5CSEBA6U19C8N - Cyclone V SE SoC FPGA, 110K LE, Dual A9 | Intel
料号： 5CSEBA6U19C8N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $210.5 | $52,625.00 |
| 500 | $195 | $97,500.00 |
5CSEBA6U19C8N 概述
A System-on-Chip (SoC) FPGA is an integrated circuit that combines a programmable FPGA fabric with a hard processor subsystem on a single die, enabling deterministic hardware acceleration alongside software execution. Within the broader taxonomy, this places the 5CSEBA6U19C8N at the intersection of programmable logic devices (FPGA & CPLD category), application processors, and embedded computing platforms. The Cyclone V SE family specifically targets cost-sensitive, low-power embedded applications where deterministic real-time response and parallel hardware processing are required alongside a Linux-capable application processor.
Key differentiating features include the hard dual-core ARM Cortex-A9 MPCore with CoreSight debug, an 110K-logic-element FPGA fabric for custom datapath acceleration, integrated peripherals such as Gigabit Ethernet MAC, USB 2.0 OTG, DDR3 controller, and a variable-precision DSP block set. The '8' speed grade and 'C' temperature grade indicate commercial-tier silicon characterized for typical industrial and commercial operating profiles, while the 'N' suffix denotes a Pb-free/RoHS-compliant package finish.
Architecture-wise, the device implements a coherent HPS-to-FPGA bridge via the AXI bus matrix, allowing the ARM cores to access FPGA-implemented accelerators with low latency. The 28 nm low-power process enables static power reductions compared with previous-generation Cyclone IV devices, while the 600 MHz Cortex-A9 cores deliver approximately 4000 DMIPS of aggregate processing throughput.
Typical applications include industrial motor control, factory automation gateways, video surveillance edge analytics, machine vision pre-processing, portable medical instrumentation, and embedded vision systems where an SoC FPGA consolidates CPU, DSP, and glue logic into a single chip. This page synthesizes distributor pricing, same-family drop-in alternatives drawn from XAIPART's internal MPN catalog, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： 5CSEBA6U19C8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CSEBA6U19C8N （相同外形与封装尺寸） ——差异在于 Package, Family, Series, Transceivers, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
5CSEBA6U19C7N
✅ 直接替换✓ 有现货
$155.29 / 个
查看数据手册 →5CSEBA6U19C7SN
✅ 直接替换✓ 有现货
$149.85 / 个
查看数据手册 →5CSEBA6U19C6N
✅ 直接替换✓ 有现货
$194.15 / 个
查看数据手册 →5CSEBA6U19A7N
✅ 直接替换✓ 有现货
$198.4 / 个
查看数据手册 →5CSEBA4U19C8N
✅ 直接替换✓ 有现货
$54.75 / 个
查看数据手册 →XC7Z020-1CLG484C
✅ 直接替换📋 参考替代料（不在目录中）
5CSEBA6U19C8N 最大额定值与电气特性
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock Frequency | 600 MHz |
| 封装 | 484-UBGA (19x19 mm) |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 8 |
| Lead-Free / RoHS Finish | Yes (N suffix) |
| Process Technology | 28 nm low-power |
| 安装类型 | Surface Mount (BGA) |
| Terminal Form | Ball |
| Terminal Count | 484 |
| Package Code | FBGA / UBG A |
| Package Shape | Square |
| Series | 5CSEA6 (U19) |
5CSEBA6U19C8N square 引脚配置指南
5CSEBA6U19C8N（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CSEBA6U19C8N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CSEBA6U19C8N 适用于 6 应用s: Industrial Motor Control, Factory Automation Gateways, Video Surveillance Edge Analytics, Machine Vision Pre-Processing, Portable Medical Instrumentation, Embedded Vision and ADAS.
Industrial Motor Control
The 5CSEBA6U19C8N is well suited to industrial motor drives where field-oriented control (FOC) loops demand deterministic microsecond response. Its 110K logic elements plus variable-precision DSP blocks run simultaneous current, speed, and position loops in FPGA fabric while the dual ARM Cortex-A9 HPS @ 600 MHz handles supervisory tasks, EtherCAT/MODBUS stacks, and HMI. Designers typically instantiate SVPWM, encoder decoding, and Clarke/Park transforms in hardware, offloading the HPS and achieving sub-10 microsecond torque loop times. The 28 nm low-power process keeps junction temperatures manageable inside IP65 enclosures without active cooling.
推荐
Factory Automation Gateways
Industrial gateways consolidate fieldbus (PROFINET, EtherCAT, Modbus TCP) into cloud APIs and benefit from the 5CSEBA6U19C8N's combined Linux-capable HPS and parallel processing fabric. The dual Cortex-A9 runs OPC UA, MQTT, and TLS while FPGA-implemented protocol stacks offload hard-real-time fieldbus MACs. Integrated Gigabit Ethernet MAC and DDR3 controller eliminate external bus chips. Compared with discrete CPU+FPGA solutions, this SoC integration reduces board area by ~40% and BOM cost by ~25% in typical 4-port gateway designs.
