5CEFA9F27C7N - Cyclone V E FPGA 301K LE | Intel | FBGA-672
料号： 5CEFA9F27C7N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $325 | $162,500.00 |
| 1,000 | $295 | $295,000.00 |
5CEFA9F27C7N 概述
Cyclone V E FPGAs belong to the broader family of low-power, cost-optimized programmable logic devices. Positioned in the hierarchy as FPGA -> programmable logic -> logic IC -> integrated circuit, Cyclone V E devices target cost-sensitive, high-volume applications requiring substantial logic density without the power and cost burden of high-end FPGAs. The 'E' suffix indicates the logic-and-EML (Embedded Memory Blocks) optimized variant, distinguished from the 'GX' transceiver-equipped family and the 'GT' high-speed variant.
Key features of the 5CEFA9F27C7N include 301,000 logic elements, 14.25 Mbits of embedded memory, 336 GPIOs supporting multiple I/O standards (LVDS, LVCMOS, SSTL), integrated PLLs, and hard memory controller blocks. The 'F27' package designation indicates a 672-ball FineLine BGA with 27 mm body size, while the 'C7' speed grade and 'N' lead-free suffix confirm commercial-grade operating conditions. Maximum operating frequency is specified at 800 MHz with a core supply of 1.13 V.
Architecturally, the device leverages a 28 nm TSMC low-power process with Adaptive Logic Modules (ALMs) and variable-precision DSP blocks. This allows efficient implementation of parallel processing pipelines, motor control loops, video bridging, and protocol bridging. Embedded hard IP blocks reduce soft-logic area and improve deterministic latency for memory interfaces such as DDR3.
Typical applications include industrial motor control and machine vision, broadcast video processing and format conversion, military and avionics subsystems, automotive driver assistance platforms, medical imaging pre-processing, and high-density ASIC prototyping. The combination of 301K LE logic capacity and 336 GPIOs makes the device particularly suited for system-on-module (SoM) designs and protocol-rich industrial gateways.
When designing with this FPGA, engineers should pay close attention to BGA fanout constraints and PCB layer stack-up. The 672-ball FineLine BGA requires microvia or via-in-pad technology for reliable manufacturing. Use the Quartus Prime design software for synthesis, place-and-route, and timing closure; verify pin assignments against the device pin-out file before committing to layout.
This page synthesizes distributor pricing, drop-in Cyclone V E family alternatives, and practical design notes not found in the manufacturer datasheet. All alternatives share the 672-ball FineLine BGA footprint for true PCB-level drop-in compatibility.
直接替换替代料： 5CEFA9F27C7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CEFA9F27C7N （相同外形与封装尺寸） ——差异在于 Package, Transceivers, Family, Speed Grade, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
5CEFA9F23I7N
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →5CEFA9F27I7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CEFA9F27C8N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CEFA9F23C7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CEFA9F31I7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
5CEFA9F27C7N 最大额定值与电气特性
| Family | Cyclone V E |
| Logic Elements | 301,000 |
| Embedded Memory | 14,251,008 bits (14.25 Mbit) |
| User I/O Pins | 336 |
| Supply Voltage (Core) | 1.13 V |
| Maximum Operating Frequency | 800 MHz |
| 封装 | 672-ball FBGA (FineLine BGA) |
| Package Body Size | 27 mm (F27) |
| Speed Grade | C7 (commercial) |
| 工作温度 | 0C to +85C (commercial) |
| 安装类型 | Surface Mount (BGA) |
| Packaging | Tray (40 units per tray) |
| Lead-Free | Yes |
| RoHS 状态 | Compliant |
| Process Technology | 28 nm TSMC low-power |
5CEFA9F27C7N 27 mm (f27) 引脚配置指南
5CEFA9F27C7N（27 mm (f27) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CEFA9F27C7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CEFA9F27C7N 适用于 6 应用s: Industrial Motor Control, Machine Vision Pre-Processing, Broadcast Video Processing, ASIC Prototyping, Protocol-Rich Industrial Gateways, Medical Imaging Pre-Processing.
