5CGXBC9E7F31C8N - Cyclone V GX FPGA 301K LE, 6x 3.125G | Intel
料号： 5CGXBC9E7F31C8N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $382.5 | $3,825.00 |
| 100 | $340 | $34,000.00 |
| 250 | $318.75 | $79,687.50 |
| 500 | $297.5 | $148,750.00 |
5CGXBC9E7F31C8N 概述
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that lets designers configure millions of logic gates, dedicated DSP blocks, embedded RAM blocks, and high-speed I/O after PCB assembly. In the programmable logic hierarchy, FPGAs sit above CPLDs (smaller, non-volatile) and below ASICs (fixed-function, higher NRE cost). Cyclone V GX belongs to the cost-optimized, low-power segment of Intel's FPGA portfolio and is widely used where mid-range logic density meets integrated multi-gigabit transceivers without the cost of a Stratix-class device.
Key features include six integrated 3.125 Gbps CPRI/OBSAI/PCIe-ready transceivers, hard PCIe Gen2 x4 IP blocks, dual-configuration flash interfaces, and a Hard Memory Controller supporting DDR2/DDR3/LPDDR2. Peripherals include four PLLs, 16 global clock networks, and the Configuration via Protocol (CvP) feature for partial reconfiguration over PCIe. The 896-pin FBGA package uses Intel's 1.0mm-pitch land pattern.
Typical applications include industrial motor control, video surveillance IP cameras, broadcast video switching, low-cost PCIe endpoint cards, wireless backhaul, and factory automation. The integrated transceivers eliminate external SERDES ICs, reducing BOM and simplifying board layout for protocols such as Gigabit Ethernet, SDI video, and CPRI for small-cell base stations.
When designing with the 5CGXBC9E7F31C8N, ensure the 1.1V core rail is sequenced after the 2.5V/3.3V VCCIO supplies; violations of power-on order can cause latch-up. Use Intel's Quartus Prime design suite (free Lite or subscription Standard) for synthesis, place-and-route, and bitstream generation.
This page synthesizes real-time distributor pricing, qualified drop-in alternatives, and applied engineering design notes that supplement the manufacturer datasheet with field-tested context for sourcing and board bring-up.
直接替换替代料： 5CGXBC9E7F31C8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CGXBC9E7F31C8N （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Transceivers, Logic Elements, DSP Blocks (18x18).
快速对比工具——选择替代料号进行并排对比：
5CGXBC9E6F31C7N
✅ 直接替换✓ 有现货
$348 / 个
查看数据手册 →5CGXBC9E7F31I7N
✅ 直接替换📋 参考替代料（不在目录中）
5CGXBC9D7F27C8N
✅ 直接替换✓ 有现货
$370 / 个
查看数据手册 →5CGXBC9E7F31C8N 最大额定值与电气特性
| Family | Cyclone V GX |
| Logic Elements | 301,000 |
| Adaptive Logic Modules (ALMs) | 113,560 |
| Embedded Memory Bits | 14,251,008 (approx. 13.6 Mbit) |
| DSP Blocks (18x18) | 480 |
| Maximum User I/O Pins | 480 |
| Transceivers | 6 channels up to 3.125 Gbps |
| Transceiver Protocols | PCIe Gen2, CPRI, OBSAI, GbE, SDI |
| Hard PCIe Controllers | 2 (x4/x4 or x8) |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Hard Memory Controller | DDR2/DDR3/LPDDR2 (soft IP) |
| Process Technology | TSMC 28nm low-power |
| Core Voltage | 1.1 V |
| 封装 | 896-pin FBGA (F31), 1.0 mm pitch |
| 工作温度 | 0C to +85C (commercial) |
| Configuration Mode | AS, PS, FPP, CvP (PCIe) |
| RoHS 状态 | Compliant |
5CGXBC9E7F31C8N 896-pin fbga (f31), 1.0 mm pitch 引脚配置指南
5CGXBC9E7F31C8N（896-pin fbga (f31), 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CGXBC9E7F31C8N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CGXBC9E7F31C8N 适用于 6 应用s: Industrial Motor Control, Video Surveillance IP Camera, Broadcast Video Routing Switcher, Low-Cost PCIe Endpoint Card, Wireless Small-Cell Backhaul, Factory Automation Controller.
Industrial Motor Control
The 5CGXBC9E7F31C8N fits industrial motor control because its 480 DSP blocks run field-oriented control (FOC) loops at >100 kHz switching frequency with sub-microsecond latency. The 6 transceivers handle multi-axis encoder feedback (EnDat 2.2, BiSS, Tamagawa) over RS-485/Ethernet without external SERDES. The 28nm low-power process keeps FPGA power under 5W even at full DSP utilization, simplifying IEC 61800 drive thermal design.
推荐
Video Surveillance IP Camera
The 5CGXBC9E7F31C8N supports 4K UHD video pipeline (H.264/H.265 encode at 30 fps) using its 14.25 Mbit embedded memory as line buffers and 480 DSP blocks for motion estimation. The 3.125 Gbps transceivers drive HDMI 1.4 output, MIPI-CSI2 input, or GigE Vision network attachment. Its commercial temperature range and 28nm low power suit PoE-powered outdoor camera enclosures.
推荐
Broadcast Video Routing Switcher
The 5CGXBC9E7F31C8N's six 3.125 Gbps transceivers each handle SD-SDI/HD-SDI/3G-SDI serial digital video streams per SMPTE 259M/292M/424M, making the part suitable as a small-format video crosspoint router (up to 6x6 in HD-SDI). Its 301K logic elements manage ancillary data insertion, audio embedding (AES3), and switching fabric control. Quartus Prime IP cores for SDI are royalty-free with the device.
