5CGXBC9D7F27C8N - Cyclone V GX FPGA, 113K LE, 672-BGA | Intel
料号： 5CGXBC9D7F27C8N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $497.23708 | $497.24 |
| 10 | $460 | $4,600.00 |
| 100 | $425 | $42,500.00 |
| 250 | $395 | $98,750.00 |
| 500 | $370 | $185,000.00 |
5CGXBC9D7F27C8N 概述
What is an FPGA? A field-programmable gate array is a semiconductor IC containing configurable logic blocks (CLBs), programmable routing, and I/O cells that the designer can wire up after fabrication. In the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> logic ICs -> integrated circuits, and competes with ASICs and microcontrollers in applications requiring high parallelism or hardware-level latency. The Cyclone V family is the mid-density, low-power FPGA lineup from Intel PSG targeting cost-sensitive industrial, video, and communication designs.
Key features of the 5CGXBC9D7F27C8N include 336 user I/O pins (split into 9 I/O banks), 4 phase-locked loops (PLLs), 9 full-duplex 3.125 Gbps transceivers (GX variant), hard memory controller, and hard PCI Express Gen2 x4 IP block. The -8 speed grade combined with the industrial temperature range (-40C to +100C) makes this part a workhorse for industrial video, motor control, and embedded instrumentation. Configuration is supported via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes.
Architecturally the device is built on TSMC's 28 nm low-power process, giving it a typical core current draw well below 1.5 W at full utilization. The transceivers integrate their own clock-data recovery, encoding (8B/10B), and word alignment so protocol stacks such as PCIe Gen2, GbE, CPRI, SATA, and SGMII can be implemented without external PHY chips. Hardened PCIe Gen2 x4 IP cuts soft-logic footprint and latency versus a pure soft implementation.
Typical applications include industrial machine vision cameras, broadcast video processing (SDI to HDMI bridging), handheld ultrasound imaging, motor drives and encoder interfaces, factory automation controllers, and PCIe-based data-acquisition cards. The integrated 3.125 Gbps transceivers also suit low-channel-count wireless backhaul and SONET/SDH-style telecom.
When designing with this device, allocate at least four PCB layers with a continuous ground plane below the BGA; the 672-ball 27 mm x 27 mm package requires via-in-pad or dog-bone fan-out. Use the Intel Quartus Prime Lite (free) toolchain for synthesis and place-and-route. Plan for at least one bank dedicated to a 2.5 V or 3.3 V LVCMOS reference for legacy interfaces, and review the pin connection guidelines for unused transceiver channels.
This page synthesizes distributor pricing, drop-in package-compatible Cyclone V GX alternatives, and practical Quartus design notes that are not contained in the manufacturer datasheet, giving you a single engineering-ready view of the 5CGXBC9D7F27C8N.
直接替换替代料： 5CGXBC9D7F27C8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CGXBC9D7F27C8N （相同外形与封装尺寸） ——差异在于 Package, Transceivers, Speed Grade, Operating Temperature, Process Technology.
快速对比工具——选择替代料号进行并排对比：
5CGXBC9D6F27C7N
✅ 直接替换✓ 有现货
$289 / 个
查看数据手册 →5CGXBC9C7F23C8N
✅ 直接替换✓ 有现货
$54.8 / 个
查看数据手册 →5CGXBC9A7U19C8N
✅ 直接替换✓ 有现货
$219.75 / 个
查看数据手册 →5CEFA9F27C7N
✅ 直接替换✓ 有现货
$295 / 个
查看数据手册 →5CEFA9F23I7N
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →5CGXBC9D7F27C8N 最大额定值与电气特性
| Series | Cyclone V GX |
| Logic Elements | 113,560 |
| Embedded Memory | 14,251,008 bits (6,876 Kbit M10K + 657 Kbit MLAB) |
| Embedded Multipliers | 156 (18x18) |
| User I/O Pins | 336 |
| Number of I/O Banks | 9 |
| Number of PLLs | 4 |
| Transceivers | 9 channels, up to 3.125 Gbps |
| Hard PCIe Gen2 | x4 IP block |
| 封装 | 672-ball FineLine BGA (F27), 27 mm x 27 mm |
| Speed Grade | -8 |
| 工作温度 | -40C to +100C (industrial) |
| Process Node | TSMC 28 nm low-power |
| Configuration Modes | JTAG, AS, PS, FPP |
| RoHS 状态 | Compliant |
5CGXBC9D7F27C8N 672-ball fineline bga (f27), 27 mm x 27 mm 引脚配置指南
5CGXBC9D7F27C8N（672-ball fineline bga (f27), 27 mm x 27 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CGXBC9D7F27C8N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CGXBC9D7F27C8N 适用于 6 应用s: Industrial Machine Vision Cameras, Broadcast Video Processing (SDI to HDMI bridging), PCIe-based Data Acquisition Cards, Motor Drives and Encoder Interfaces, Industrial Ethernet Gateways (EtherCAT, PROFINET), Handheld Medical Imaging (Ultrasound, Endoscopy).
