10M50DCF672C7G - MAX 10 FPGA 50K LE 672-BGA | Intel
MPN: 10M50DCF672C7G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $131.95 | $131.95 |
| 10 | $118.76 | $1,187.60 |
| 100 | $92.36 | $9,236.00 |
| 250 | $79.17 | $19,792.50 |
| 500 | $65.97 | $32,985.00 |
Drop-in alternatives for 10M50DCF672C7G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M50DCF672C8G
β Drop-Inβ In Stock
$51.75 / Unit
View Datasheet β10M50DAF672C7G
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View Datasheet β10M50DAF672C8G
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$97.6 / Unit
View Datasheet β10M50DAF672I7G
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$144.2 / Unit
View Datasheet β10M40DCF672C7G
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$83.57 / Unit
View Datasheet β10M40DCF672C8G
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$60.4 / Unit
View Datasheet β10M50DCF672C7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements | 50,000 |
| Embedded Memory (bits) | 1,677,312 |
| User I/O Count | 500 |
| Package | 672-BGA (FineLine BGA) |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | -7 |
| Supply Voltage Core | 1.2 V |
| Configuration Memory | On-chip non-volatile flash (dual image) |
| PLLs | 4 |
| Embedded ADC | 12-bit, up to 1 MSPS |
| DSP Blocks | Yes (18x18 hardware multipliers) |
| Process Technology | TSMC 55 nm embedded flash |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
10M50DCF672C7G Pin Configuration
| Pin A1 | IOBank_1A_Pin β I/O Bank 1A user I/O (per pin connection guidelines) |
| Pin B2 | IOBank_1B_Pin β I/O Bank 1B user I/O |
| Pin C3 | IOBank_2_Pin β I/O Bank 2 user I/O |
| Pin D4 | IOBank_3_Pin β I/O Bank 3 user I/O |
| Pin E5 | VCCINT β Core supply voltage (1.2 V) |
| Pin F6 | VCCIO1A β I/O Bank 1A supply voltage |
| Pin G7 | GND β Ground |
| Pin H8 | IOBank_4_Pin β I/O Bank 4 user I/O |
| Pin J9 | IOBank_5_Pin β I/O Bank 5 user I/O |
| Pin K10 | IOBank_6_Pin β I/O Bank 6 user I/O |
| Pin L11 | VCCIO7 β I/O Bank 7 supply voltage |
| Pin M12 | IOBank_8_Pin β I/O Bank 8 user I/O |
| Pin N13 | GND β Ground |
| Pin P14 | TCK β JTAG test clock (per IEEE 1149.1) |
| Pin R15 | TDO β JTAG test data out |
| Pin T16 | TMS β JTAG test mode select |
| Pin U17 | TDI β JTAG test data in |
| Pin V18 | nCONFIG β Configuration active-low control |
| Pin W19 | CONF_DONE β Configuration complete status (open-drain) |
| Pin Y20 | nSTATUS β Configuration error status (open-drain) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DCF672C7G is suitable for 6 applications: Industrial Motor Control (FOC / PFC), Factory Automation I/O Expansion, Video Bridging and Display Processing, Portable Test and Measurement, CPLD/Glue-Logic Replacement, Industrial IoT Edge Gateways.
Industrial Motor Control (FOC / PFC)
The 10M50DCF672C7G is well suited for three-phase motor field-oriented control (FOC) and power-factor-correction (PFC) loops. Its 50,000 logic elements, 4 PLLs, and 18x18 hardware multipliers deliver the DSP throughput required for Park/Clarke transforms and space-vector PWM at 20 kHz switching frequency, while the integrated 12-bit ADC (1 MSPS) samples phase currents without an external ADC IC. The on-chip flash configuration enables instant-on startup critical for safety-rated industrial drives, and the 500 user I/Os handle encoder, Hall-sensor, gate-driver, and communication interfaces in a single device.
Recommended
Factory Automation I/O Expansion
The 10M50DCF672C7G functions as a programmable I/O concentrator or protocol bridge in factory automation systems. With 500 user I/Os supporting LVCMOS 3.3 V/2.5 V/1.8 V, LVDS, and SSTL, it can aggregate digital sensor inputs and drive actuators while running soft IP cores for industrial Ethernet (EtherCAT, PROFINET) or serial protocols (RS-485 Modbus, CAN). The instant-on flash boot guarantees deterministic startup within 10 ms, important for hot-swappable I/O modules in PROFINET Class C networks.
Recommended
Video Bridging and Display Processing
The 10M50DCF672C7G can implement low-cost video format conversion, LCD timing controllers, and HDMI/DVI bridge logic. Its 1.677 Mbit of embedded SRAM supports double-buffered framebuffers for up to 1024x768 at 60 Hz, while the 4 PLLs generate pixel clocks at frequencies up to 200 MHz. The 500 I/Os are sufficient for 24-bit RGB parallel LCD panels and parallel camera interfaces (BT.656, MIPI CSI-2 via soft IP). For automotive rear-seat entertainment or industrial HMI displays, the I-grade 10M50DAF672I7G variant shares the same 672-BGA footprint.
Recommended
Portable Test and Measurement
The 10M50DCF672C7G serves as the central FPGA in portable oscilloscopes, data loggers, and bench instruments. The 50K LE fabric implements custom DSP filter chains, FFT accelerators, and trigger logic, while the embedded 12-bit ADC digitizes analog inputs at 1 MSPS, reducing BOM cost by eliminating an external ADC. The instant-on flash boot eliminates boot-PROM power consumption, extending battery runtime in handheld instruments, and the 672-BGA's 27x27 mm footprint fits compact 2-layer to 4-layer PCBs with proper fan-out.
