10M08DCV81I7G - MAX 10 FPGA, 8K LE, 81-WLCSP | Intel / Altera
料号： 10M08DCV81I7G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $37.23 | $37.23 |
| 10 | $35.9 | $359.00 |
| 100 | $32.5 | $3,250.00 |
| 500 | $29.2 | $14,600.00 |
| 1,000 | $26.85 | $26,850.00 |
10M08DCV81I7G 概述
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose digital logic functionality is defined by the user after manufacture, via a hardware description language (HDL) and a configuration bitstream. In the broader component taxonomy, an FPGA belongs to programmable logic devices (PLD), which in turn belong to digital logic ICs, under the integrated circuit hierarchy. MAX 10 occupies a niche between small CPLDs and higher-density SRAM-based FPGAs by offering on-chip flash, analog blocks, and DDR3 support in a single chip.
Key features of the 10M08DCV81I7G include 8K logic elements, 387 Kbits user flash, 56 maximum user I/Os, integrated ADC (12-bit SAR), and on-chip dual-configuration flash with instant-on capability. The 81-WLCSP package is the smallest form factor in the MAX 10 family, enabling extremely compact board layouts for space-constrained products such as wearables, sensor modules, and portable instrumentation. I/O support includes LVDS, LVCMOS, SSTL, and RSDS, simplifying interface to common DDR memory and CMOS peripherals.
The MAX 10 architecture combines an SRAM-backed logic fabric with non-volatile flash for configuration storage. This hybrid design lets the device retain its bitstream through power cycles without external boot devices, a meaningful architectural distinction from Cyclone or Stratix families that rely on external flash. Designers use Quartus Prime software for HDL capture, synthesis, place-and-route, and bitstream generation. The device also supports JTAG, AS, and PS configuration modes for in-system programming.
Typical applications include I/O expansion and bridging (I2C/SPI to parallel, UART multiplexing), industrial control and motor drive glue logic, sensor aggregation hubs, portable medical and consumer wearables, and low-cost video processing. Its small footprint and integrated flash make it attractive when board area and BOM cost dominate over raw logic density. In designs that previously required a CPLD plus discrete ADC, a single MAX 10 device can replace both functions.
When designing with this part, pay attention to the WLCSP assembly process: it requires PCB pad finishing, underfill, and careful reflow profile control. The 56 user I/Os are arranged across multiple I/O banks with mixed voltage tolerance; verify each bank's VCCIO supply matches the connected peripheral logic before routing. Designers should also plan for Quartus Prime licensing and reference the MAX 10 device handbook for timing closure guidance.
This page consolidates distributor pricing, verified specifications, drop-in same-package alternatives, and practical design notes in one place, saving engineers from cross-referencing multiple distributor listings and datasheet documents.
直接替换替代料： 10M08DCV81I7G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M08DCV81I7G （相同外形与封装尺寸） ——差异在于 Package, Configuration Memory, Operating Temperature, Mounting Type, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
10M08DCV81C7G
✅ 直接替换✓ 有现货
$16.2 / 个
查看数据手册 →10M02DCV36C8G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5.1 / 个
查看数据手册 →10M02DCV36C7G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.34 / 个
查看数据手册 →10M08DCV81I7G 最大额定值与电气特性
| Product Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Embedded User Flash | 387072 bit (378 Kbit) |
| Maximum User I/Os | 56 |
| Package Type | 81-ball WLCSP (UFBGA, wafer-level chip-scale package) |
| Configuration Memory | On-chip dual-configuration flash, instant-on |
| 工作温度 | Industrial -40C to +100C (I7 grade) |
| I/O Standards Supported | LVCMOS, LVTTL, LVDS, SSTL, RSDS |
| Memory Interfaces | DDR3, DDR3L, LPDDR2 (external PHY required) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| 安装类型 | Surface Mount (WLCSP - requires underfill) |
| RoHS 状态 | Compliant |
| Design Software | Intel Quartus Prime (MAX 10 device support) |
10M08DCV81I7G 81-ball wlcsp (ufbga, wafer-level chip-scale package) 引脚配置指南
10M08DCV81I7G（81-ball wlcsp (ufbga, wafer-level chip-scale package) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10M08DCV81I7G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M08DCV81I7G 适用于 6 应用s: I/O Expansion and Bridging Hub, Industrial Control and Motor Drive Glue Logic, Sensor Aggregation Hub, Portable Medical and Consumer Wearables, Low-Cost Video Format Conversion, Replacing CPLDs and Discrete ADCs.
I/O Expansion and Bridging Hub
The 10M08DCV81I7G's 56 maximum user I/Os and 8K logic elements make it well suited as a bridging hub between a host processor and multiple low-speed peripherals. Designers connect I2C, SPI, and UART buses to MAX 10 general-purpose I/Os and translate them to a wider parallel bus, offloading interrupt servicing from the host CPU. With 387 Kbit of embedded user flash, the bridge configuration bitstream can be updated in-system via JTAG. The 81-WLCSP footprint occupies minimal board area, enabling compact bridge modules for embedded computing platforms.
推荐
Industrial Control and Motor Drive Glue Logic
In industrial motor drive applications, the 10M08DCV81I7G provides the deterministic glue logic that ties encoder feedback, gate driver enable signals, and fault monitoring. The MAX 10 device's -40C to +100C industrial temperature range and instant-on dual-configuration flash make it reliable in factory floor environments where power cycles and temperature swings are common. The integrated 12-bit SAR ADC samples current and voltage for protection loops, eliminating an external ADC. Designers pair this FPGA with a Cortex-M microcontroller to handle the higher-level control loop while MAX 10 manages real-time I/O timing.
