5CSEBA5U19C6N - Cyclone V SE SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
料号： 5CSEBA5U19C6N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $172.89 | $172.89 |
| 10 | $158.5 | $1,585.00 |
| 100 | $142.75 | $14,275.00 |
| 500 | $128.4 | $64,200.00 |
| 1,000 | $118.2 | $118,200.00 |
5CSEBA5U19C6N 概述
An SoC FPGA combines a programmable logic fabric with one or more hard processor cores on a single die, enabling deterministic hardware acceleration alongside software flexibility. In the taxonomy of embedded computing devices, the 5CSEBA5U19C6N belongs to the SoC FPGA family, which sits between pure microcontrollers and pure ASICs in the embedded design hierarchy. Cyclone V SE devices in particular target low-power, cost-sensitive applications that still demand FPGA-based I/O flexibility and DSP throughput.
Key features of this device include 85K programmable logic elements, approximately 4,450 Kbits of embedded memory, 87 variable-precision DSP blocks, integrated dual ARM Cortex-A9 cores with NEON media engine and single/double-precision FPU, and a rich set of peripherals including CAN, USB OTG, Gigabit Ethernet, DDR3 controller, and PCIe Gen2. The device is fabricated on TSMC's 28 nm low-power process and supports commercial temperature grades with multiple speed grades.
Architecturally, the device is split into an HPS (Hard Processor System) domain and an FPGA fabric domain connected by high-bandwidth AXI bridges, allowing software running on the ARM cores to configure and exchange data with custom FPGA logic at multi-gigabit rates. The fabric includes 8 fractional PLLs and up to 364 general-purpose I/O pins.
Typical applications include industrial motor control, factory automation HMIs, broadcast video processing, software-defined radio front-ends, machine vision pre-processing, and embedded vision systems. The Cyclone V SE family is widely used wherever a low-power ARM host must tightly couple to custom hardware accelerators.
When designing with this device, allocate at least 15% of LE resources for fabric-to-HPS AXI bridge logic and reserve dedicated HPS clock and DDR pins per the device handbook pin connection guidelines to avoid signal-integrity issues on the processor memory interface.
This page synthesizes distributor pricing, same-brand drop-in Cyclone V SoC alternatives, and practical design notes for the 5CSEBA5U19C6N that complement the Intel Cyclone V Device Handbook.
直接替换替代料： 5CSEBA5U19C6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CSEBA5U19C6N （相同外形与封装尺寸） ——差异在于 Package, Logic Elements, DSP Blocks, Operating Temperature, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
5CSEBA5U19A7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$152.4 / 个
查看数据手册 →5CSEBA5U19I7N
✅ 直接替换✓ 有现货
$119.85 / 个
查看数据手册 →5CSEBA6U19C6N
✅ 直接替换✓ 有现货
$194.15 / 个
查看数据手册 →5CSEBA4U19C6N
✅ 直接替换✓ 有现货
$74.5 / 个
查看数据手册 →5CSEBA4U19I7N
✅ 直接替换✓ 有现货
$72 / 个
查看数据手册 →5CSEBA5U19C6N 最大额定值与电气特性
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 85K |
| Hard Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 925 MHz |
| 封装 | 484-UBGA (19x19 mm) |
| Process Technology | 28 nm low-power |
| Embedded Memory | Approximately 4,450 Kbits (per family datasheet) |
| DSP Blocks | 87 variable-precision |
| PLLs | 8 fractional |
| Maximum User I/O | 364 (per family datasheet) |
| Peripherals | CAN, USB OTG, Gigabit Ethernet, DDR3 controller, PCIe Gen2, I2C, SPI, UART |
| 工作温度 | Commercial (0C to +85C) per C6 speed/temp code |
| Speed Grade | C6 |
| RoHS 状态 | Compliant (per Altera product page) |
| 安装类型 | Surface Mount (BGA) |
5CSEBA5U19C6N 484-ubga (19x19 mm) 引脚配置指南
5CSEBA5U19C6N（484-ubga (19x19 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CSEBA5U19C6N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CSEBA5U19C6N 适用于 6 应用s: Industrial Motor Control and Drive, Software-Defined Radio Baseband, Machine Vision and Embedded Vision, Broadcast Video Processing, Industrial HMI and IoT Gateways, Aerospace and Avionics Subsystems.
