5CSEBA6U19C6N - Cyclone V SE SoC FPGA 110K LE Dual A9 | Altera
MPN: 5CSEBA6U19C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $258.9 | $258.90 |
| 10 | $245.95 | $2,459.50 |
| 100 | $226.55 | $22,655.00 |
| 500 | $210.4 | $105,200.00 |
| 1,000 | $194.15 | $194,150.00 |
Drop-in alternatives for 5CSEBA6U19C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSEBA6U19C6N Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (Intel) |
| Series | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA6 (U19 package) |
| Logic Elements | 110K |
| HPS Architecture | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Frequency | 925 MHz |
| FPGA Speed Grade | -6 (industrial) |
| Package | 484-UBGA (UBGА, 19x19 mm) |
| Pin Count | 484 |
| Process Technology | TSMC 28 nm low-power |
| User I/O | 66 (per Heisener) / configurable LVDS/LVCMOS |
| Hard IP Blocks | PCIe Gen2, multi-port memory controller, ARM Cortex-A9 HPS |
| DSP Blocks | Variable-precision DSP |
| Memory | Embedded M10K blocks |
| Operating Temperature | -40C to +100C (industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per Altera/Intel product page) |
| MSL Level | 3 (per BGA package) |
5CSEBA6U19C6N 484-ubga (ubgА, 19x19 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA6U19C6N (484-ubga (ubgА, 19x19 mm) package) with 484 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U19C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 484 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA6U19C6N is suitable for 6 applications: Industrial Machine Vision and Smart Cameras, Motor Control and Servo Drives, Programmable Logic Controllers (PLC) and Industrial I/O, Industrial Ethernet Protocol Bridging, Test and Measurement Equipment, Aerospace and Defense Avionics Subsystems.
Industrial Machine Vision and Smart Cameras
The 5CSEBA6U19C6N's Dual ARM Cortex-A9 HPS at 925 MHz runs the Linux vision stack (OpenCV, GigE Vision stack) while its 110K logic elements process Bayer-to-RGB conversion, convolution filters, and edge detection on variable-precision DSP blocks at deterministic throughput. The 484-UBGA package exposes sufficient LVDS pairs to interface directly with MIPI/Sub-LVDS/parallel image sensors without an external bridge ASIC. Estimated: at a typical 30 fps 1080p pipeline, fabric utilization stays around 50-65%, leaving headroom for analytics acceleration.
Recommended
Motor Control and Servo Drives
The 5CSEBA6U19C6N integrates the HPS for motion-control loop closure (FOC, PI, S-curve profiling) and the FPGA fabric for sub-microsecond current/voltage loop execution in hardware, outperforming pure MCU solutions. Per Cyclone V SE datasheet, the device's PWM generation, quadrature encoder decode, and resolver interface fit comfortably in 110K logic elements, with remaining logic available for EtherCAT slave IP. Estimated: a 4-axis servo using 32 kHz current loop runs at <2% fabric utilization.
Recommended
Programmable Logic Controllers (PLC) and Industrial I/O
The 5CSEBA6U19C6N serves as the central SoC in industrial PLCs, where the ARM Cortex-A9 host runs a PLC runtime (CODESYS, Beremiz) and the FPGA fabric handles high-speed digital I/O counting, pulse-train generation, and fieldbus protocol offload. According to Altera's industrial reference designs, the HPS Ethernet MAC plus FPGA-based EtherCAT slave IP fits in <30K logic elements, leaving 80K+ for application logic. The 484-UBGA package provides 66+ user I/O supporting isolated 24V industrial signaling.
Recommended
Industrial Ethernet Protocol Bridging
The 5CSEBA6U19C6N bridges between EtherCAT, PROFINET, EtherNet/IP, and Modbus TCP with simultaneous hardware-assisted protocol stacks running in FPGA logic (cut-through forwarding, distributed-clock processing) and the ARM cores managing diagnostics. Per Cyclone V SE datasheet, two soft 10/100/1000 Ethernet MACs are easily implemented in the fabric, and the HPS supplies two additional Gigabit Ethernet MACs natively. Estimated: a 4-port industrial switch fabric fits in ~40K logic elements.