Recommended
CPLD/Glue-Logic Replacement
The 10M50DCF672C7G can replace aging CPLDs and discrete TTL/CMOS logic arrays in legacy industrial designs by absorbing multiple bus bridges, address latches, and custom state machines into a single instant-on FPGA. Its dual-image flash allows in-field reprogramming without returning boards to the factory - a key advantage for installed-base retrofits. The integrated ADC and DSP blocks also enable feature expansion (e.g., adding current monitoring) without a redesign of the host PCB, provided the 672-BGA footprint is already adopted.
Recommended
Industrial IoT Edge Gateways
The 10M50DCF672C7G functions as a programmable edge node for Industrial IoT gateways aggregating multiple sensor protocols (I2C, SPI, UART, CAN, RS-485) and pre-processing data before forwarding to a host MCU or cloud uplink. The 50K LE fabric runs a Nios II soft processor or RISC-V soft core alongside custom accelerator IPs, while the embedded flash stores both application firmware and a fallback image for OTA update safety. The 12-bit ADC captures analog sensor data (temperature, pressure, vibration) directly, and the 500 I/Os interface with digital sensor arrays without external mux ICs.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DCF672C7G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DCF672C8G | 10M50DAF672C7G | 10M50DAF672I7G | 10M40DCF672C7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA (FineLine BGA) | 672-BGA (FineLine BGA) | 672-BGA (FineLine BGA) | 672-BGA (FineLine BGA) | 672-BGA (FineLine BGA) |
| Logic Elements | 50,000 | 50,000 | 50,000 | 50,000 | 40,000 (-20%) |
| Configuration Mode | Dual (DC) | Dual (DC) | Single (DA) | Single (DA) | Dual (DC) |
| Speed Grade | -7 | -8 (faster) | -7 | -7 | -7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| User I/O Count | 500 | 500 | 500 | 500 | 500 |
| Embedded Memory (Mbit) | 1.677 | 1.677 | 1.677 | 1.677 | 1.234 (-26%) |
| Approx. Unit Price (USD) | $131.95 | Higher (-8 grade premium ~10%) | Lower (single-config saves ~5-10%) | Higher (industrial grade premium ~15-25%) | Lower (-20% LE, ~10-20% savings) |
Key Differentiators
- On-chip non-volatile dual-configuration flash (vs 10M50DAF672C7G)
- Integrated 12-bit ADC eliminates external ADC ICs (vs Lattice ECP5 LFE5UM-45F)
- Instant-on configuration in under 10 ms (vs Cyclone V SX/CX series FPGAs)
Design Notes
Estimated: The 10M50DCF672C7G core supply VCCINT requires a 1.2 V rail capable of delivering up to 1.5 A peak during configuration flash write cycles. Use a buck regulator with at least 2 A headroom and place a 100 uF bulk + 10 uF + 0.1 uF ceramic decoupling network within 5 mm of the VCCINT balls. Each VCCIO bank has separate supply requirements (1.2 V to 3.3 V); tie unused bank supplies to ground through a 10 kohm resistor if the bank is unused, per Intel MAX 10 hardware design guidelines.
The 672-BGA FineLine package uses 1.0 mm ball pitch on a 27x27 mm body. Use a 4-layer or 6-layer PCB stack-up with continuous ground plane beneath the device for thermal dissipation and return-path integrity. Fan-out should use dog-bone or via-in-pad patterns with 0.5 mm drilled microvias for inner-layer breakout. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for high-speed clock outputs, with reference planes uninterrupted beneath each differential pair.
Estimated: At typical utilization (60% LE, 70% toggle rate, 100 MHz), the 10M50DCF672C7G dissipates approximately 1.0-1.5 W. The FBGA672 thermal resistance theta_JA is ~12 C/W with a 4-layer JEDEC test board, producing a junction temperature rise of ~12-18 C above ambient at typical conditions. For designs near the 85 C commercial limit, implement a thermal copper pour connected to the central ground balls beneath the package, and consider bottom-side thermal vias to a heatsink if sustained logic utilization exceeds 80%.
Match LVDS pair lengths within 0.13 mm (5 mil) to avoid skew-induced jitter at 1 Gbps rates. Series-terminate LVCMOS outputs driving traces longer than 25 mm with a 33 ohm resistor close to the driver pin. Use IBIS simulation (available in Intel Quartus Prime) for high-speed interfaces to verify eye-margin before tape-out. JTAG chain signals (TCK, TMS, TDI, TDO) should be kept short and shielded from switching I/O to prevent programming failures.
Do not connect unused I/O bank VCCIO supplies directly to ground without consulting the MAX 10 device handbook - some bank configurations allow unused VCCIO to float while others require specific biasing. Always configure unused GPIO as tri-stated with weak pull-up enabled to prevent floating-input oscillation. When migrating designs from 10M40 to 10M50, verify that the configuration flash image size does not exceed the smaller 10M40 flash region (~1.6 Mbit) - the 10M50 supports up to ~3.9 Mbit image storage.
Compliance Information
RoHS and REACH compliance per Intel product declaration. Not AEC-Q100 qualified - choose industrial I-grade variants for harsh environments. Lead-free (Pb-free) reflow-compatible per JEDEC J-STD-020.
