A3P600-2FG144 - ProASIC3 FPGA, 600K Gates | Microchip
料号： A3P600-2FG144 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $34 | $3,400.00 |
| 500 | $30.6 | $15,300.00 |
| 1,000 | $27.2 | $27,200.00 |
A3P600-2FG144 概述
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the hierarchy of programmable logic devices (PLDs), above CPLDs in capacity and complexity, and are used to prototype or implement digital systems without the non-recurring engineering costs of ASICs. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash cells, allowing instant-on operation and secure, low-power designs.
Key features of the A3P600-2FG144 include 600,000 system gates, 13,824 CLBs, 97 user I/Os, and 110,592 bits of RAM. The device supports a wide range of I/O standards and includes advanced clock management with up to 6 PLLs. Its flash-based architecture provides inherent security against reverse engineering and supports single-chip, live-at-power-up operation without an external boot device.
Technically, the ProASIC3 family uses a 130-nm flash process, offering low power consumption and high reliability. The device provides 1,024 bits of FlashROM for user data, and its non-volatile configuration means no external configuration memory is required. The 144-FPBGA package measures 13x13 mm with a 1.00 mm ball pitch, enabling compact PCB designs.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics where low power, security, and instant-on capability are critical. The A3P600-2FG144 is also suitable for aerospace and defense systems requiring radiation-tolerant, flash-based FPGAs.
When designing with this device, ensure the core supply is within 1.425V to 1.575V and provide adequate decoupling on all power pins. The device is RoHS non-compliant, so verify your environmental compliance requirements before use.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P600-2FG144.
直接替换替代料： A3P600-2FG144 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3P600-2FG144 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, RoHS Status, Family, Configuration.
快速对比工具——选择替代料号进行并排对比：
A3P600-2FGG144
✅ 直接替换✓ 有现货
$30.4 / 个
查看数据手册 →A3P600-2FG144I
✅ 直接替换📋 参考替代料（不在目录中）
A3P600-2FG144II
✅ 直接替换📋 参考替代料（不在目录中）
A3P600-FG144
✅ 直接替换✓ 有现货
$15.6 / 个
查看数据手册 →A3P600-FG144I
✅ 直接替换✓ 有现货
$15.6 / 个
查看数据手册 →A3P600-FGG144
✅ 直接替换✓ 有现货
$49.8 / 个
查看数据手册 →A3P600-FGG144I
✅ 直接替换✓ 有现货
$27.2 / 个
查看数据手册 →A3P600L-1FG144I
✅ 直接替换✓ 有现货
$32.16 / 个
查看数据手册 →A3P600-2FG144 最大额定值与电气特性
| Series | ProASIC3 |
| Number of Logic Elements/Cells | 13824 CLBs |
| Total RAM Bits | 110592 bits |
| Number of I/O | 97 |
| Number of Gates | 600000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| 安装类型 | Surface Mount |
| 封装 / 外壳 | 144-LBGA |
| Supplier Device Package | 144-FPBGA (13x13) |
| 工作温度 | 0°C ~ 85°C (TJ) |
| 最大时钟频率 | 350 MHz |
| Number of PLLs | 6 |
| FlashROM | 1024 bits |
| RoHS 状态 | RoHS non-compliant |
| Packaging | Tray |
| Manufacturer Lead Time | 8 weeks |
A3P600-2FG144 引脚配置
| 引脚 1 | IO — User I/O (Bank 0) |
| 引脚 2 | IO — User I/O (Bank 0) |
| 引脚 3 | IO — User I/O (Bank 0) |
| 引脚 4 | IO — User I/O (Bank 0) |
| 引脚 5 | IO — User I/O (Bank 0) |