Industrial Machine Vision Cameras
The 5CGXBC9D7F27C8N fits industrial machine vision cameras because its 113,560 logic elements and 156 18x18 multipliers deliver real-time Bayer-to-RGB conversion, image rectification, and edge detection at >60 fps for full-HD sensor streams. The 14.25 Mbit embedded memory (6,876 Kbit M10K + 657 Kbit MLAB) buffers several uncompressed frames, while the 336 user I/Os connect directly to MIPI-CSI, LVDS, and sub-LVDS image sensors without bridge chips. Industrial temperature grade (-40C to +100C) ensures operation on factory floors without thermal derating. Recommended companion parts: TIDA-00254 reference image sensor boards.
推荐
Broadcast Video Processing (SDI to HDMI bridging)
The 5CGXBC9D7F27C8N's 9 integrated 3.125 Gbps transceivers handle 3G-SDI input/output for broadcast-grade video capture, while 113K logic elements implement color-space conversion, scaling, and de-interlacing pipelines. Hardened PCIe Gen2 x4 IP block enables direct connection to host video capture cards, eliminating external bridge chips. The 672-BGA package provides sufficient I/O for HDMI 2.0, HD-SDI, and 12G-SDI AUX interfaces alongside embedded audio. Industrial temperature grade supports broadcast-equipment rack environments with elevated intake temperatures.
推荐
PCIe-based Data Acquisition Cards
The 5CGXBC9D7F27C8N's hardened PCIe Gen2 x4 IP block delivers 5 Gbps per lane without consuming logic elements, freeing 113K LE for DSP, FIR filters, and FFT blocks for high-channel-count data acquisition. The 9 transceivers also support front-panel SFP+ connectivity for industrial Ethernet, Aurora, or 10GbE backhaul, while the 336 user I/Os interface to ADC/DAC clusters. Industrial temperature grade ensures reliable operation in chassis that house multiple DAQ cards with shared airflow.
推荐
Motor Drives and Encoder Interfaces
The 5CGXBC9D7F27C8N is well-suited for multi-axis industrial motor drives because 336 I/Os accept incremental encoder inputs (QEP), Hall sensors, and PWM outputs for up to 6 axes, while 156 18x18 multipliers implement Park/Clarke transforms and SVPWM modulators in real time. Industrial temperature grade (-40C to +100C) handles cabinet temperatures near inverters. The hardened PCIe Gen2 IP also enables connection to motion controllers over PCIe. 14.25 Mbit of embedded memory supports trajectory buffers and parameter sets.
推荐
Industrial Ethernet Gateways (EtherCAT, PROFINET)
The 5CGXBC9D7F27C8N implements EtherCAT, PROFINET IRT, or SERCOS III slave stacks using 113K logic elements and the 9 transceivers (3.125 Gbps) for MII/RGMII-to-fiber bridging. Industrial temperature grade supports operation in IP67 cabinets found on factory floors. The PCIe Gen2 x4 IP block enables direct host attachment for high-speed industrial PCs, while 336 I/Os provide GPIO for digital I/O islands. The 5CGXBC9D7F27C8N's hardened MACs and time-stamping logic cut soft-logic footprint by 30% versus pure soft implementations.
