX115H2F34I2SG)
- Same package as the entire 10AX115 family （对比 10AX115H3F34I2LG)
- Highest logic density in the Arria 10 family （对比 10AX090U3F45I2SG)
设计说明
The 10AX115H3F34I2SG in FCBGA-1152 can dissipate 25-40 W at full transceiver and logic utilization. Attach a high-performance heatsink with thermal interface material rated for industrial temperature. Use thermal vias under the exposed pad of the FCBGA and at least 4-layer PCB with continuous ground planes to spread heat. Estimate: at 35 W and theta_JA of 8 C/W (with heatsink), junction rises 280 C above 25 C ambient, exceeding the 100 C TJ limit - ensure adequate airflow or cold-plate cooling for sustained full-load operation.
The FCBGA-1152 substrate demands high-density PCB layout: microvias (0.1 mm or smaller), fine line/space (4 mil or below), and stack-up of 8+ layers for transceiver signal integrity. Decouple every transceiver and I/O bank with 0.1 uF and 10 uF capacitors placed within 5 mm of the power pins. Keep high-speed serial traces 100 ohm differential, length-matched within 5 mil for lanes of the same group, and reference continuous ground planes on adjacent layers.
Do not substitute the H3 (speed grade -3) with H2 or H1 speed grades in designs that close timing on the highest transceiver or logic frequency. Verify the Quartus Prime fitter report shows positive slack on all critical paths before committing to a lower speed grade. Also ensure boot flash capacity exceeds the compressed bitstream size; Arria 10 GX designs with hard IP often exceed 100 Mbits uncompressed.
Arria 10 GX transceivers at 14.1 Gbps require pre-emphasis and equalization settings tuned per channel via the Quartus Prime Transceiver Toolkit. Lossy backplane channels (>10 inch FR4) need CTLE and DFE enabled. AC-coupling capacitors must be 100 nF X7R placed within 200 mil of the FPGA transmitter pins. Reference clock jitter must be below 200 fs RMS for 10G Ethernet compliance.
合规信息
RoHS compliant per Intel environmental disclosures for Arria 10 family. Not AEC-Q100 qualified - this device is for industrial/commercial use. AEC-Q100 qualification must be specified separately if required.