推荐
Video Surveillance Edge Analytics
The 5CSEBA6U19C8N handles multi-channel H.264/H.265 decode plus motion detection and license-plate recognition at the network edge. The 110K logic elements plus dedicated DSP blocks accelerate pixel-pipeline preprocessing (Sobel, optical flow) before passing metadata to the Cortex-A9 for higher-level analytics. DDR3 controller bandwidth handles 4-8 channels of 1080p30 without external memory. A typical 8-camera NVR uses one 5CSEBA6U19C8N plus a SATA controller, replacing a multi-ASIC solution and simplifying firmware development on a single SoC.
推荐
Machine Vision Pre-Processing
For factory-floor inspection, the 5CSEBA6U19C8N's FPGA fabric accelerates image preprocessing (Gaussian, Sobel, thresholding, morphological ops) at line rate while the ARM cores run classifier inference (TensorFlow Lite, ONNX). MIPI CSI-2 input through FPGA soft cores feeds the pipeline, and DDR3 holds frame buffers. A single SoC typically replaces a CPU + GPU + FPGA 3-board stack, reducing latency by ~5x and enabling closed-loop decisions within 1 frame interval. Industrial Camera Link and GigE Vision protocols are supported via IP cores.
推荐
Portable Medical Instrumentation
Medical devices such as ultrasound carts, patient monitors, and point-of-care diagnostics benefit from the 5CSEBA6U19C8N's low-power 28 nm process and integrated ARM+FPGA architecture. Beamforming in ultrasound uses FPGA fabric for parallel channel processing while the HPS handles DICOM, user interface, and network. Battery-powered designs leverage the deep-sleep modes of the FPGA fabric (typical <100 mW static). The commercial temperature grade suits clinical environments; medical certification (IEC 60601) is the integrator's responsibility.
推荐
Embedded Vision and ADAS
The 5CSEBA6U19C8N serves entry-level ADAS front cameras and surround-view ECUs where multiple camera inputs are preprocessed, stitched, and feature-extracted in FPGA fabric. The HPS runs object detection and lane-keeping algorithms. Automotive qualification is achieved with the 'A' grade variant (5CSEBA6U19A7N), which shares the same U19 footprint. Designers typically pair the SoC with an external ISP and external DRAM, using the integrated DDR3 controller to maintain low BOM cost.
推荐
推荐产品汇总
工程参考数据： 5CSEBA6U19C8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CSEBA6U19C7N | 5CSEBA6U19C6N | 5CSEBA6U19A7N | 5CSEBA4U19C8N | XC7Z020-1CLG484C |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | AMD |
| Package | 484-UBGA (19x19 mm) | 484-UBGA (19x19 mm) - same | 484-UBGA (19x19 mm) - same | 484-UBGA (19x19 mm) - same | 484-UBGA (19x19 mm) - same | 484-CLG BGA (19x19 mm) - same footprint, different ball map |
| Logic Elements | 110K | 110K | 110K | 110K | 85K | ~85K logic cells |
| HPS Core | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 667 MHz |
| Speed Grade | 8 | 7 | 6 | 7 | 8 | -1 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Automotive (-40C to +125C) | Commercial | Commercial |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes |
| Typical Unit Price (qty 1, USD) | 285.00 | ~245 (lower speed) | ~215 (lowest speed) | ~360 (auto grade) | ~210 (lower density) | ~225 |
关键差异点
- Highest speed grade in the 5CSEA6 family （对比 5CSEBA6U19C7N)
- Maximum logic density for the 5CSEA6 commercial part （对比 5CSEBA4U19C8N)
- Commercial temperature grade vs automotive （对比 5CSEBA6U19A7N)
设计说明
Estimated: at 1.0 V core, 110K LE utilization at 75% toggle rate, and 600 MHz HPS activity, the 5CSEBA6U19C8N dissipates roughly 3-5 W. The 484-UBGA package has a typical theta_JA of ~15 C/W with a standard 4-layer JEDEC test board, giving a junction temperature rise of 45-75 C above ambient. For sealed enclosures without airflow, add a thermal pad or copper heat spreader; ensure Tj stays below 100 C for the commercial-grade 'C' temperature variant. The 'I' industrial-grade '5CSEBA6U19I7N' variant (rated to -40C to +100C) is recommended for fanless sealed enclosures operating above 60 C ambient.
The 484-UBGA at 0.8 mm pitch requires laser-drilled microvias on the top layer for fan-out; via-in-pad is recommended for the HPS DDR3 and Gigabit Ethernet signals to maintain signal integrity. Use Intel's Cyclone V device pinout spreadsheet to assign banks: dedicate one I/O bank to DDR3 with its own VCCIO voltage (1.5 V for DDR3), and keep HPS JTAG traces under 50 mm with 50 ohm controlled impedance. Provide decoupling of 100 nF + 10 uF per VCC pin within 2 mm of the ball.
Do not confuse the HPS EMAC with the FPGA fabric EMAC - the HPS uses dedicated PHY interfaces and cannot be remapped to FPGA I/O banks. Configure boot mode pins (MSEL) early in your schematic; defaults are MSEL=010 for AS x4 fast mode. Always include a watchdog timer in HPS software to recover from lockups. For non-volatile storage, configure the QSPI boot flash as 1.8 V or 3.3 V to match the FPGA's configuration voltage - mismatch is a common bring-up failure.
合规信息
RoHS compliance confirmed by the 'N' suffix in the OPN per Intel ordering convention. AEC-Q100 qualification is NOT available on this commercial OPN - use 5CSEBA6U19A7N for automotive. REACH compliance inferred from Intel's standard product compliance declarations.