Industrial Motor Control and Drive
The 5CSEBA5U19C6N fits industrial motor control because its dual ARM Cortex-A9 HPS at 925 MHz runs motion-control loops and field-oriented control software, while the 85K LE FPGA fabric implements hardware-accelerated PWM, encoder feedback capture, and sigma-delta modulator interfaces. Compared with a discrete MCU plus CPLD partition, the integrated HPS-to-fabric AXI bridges remove a parallel bus and reduce BOM by one IC. The 87 variable-precision DSP blocks provide headroom for sine/cosine and Park/Clarke transforms in real time, and the 28 nm low-power process keeps the SoC below typical multi-axis drive thermal budgets without active heatsinking.
推荐
Software-Defined Radio Baseband
The 5CSEBA5U19C6N suits SDR baseband designs because the FPGA fabric executes parallel multiply-accumulate chains for digital down-conversion, channelization, and demodulation at line rate, while the dual ARM Cortex-A9 cores handle stack processing and MAC-layer software. The 87 variable-precision DSP blocks deliver the required FIR and FFT throughput for sub-6 GHz waveforms, and the integrated DDR3 controller provides high-bandwidth sample buffering without an external memory bridge. Per the Cyclone V Device Handbook, the HPS PCIe Gen2 endpoint enables direct attachment to a host modem card.
推荐
Machine Vision and Embedded Vision
The 5CSEBA5U19C6N is well matched to machine vision pipelines because the FPGA fabric performs pixel-level preprocessing such as color space conversion, filtering, and feature extraction at MIPI or parallel camera sensor rates, offloading the dual ARM Cortex-A9 cores to higher-level inference and orchestration tasks. The integrated DDR3 controller buffers frame data without an external memory bridge, and the 8 fractional PLLs generate the precise pixel-clock trees required by modern image sensors. Compared with a CPU-only vision box, the SoC FPGA reduces latency by an order of magnitude while keeping power below 10 W typical for fanless embedded housings.
推荐
Broadcast Video Processing
The 5CSEBA5U19C6N targets broadcast video processing because the FPGA fabric handles real-time SDI de/embedding, scaling, alpha blending, and color management at 3G-SDI line rates, while the HPS runs control-plane software for ancillary data and network management. The 87 DSP blocks accelerate chroma resampling and motion-adaptive deinterlacing with deterministic latency, which is critical for broadcast compliance. The 28 nm low-power process lets the SoC sit in a 1U rack frame without active cooling, and the integrated Gigabit Ethernet and USB OTG simplify ingest and monitoring connectivity.
推荐
Industrial HMI and IoT Gateways
The 5CSEBA5U19C6N is a strong fit for industrial HMI and IoT gateway applications because the dual ARM Cortex-A9 HPS runs Linux with Qt or Web-based HMIs at 925 MHz, while the FPGA fabric implements custom high-speed industrial protocols such as EtherCAT, PROFINET IRT, or serial fieldbuses in deterministic hardware. The integrated CAN, USB OTG, and Gigabit Ethernet peripherals reduce external bridge ICs, and the 364 maximum user I/Os provide ample headroom for multi-port fieldbus connectivity. The 28 nm low-power process keeps the SoC within fanless enclosure thermal limits for DIN-rail mounted gateways.
推荐
Aerospace and Avionics Subsystems
The 5CSEBA5U19C6N suits aerospace and avionics subsystems where deterministic FPGA fabric implements ARINC 429, MIL-STD-1553, or custom sensor interfaces in parallel, while the dual ARM Cortex-A9 HPS runs DO-178C certifiable application software with separation from the I/O fabric. The 85K LE budget supports multiple redundant databus channels, and the 87 DSP blocks handle vibration-spectrum analysis for HUMS applications. According to the Cyclone V Device Handbook, the HPS Cortex-A9 subsystem provides memory protection and a watchdog timer appropriate for safety-critical software partitioning.