Recommended
Test and Measurement Equipment
The 5CSEBA6U19C6N's HPS runs the test UI and statistical analysis in Linux while the FPGA fabric performs high-speed ADC/DAC interfacing, real-time DSP (FFT, FIR filtering), and trigger logic at deterministic latency. Per Altera reference designs, the HPS Gigabit Ethernet MAC streams post-processed data to the host at line rate. The 484-UBGA package supports high-speed LVDS for parallel ADC interface, and the PCIe Gen2 hard IP in the FPGA fabric enables streaming data to a host PC at up to 4 GB/s.
Recommended
Aerospace and Defense Avionics Subsystems
The 5CSEBA6U19C6N serves in DO-254/DO-178 friendly avionics designs where the FPGA fabric implements deterministic I/O and signal conditioning while the ARM Cortex-A9 HPS runs a DAL-C/D real-time OS for display, controls, and network stacks. According to Intel's Cyclone V SoC military-grade literature, the device's -40C to 100C industrial temperature window supports avionics bay thermal envelopes. The 28 nm low-power process provides SEU/SEL behavior suited for safety-critical designs when paired with mitigation IP.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U19C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U19A7N | 5CSEBA6U19C7N | 5CSEBA6U19I7N | 5CSEBA5U19C6N | 5CSEBA4U19C6N | 5CSEBA2U19C6N |
|---|---|---|---|---|---|---|---|
| Package | 484-UBGA (U19, 19x19 mm) | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same | 484-UBGA (U19, 19x19 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 110K | 110K | 110K | 110K | ~85K (-23%) | ~49K (-55%) | ~25K (-77%) |
| Speed Grade | -6 | -7 (faster) | -7 (faster) | -7 (faster) | -6 | -6 | -6 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to 85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) extended | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| HPS Frequency | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| HPS Architecture | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Unit Price (qty 1, USD) | 258.90 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Active | Active | Active | Active | Active | Active | Active |
Key Differentiators
- Highest logic density in the U19 package variant (vs 5CSEBA5U19C6N)
- Same-package upgrade path with -7 speed grade (vs 5CSEBA6U19C7N)
- Full industrial -40C to 100C junction temperature range (vs 5CSEBA6U19A7N)
Design Notes
Estimated: The 5CSEBA6U19C6N in the UBGА-484 (19x19 mm) package has a typical theta_JA in the 8-12 C/W range when mounted on a JEDEC 4-layer PCB with thermal vias. With worst-case industrial junction Tj of 100 C and ambient of 85 C inside an enclosure, allowable power dissipation is ~1.5 W. At full HPS + fabric utilization the device can dissipate 4-6 W, so a heatsink, heat-spreader, or forced-air cooling is required. Place thermal vias under the package center array per Cyclone V hardware design guidelines, and avoid placing the device in still-air corners of the enclosure.
Use a 6+ layer PCB with dedicated power and ground planes for the UBGА-484 package. Estimated: BGA escape routing at 0.8 mm pitch typically requires 4 routing layers with 4 mil trace/space. Place decoupling capacitors (0.1 uF + 1 uF + 10 uF) within 100 mil of every power pin, with the smallest values closest to the balls. Match the HPS DDR3 layout per Intel's EMIF pin assignment and length-matching rules; mismatched HPS memory will cause Linux boot failures that look like software bugs. Include JTAG/AS configuration header per Intel Cyclone V hardware reference.
Do not assume all UBGА-484 Cyclone V SE SoC parts are drop-in across speed grades and temperature ranges - the OPN suffix letters (A/C/I for temperature, 6/7/8 for speed) encode real parametric differences. Quartus Prime Fitter reports will close at different worst-case fMAX for each speed grade. Always re-run Timing Analyzer when substituting a -6 with a -7 or an industrial with a commercial device. Also note that older Altera-format datasheet pinout differs in pin numbering convention from the Intel-format datasheet; verify pin numbers in Quartus Pin Planner before finalizing schematic.
Compliance Information
RoHS compliance per Altera/Intel product page. AEC-Q100 not applicable for industrial FPGA - part targets industrial automation, not automotive-qualified designs. REACH, halogen-free, and conflict-mineral data not in the provided sources.