Industrial Motor Control
The 5CEFA9F27C7N's 301,000 logic elements deliver the parallel DSP throughput required for multi-axis field-oriented control (FOC) loops, where each axis demands high-rate Park/Clarke transforms and SVPWM generation. The 336 GPIOs comfortably accommodate 8+ encoder inputs, 16+ PWM channels, and dual-redundant CAN/EtherCAT interfaces without external muxing. Industrial motor drives benefit from the device's hard memory controller blocks driving external DDR3 for trajectory buffering. Compared to a microcontroller + DSP solution, the FPGA off-loads the control loop deterministically, freeing the MCU for supervisory and communication tasks.
推荐
Machine Vision Pre-Processing
The 5CEFA9F27C7N's 14.25 Mbits of embedded memory and 336 GPIOs enable multi-channel camera aggregation with on-FPGA Bayer-to-RGB conversion, histogram equalization, and edge detection pipelines. The 800 MHz maximum operating frequency supports real-time processing of 1080p60 streams from multiple parallel image sensors. Embedded hard IP blocks accelerate memory interfacing for frame buffer storage, and the rich LVDS I/O support handles MIPI CSI-2 deserialization via soft IP. This part is a strong fit for inspection cameras on SMT lines and pick-and-place machines where deterministic latency matters.
推荐
Broadcast Video Processing
Broadcast studios require lossless video format conversion (SDI to HDMI, 3G-SDI routing, frame-rate conversion) which the 5CEFA9F27C7N handles with 301K logic elements capable of supporting multiple parallel video pipelines. The 336 GPIOs map directly to multi-channel SDI inputs/outputs plus housekeeping interfaces. Embedded transceivers in the Cyclone V GX family are not present in this 'E' variant, so SDI SERDES is typically implemented via external chips. The part is widely used in production switchers, video walls, and broadcast format converters where cost-per-channel matters.
推荐
ASIC Prototyping
ASIC prototyping rigs benefit from the 5CEFA9F27C7N's 301K logic elements, which can host a moderate-complexity ASIC design partitioned across multiple FPGAs. The 336 GPIOs serve as chip-to-chip interconnect channels between sibling FPGAs in a multi-FPGA prototyping rack. Hard memory controllers and PLLs allow direct DDR3 attachment without wasting logic resources. Quartus Prime's incremental compilation supports rapid design bring-up and modular debugging, accelerating time-to-prototype for designs targeting 28 nm and below process nodes.
推荐
Protocol-Rich Industrial Gateways
Industrial protocol gateways (PROFINET, EtherCAT, Modbus, CAN, RS-485, OPC-UA) require simultaneous support for multiple fieldbus standards, which the 5CEFA9F27C7N's 336 GPIOs and 14.25 Mbits embedded memory comfortably handle. Each protocol stack is implemented as a soft IP core, with the FPGA's logic density accommodating three or four concurrent stacks plus protocol translation logic. Hard memory controllers enable buffering of message queues in DDR3. The commercial temperature grade suits IP65-rated control cabinet installations where ambient stays within 0C to 70C.
推荐
Medical Imaging Pre-Processing
Ultrasound and endoscopy pre-processing boards use the 5CEFA9F27C7N for high-channel-count analog-front-end digitizer aggregation, beamforming preprocessing, and JPEG2000 compression pipelines. The 301K logic elements support 64-channel beamformers, while the 336 GPIOs accommodate multi-channel LVDS links from analog front-ends. Embedded hard IP accelerates memory access for raw RF frame storage. Note: medical applications typically require industrial temperature grade, so consider the 5CEFA9F23I7N variant; this commercial-temperature part is appropriate for bench-top diagnostic equipment in controlled environments.