推荐
推荐产品汇总
工程参考数据： 5CSEBA5U19C6N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CSEBA5U19A7N | 5CSEBA5U19I7N | 5CSEBA6U19C6N | 5CSEBA4U19C6N | 5CSEBA4U19I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA U19 (19x19 mm) | 484-UBGA U19 (19x19 mm) - same | 484-UBGA U19 (19x19 mm) - same | 484-UBGA U19 (19x19 mm) - same | 484-UBGA U19 (19x19 mm) - same | 484-UBGA U19 (19x19 mm) - same |
| Logic Elements | Approximately 85K | Approximately 85K | Approximately 85K | Approximately 110K | Approximately 40K | Approximately 40K |
| Hard Processor Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Maximum HPS Clock | 925 MHz | 925 MHz (with A7 timing derate) | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| Speed Grade | C6 | A7 (slower) | I7 (industrial temp) | C6 | C6 | I7 (industrial temp) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
关键差异点
- Mid-density fabric with the same HPS as the A6 upgrade （对比 5CSEBA6U19C6N)
- Commercial temperature C6 speed grade balance （对比 5CSEBA5U19I7N)
- Same 484-UBGA U19 footprint as the entire Cyclone V SE family （对比 5CSEBA4U19C6N)
设计说明
The 484-UBGA U19 package on 5CSEBA5U19C6N requires 4 to 6 PCB layers with dedicated inner power planes for HPS core, HPS I/O, FPGA core, and FPGA I/O supplies. Per the Intel Cyclone V Device Handbook, route the HPS DDR3 byte lanes with matched-length traces and a continuous reference plane on an inner layer; place the DDR3 chips within 25 mm of the HPS ball group. Use microvia-in-pad stackup if BGA pitch forces escape routing through the ball array, and follow Intel's recommended decoupling (typically 0.1 uF X7R per power pin plus 10 uF bulk per supply rail).
Estimated: at typical 28 nm Cyclone V SE junction-to-ambient thermal resistance (theta_JA approximately 15 C/W for a JEDEC 4-layer test board with minimal copper), a power dissipation of 5 W produces about a 75 C junction temperature rise above ambient. For sealed industrial enclosures at +60 C ambient, attach a small 1 C/W heatsink or apply 5 cm x 5 cm copper pour under the U19 package to keep junction temperature below +125 C. Use the Quartus Prime PowerPlay analyzer to extract per-design power before sizing thermal solution.
The HPS DDR3 controller on 5CSEBA5U19C6N supports up to DDR3-1600 with write leveling and deskew training; route all DDR3 address, command, and clock traces on an inner stripline layer with 50 ohm single-ended impedance and 100 ohm differential clocks. Fly-by DDR3 topology is recommended over T-branch for speeds above DDR3-1066. Series-stagger the DQ/DQS byte-group lengths and enforce a 5 mm maximum skew across the byte, per Micron and Intel DDR3 layout guidelines, before closing the HPS pin assignments in the Quartus Prime HPS pin mapper.
Common pitfalls on 5CSEBA5U19C6N designs include: (1) leaving HPS boot configuration pins floating - tie MSEL, BSEL, and CSEL to the correct pull resistors per the boot-mode table; (2) under-provisioning the HPS reset network, which can leave the Cortex-A9 cores in an undefined state if the warm-reset signal is not a clean open-drain; (3) forgetting to assign the dedicated HPS clock and JTAG pins, which cannot be repurposed as user I/O. Always generate the HPS pin assignments from the Quartus Prime HPS Component and lock them before PCB fab.
合规信息
RoHS and lead-free compliance confirmed from the Altera product page. REACH, halogen-free, and conflict-minerals declarations not present in the verified web data - set to unknown pending Intel product compliance letter.