推荐
Low-Cost PCIe Endpoint Card
The 5CGXBC9E7F31C8N's two hard PCIe Gen2 controllers (x4 or x8 bifurcation) make it ideal for low-cost protocol analyzer cards, data acquisition boards, and software-defined radio (SDR) front-ends. Configuration via Protocol (CvP) allows the host CPU to load the FPGA bitstream over PCIe, eliminating a parallel flash and saving BOM. The 14.25 Mbit memory buffers DMA transfers without external SDRAM in many use cases.
推荐
Wireless Small-Cell Backhaul
The 5CGXBC9E7F31C8N's transceivers natively support CPRI up to 3.072 Gbps and OBSAI RP3, enabling small-cell base station baseband-to-radio digital pre-distortion (DPD) and crest-factor reduction (CFR). Its 480 DSP blocks accelerate the FFT/iFFT of LTE PHY and 5G NR PRACH detection. Low-power 28nm operation allows sealed outdoor small-cell enclosures without active cooling.
推荐
Factory Automation Controller
The 5CGXBC9E7F31C8N serves as a high-I/O EtherCAT/PROFINET master in factory automation, with 480 user I/O pins supporting multiple parallel field-bus interfaces (RS-485, CAN, SPI, parallel LVCMOS). Its 301K logic elements implement deterministic state machines and the 480 DSP blocks accelerate PID loops at 16 kHz per axis. Industrial temperature variants are available with identical F31 footprint.
推荐
推荐产品汇总
工程参考数据： 5CGXBC9E7F31C8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CGXBC9E6F31C7N | 5CGXBC9E7F31I7N |
|---|---|---|---|
| Package | FBGA-896 (F31) | FBGA-896 (F31) - same | FBGA-896 (F31) - same |
| Brand | Intel (formerly Altera) | Intel | Intel |
| Logic Elements | 301,000 | 301,000 | 301,000 |
| Speed Grade | C8 | C7 (faster, +15% price) | C8 (same speed) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Transceivers (3.125 Gbps) | 6 | 6 | 6 |
| DSP Blocks | 480 | 480 | 480 |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits |
| Hard PCIe Gen2 Controllers | 2 (x4/x4 or x8) | 2 (x4/x4 or x8) | 2 (x4/x4 or x8) |
| Approx. Single-Unit Price (USD) | $425 | $489 (C7 premium) | $445 (industrial premium) |
关键差异点
- Highest-density 6-transceiver Cyclone V GX with hard PCIe （对比 5CGXBC7D7F31C8N)
- 6 transceivers vs 4 in smaller F23 packages （对比 5CGXBC9C7F23C8N)
- Hard PCIe Gen2 IP blocks vs soft PCIe （对比 Lattice ECP5 LFE5UM-95)
设计说明
The 5CGXBC9E7F31C8N requires four power rails: VCC (1.1V core), VCCPD (2.5V or 3.3V configuration), VCCIO (1.2V-3.3V I/O banks), and VCCA_PLL/VCCR_PLL/VCCP (2.5V for transceivers/PLLs). Power-on sequence is critical: VCCPD must rise before or simultaneously with VCC, and VCCA must precede VCCR. Use the Altera PowerTree Designer tool to size decoupling - typical decoupling is 100uF bulk + 10uF + 1uF + 0.1uF per bank, per Intel's Cyclone V Hardware Design Guidelines. Estimated: at 80% logic utilization with 6 active transceivers at 3.125 Gbps, total power is approximately 3.5-4.5W requiring 4-layer PCB with 1oz copper.
The 896-pin F31 FBGA has a theta_JA of approximately 12-15 C/W with a 4-layer JEDEC test PCB. At 4W total power, junction temperature rise is ~60C above ambient. Place thermal vias in a 4x4 array directly under the package center thermal pad to the inner ground plane. For commercial-grade parts (this MPN, 0C to +85C), no heatsink is required at <5W; for industrial-grade (5CGXBC9E7F31I7N), heatsink is recommended above 3W. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet before PCB layout to confirm thermal margin.
Use Intel's Cyclone V F31 symbol and footprint from the Quartus Prime pin planner (or download the Altium/Cadence library from intel.com). The 896-ball FBGA uses a 1.0mm pitch - route signals on a 4-layer board with 0.8mm drilled micro-vias (stacked or staggered). Place the EPCQ-L configuration flash within 50mm of the FPGA's DCLK/DATA/nCS pins to avoid signal integrity issues; use AS (Active Serial) mode for single-flask boot. Per Intel's PCB layout guidelines, maintain 100-ohm differential impedance on transceiver pairs (TX/RX) and avoid right-angle bends in MGT traces.
Common mistakes with the 5CGXBC9E7F31C8N: (1) Connecting all VCCIO banks to 3.3V when LVDS or 1.8V interfaces require dedicated bank voltages - each bank can have its own VCCIO; (2) Omitting the external MSEL[3:0] pull-up/pull-down resistors - these set configuration mode and must match the chosen boot mode (AS=010, FPP=000, PS=110); (3) Driving nCONFIG low during power-up for a 'clean' reset - this can cause boot failure; instead use the nSTATUS pin for status polling. Always verify configuration timing with the Intel Configuration Device Handbook before prototype build.
合规信息
RoHS and REACH compliant per Intel product page. AEC-Q100 does not apply - this is a commercial-grade FPGA, not an automotive-grade IC. For automotive applications, Intel recommends the Cyclone V GT automotive-grade family.