推荐
推荐产品汇总
工程参考数据： 5CEFA9F27C7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CEFA9F23I7N | 5CEFA9F27I7N | 5CEFA9F27C8N | 5CEFA9F23C7N | 5CEFA9F31I7N | XC6SLX150-3FGG676I |
|---|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Xilinx |
| Package | 672-ball FBGA (F27) | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F27) - same | 672-ball FBGA (F23) - smaller body | 672-ball FBGA (F31) - larger body | 676-ball FBGA - different pinout |
| Logic Elements | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 301,000 | 147,443 |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 4,824 Kbits |
| User I/Os | 336 | 336 | 336 | 336 | 336 | 336 | 338 |
| Speed Grade | C7 (commercial) | I7 (industrial) | I7 (industrial) | C8 (faster commercial) | C7 (commercial) | I7 (industrial) | -3 (industrial) |
| Operating Temperature | 0C to +85C | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C |
| Process / Family | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 28 nm / Cyclone V E | 45 nm / Spartan-6 |
关键差异点
- Highest-density Cyclone V E with 301K logic elements in 672-ball FBGA （对比 5CEFA4U19I7)
- Lower-cost Cyclone V E variant vs Xilinx Spartan-6 at similar density （对比 XC6SLX150-3FGG676I)
- Commercial temperature grade optimized for cost-sensitive deployments （对比 5CEFA9F23I7N)
设计说明
The 672-ball FineLine BGA requires microvia or via-in-pad PCB technology for reliable solder joint formation. Use a minimum 8-layer stack-up with HDI (High Density Interconnect) construction; signal layers should fan out the BGA escape pattern on the top two layers using 0.1 mm laser-drilled microvias. Estimated: assuming a 0.8 mm ball pitch and 672 balls, fanout requires roughly 40 mm x 40 mm of BGA escape area on the top signal layer. Apply NSMD (Non-Solder Mask Defined) pads with 0.4 mm diameter for reliable solder joint inspection.
Cyclone V E FPGAs in the 672-ball BGA package rely heavily on the center power/ground balls for thermal dissipation. Estimated: at 100% logic utilization with 800 MHz operation, junction-to-ambient thermal resistance (theta_JA) is approximately 12 C/W with a standard 8-layer JEDEC test board. For continuous high-utilization workloads, attach a heatsink or use forced-air cooling to keep junction temperature below 100C. The exposed center balls on the F27 package provide a thermal path; connect them to an internal ground plane with multiple thermal vias (0.3 mm drill, 1.2 mm pitch array).
The 5CEFA9F27C7N requires a multi-rail power tree: core 1.13 V (typically 2-4 A depending on utilization), auxiliary PLL supply, and configurable I/O voltages (1.2 V to 3.3 V per bank group). Use a sequence controller (such as the Intel-recommended power sequencer) to enforce core-before-I/O power-up; reverse sequencing can cause latch-up. Decoupling follows the Intel pin connection guidelines: place 0.1 uF X7R ceramics within 2 mm of every power pin, plus bulk decoupling capacitors on each supply rail. Estimated: total quiescent power for an idle configured device is approximately 0.5 W; dynamic power scales with toggle rate and can exceed 5 W at 80% utilization.
Do not skip configuration mode validation: the 5CEFA9F27C7N supports AS (Active Serial), PS (Passive Serial), FPP (Fast Passive Parallel), and JTAG configuration. Selecting the wrong mode strap on MSEL pins renders the board unbootable. Also, ensure the configuration flash (EPCS or compatible) has correct AS byteswap settings for the chosen bitstream ordering. Finally, do not rely on default Quartus pin assignments - always verify the pinout file against your schematic before board fabrication, especially for differential pairs requiring matched-length routing.
合规信息
RoHS compliant and lead-free per the N suffix in MPN. Not AEC-Q100 qualified (FPGA is not a typical automotive-qualified part); automotive designs should use Cyclone V Auto or Cyclone IV GX automotive parts. REACH compliance documentation available from Intel product environmental portal.