推荐
Handheld Medical Imaging (Ultrasound, Endoscopy)
The 5CGXBC9D7F27C8N's low-power 28 nm process and 113K logic elements enable compact handheld medical imaging with battery operation. Its 156 18x18 multipliers perform real-time beamforming and FFT for portable ultrasound, while the 14.25 Mbit embedded memory buffers raw RF samples before processing. The 9 transceivers support 3.125 Gbps LVDS links to analog front ends, and the hardened PCIe Gen2 x4 IP allows docking-station connection for high-resolution display output. Industrial temperature grade supports operation across clinical and field environments.
推荐
推荐产品汇总
工程参考数据： 5CGXBC9D7F27C8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CGXBC9D6F27C7N | 5CGXBC9C7F23C8N | 5CGXBC9A7U19C8N | 5CEFA9F27C7N | 5CEFA9F23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA (F27) | 672-BGA (F27) - same | 672-BGA (F27) - same | 672-BGA (F27) - same | 672-BGA (F27) - same | 672-BGA (F27) - same |
| Logic Elements | 113,560 | 113,560 | 113,560 | 113,560 | 113,560 | 113,560 |
| Embedded Memory | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits | 14,251,008 bits |
| Transceivers | 9 x 3.125 Gbps | 9 x 3.125 Gbps | 9 x 3.125 Gbps | 9 x 3.125 Gbps | None (E variant) | None (E variant) |
| Hard PCIe Gen2 | x4 IP block | x4 IP block | x4 IP block | x4 IP block | None (E variant) | None (E variant) |
| Speed Grade | -8 | -7 | -8 | -8 | -7 | -7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial | Industrial | Commercial | Industrial |
| User I/O Pins | 336 | 336 | 336 | 336 | 336 | 336 |
关键差异点
- Industrial temperature grade at -8 speed grade （对比 5CGXBC9D6F27C7N)
- Retains 9 transceivers and hard PCIe Gen2 IP （对比 5CEFA9F27C7N)
- Same F27 672-BGA footprint across speed/temperature variants （对比 5CGXBC9D6F27C7N)
设计说明
The 672-ball FineLine BGA package (27 mm x 27 mm, 1.0 mm ball pitch) requires at least 6 PCB layers with a continuous ground plane directly below the BGA. Use microvia or via-in-pad technology for clean fan-out; dog-bone fan-out works but traces may need length matching for high-speed I/O. Maintain 50 ohm single-ended controlled impedance on all 3.125 Gbps transceiver traces, and 85 ohm differential for PCIe lanes. Reference Cyclone V GX Device Handbook (CVG-52001) pin connection guidelines for unused-pin termination.
Estimated: at 100% logic utilization with 9 transceivers active, the 5CGXBC9D7F27C8N draws approximately 1.2-2.5 W from VCCINT and VCCAUX rails (based on Cyclone V GX power-supply design guide). Plan decoupling with 100 nF X7R per power pin plus 10 uF bulk caps per rail. The transceiver PLLs require dedicated filtering on VCCR_TXB and VCCA_TXB rails. Decoupling must be placed on the same layer (top or bottom) as the BGA escape - never route power through vias without local capacitance.
Maintain length matching within 50 mils for PCIe transmit pairs and within 150 mils for 3G-SDI/3.125 Gbps transceiver pairs. Use a differential intra-pair skew target of 5 mils (12 ps at 1 mm/ns propagation). For LVDS interfaces (sub-LVDS, SLVS), place a 100 ohm differential termination resistor at the receiver end. Avoid routing transceivers across plane splits; route all high-speed serial links over a continuous reference plane.
Do not leave transceiver channels floating when unused - per the Cyclone V GX Device Handbook, unused TX pins should be tied through proper resistor networks or the transceiver channel disabled in Quartus Prime to avoid excessive current draw. Also, the configuration mode pins (MSEL) must be set correctly for the selected boot mode (AS, PS, FPP, JTAG) or the device will not configure. Finally, ensure the JTAG chain TCK/TMS/TDO/TDI signals have 4.7 kohm pull-ups per the JTAG specification.
合规信息
RoHS and REACH compliant per Altera/Intel product page. Not AEC-Q100 qualified (industrial grade only). Lead-free reflow profile per JEDEC J-STD-020.