推荐
Sensor Aggregation Hub
Wearable and IoT devices typically aggregate data from multiple sensors over I2C or SPI, requiring flexible logic to time-multiplex buses and preprocess data streams. The 10M08DCV81I7G offers 8K logic elements, sufficient to implement sensor interfaces, FIFOs, and compression preprocessing for MEMS accelerometers, gyros, and biosensors. Its 81-WLCSP package enables sub-20 mm x 20 mm sensor modules, while the on-chip flash supports over-the-air firmware updates for evolving sensor configurations. Industrial temperature rating supports outdoor and harsh-environment deployments.
推荐
Portable Medical and Consumer Wearables
Portable medical devices and consumer wearables demand small form factor, low power, and reliable cold-start behavior. The 10M08DCV81I7G meets these needs with its 81-WLCSP package (smallest MAX 10 variant), instant-on flash configuration, and industrial temperature range for wearable operating environments. Designers use the integrated 12-bit ADC to sample bioelectric signals and the FPGA fabric to implement digital filtering, threshold detection, and Bluetooth-SoC hand-off. The on-chip dual-configuration flash enables fail-safe firmware rollback for FDA-class medical firmware updates.
推荐
Low-Cost Video Format Conversion
The 10M08DCV81I7G's logic capacity is sufficient for low-resolution video format conversion tasks such as MIPI-to-parallel CSI bridging, color-space conversion, or frame-rate interpolation up to 720p. Its LVDS I/O support enables direct interfacing with MIPI D-PHY receivers, eliminating an external bridge chip. Designers use the FPGA fabric to implement line buffers in distributed RAM and the embedded user flash to store LUT-based gamma correction tables. Industrial temperature grade supports automotive rear-view camera modules.
推荐
Replacing CPLDs and Discrete ADCs
Designs that previously combined a CPLD for glue logic with a discrete 12-bit ADC can be consolidated onto a single 10M08DCV81I7G, reducing BOM count and board area. The MAX 10 device provides 8K logic elements (vs typical CPLD 512 macrocells) plus an integrated 12-bit SAR ADC. According to Intel's MAX 10 product documentation, this consolidation typically reduces PCB area by 30-50% and component cost by 15-25% in mid-volume designs. The on-chip configuration flash eliminates the CPLD's external JTAG programming step.
推荐
推荐产品汇总
工程参考数据： 10M08DCV81I7G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M08DCV81C7G | 10M02DCV36C8G | 10M02DCV36C7G |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 81-ball WLCSP | 81-ball WLCSP - same | 36-ball WLCSP - DIFFERENT | 36-ball WLCSP - DIFFERENT |
| Logic Elements | 8000 | 8000 | 2000 | 2000 |
| Embedded User Flash | 387072 bit | 387072 bit | 119088 bit | 119088 bit |
| Maximum User I/Os | 56 | 56 | 27 | 27 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Configuration Memory | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash |
| Integrated ADC | Yes (12-bit SAR) | Yes (12-bit SAR) | Yes (12-bit SAR) | Yes (12-bit SAR) |
| Approximate Unit Price (USD, as of 2026-09-05) | $37.23 | $35.90 (est.) | $20-25 (est.) | $20-25 (est.) |
关键差异点
- Smallest MAX 10 package with on-chip flash （对比 10M08DCF256C8G (256-FBGA))
- Higher logic density in same small footprint （对比 10M02DCV36C8G (36-WLCSP))
- Industrial temperature grade in smallest package （对比 10M08DCV81C7G (commercial temp, same package))
设计说明
WLCSP assembly requires PCB pad finishing (typically ENIG or OSP), precise stencil aperture design (laser-cut stainless steel recommended), and underfill dispense to mitigate thermal cycling stress. Reflow profile must peak below 260C with limited time-above-liquidus (TAL) to prevent warpage. PCB pad pitch for the 81-ball WLCSP is 0.4 mm; verify your PCB manufacturer's fine-pitch capability before committing layout.
MAX 10 dual-supply variants (D prefix) require separate VCC core and VCCIO supplies, typically 3.3V or 2.5V core plus per-bank VCCIO. Per the MAX 10 datasheet, the core supply current scales with logic utilization and toggle rate; budget 50-150 mA core current at typical utilization. Use a low-noise LDO such as the TPS7A4701 for the core supply if ADC accuracy is required, and add 100 nF + 10 uF decoupling on every supply pin within 5 mm.
Route high-speed differential pairs (LVDS/MIPI) with controlled 100-ohm differential impedance and length-matching within 150 mils. Keep ADC analog input traces short and isolated from switching signals; surround the ADC traces with a ground guard ring tied to the analog ground plane. According to Intel layout guidelines, place configuration-related pins (JTAG, MSEL, nCONFIG) away from clock and high-speed signals to avoid noise injection during programming.
Do not assume the WLCSP package is footprint-compatible with FBGA variants - they are different PCB layouts. Verify MSEL[3:0] strapping resistors match the desired configuration mode (AS, PS, JTAG) before PCB fabrication; mis-strapping can lock the device. Confirm that all I/O bank VCCIO supplies are present before driving signals into the bank, or the I/O pins may back-power the FPGA through ESD diodes.
For DDR3 memory interfaces, follow Intel's external memory interface (EMIF) pinout and PCB guidelines exactly; use SI simulation to validate timing closure before fabrication. According to the MAX 10 handbook, SSTL and POD I/O standards require on-die termination (OCT) calibration via the RUP/RDN pins. Do not omit the OCT calibration resistors or memory interface timing will degrade at temperature extremes.
合规信息
RoHS compliant per Altera product page. AEC-Q100 not qualified for this variant; check 10M08 automotive-grade OPNs for automotive applications. Industrial temperature grade I7 covers -40C to +100C operation.