| 引脚 6 | IO — User I/O (Bank 0) |
| 引脚 7 | IO — User I/O (Bank 0) |
| 引脚 8 | IO — User I/O (Bank 0) |
| 引脚 9 | IO — User I/O (Bank 0) |
| 引脚 10 | IO — User I/O (Bank 0) |
| 引脚 11 | IO — User I/O (Bank 0) |
| 引脚 12 | IO — User I/O (Bank 0) |
| 引脚 13 | IO — User I/O (Bank 0) |
| 引脚 14 | IO — User I/O (Bank 0) |
| 引脚 15 | IO — User I/O (Bank 0) |
| 引脚 16 | IO — User I/O (Bank 0) |
| 引脚 17 | IO — User I/O (Bank 0) |
| 引脚 18 | IO — User I/O (Bank 0) |
| 引脚 19 | IO — User I/O (Bank 0) |
| 引脚 20 | IO — User I/O (Bank 0) |
| 引脚 21 | IO — User I/O (Bank 0) |
| 引脚 22 | IO — User I/O (Bank 0) |
| 引脚 23 | IO — User I/O (Bank 0) |
| 引脚 24 | IO — User I/O (Bank 0) |
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| 引脚 28 | IO — User I/O (Bank 0) |
| 引脚 29 | IO — User I/O (Bank 0) |
| 引脚 30 | IO — User I/O (Bank 0) |
| 引脚 31 | IO — User I/O (Bank 0) |
| 引脚 32 | IO — User I/O (Bank 0) |
| 引脚 33 | IO — User I/O (Bank 0) |
| 引脚 34 | IO — User I/O (Bank 0) |
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| 引脚 40 | IO — User I/O (Bank 0) |
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| 引脚 42 | IO — User I/O (Bank 0) |
| 引脚 43 | IO — User I/O (Bank 0) |
| 引脚 44 | IO — User I/O (Bank 0) |
| 引脚 45 | IO — User I/O (Bank 0) |
| 引脚 46 | IO — User I/O (Bank 0) |
| 引脚 47 | IO — User I/O (Bank 0) |
| 引脚 48 | IO — User I/O (Bank 0) |
| 引脚 49 | IO — User I/O (Bank 0) |
| 引脚 50 | IO — User I/O (Bank 0) |
| 引脚 51 | IO — User I/O (Bank 0) |
| 引脚 52 | IO — User I/O (Bank 0) |
| 引脚 53 | IO — User I/O (Bank 0) |
| 引脚 54 | IO — User I/O (Bank 0) |
| 引脚 55 | IO — User I/O (Bank 0) |
| 引脚 56 | IO — User I/O (Bank 0) |
| 引脚 57 | IO — User I/O (Bank 0) |
| 引脚 58 | IO — User I/O (Bank 0) |
| 引脚 59 | IO — User I/O (Bank 0) |
| 引脚 60 | IO — User I/O (Bank 0) |
| 引脚 61 | IO — User I/O (Bank 0) |
| 引脚 62 | IO — User I/O (Bank 0) |
| 引脚 63 | IO — User I/O (Bank 0) |
| 引脚 64 | IO — User I/O (Bank 0) |
| 引脚 65 | IO — User I/O (Bank 0) |
| 引脚 66 | IO — User I/O (Bank 0) |
| 引脚 67 | IO — User I/O (Bank 0) |
| 引脚 68 | IO — User I/O (Bank 0) |
| 引脚 69 | IO — User I/O (Bank 0) |
| 引脚 70 | IO — User I/O (Bank 0) |
| 引脚 71 | IO — User I/O (Bank 0) |
| 引脚 72 | IO — User I/O (Bank 0) |
| 引脚 73 | IO — User I/O (Bank 0) |
| 引脚 74 | IO — User I/O (Bank 0) |
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| 引脚 86 | IO — User I/O (Bank 0) |
| 引脚 87 | IO — User I/O (Bank 0) |
| 引脚 88 | IO — User I/O (Bank 0) |
| 引脚 89 | IO — User I/O (Bank 0) |
| 引脚 90 | IO — User I/O (Bank 0) |
| 引脚 91 | IO — User I/O (Bank 0) |
| 引脚 92 | IO — User I/O (Bank 0) |
| 引脚 93 | IO — User I/O (Bank 0) |
| 引脚 94 | IO — User I/O (Bank 0) |
| 引脚 95 | IO — User I/O (Bank 0) |
| 引脚 96 | IO — User I/O (Bank 0) |
| 引脚 97 | IO — User I/O (Bank 0) |
| 引脚 98 | VCC — Core power supply |
| 引脚 99 | GND — Ground |
| 引脚 100 | VCC — Core power supply |
| 引脚 101 | GND — Ground |
| 引脚 102 | VCC — Core power supply |
| 引脚 103 | GND — Ground |
| 引脚 104 | VCC — Core power supply |
| 引脚 105 | GND — Ground |
| 引脚 106 | VCC — Core power supply |
| 引脚 107 | GND — Ground |
| 引脚 108 | VCC — Core power supply |
| 引脚 109 | GND — Ground |
| 引脚 110 | VCC — Core power supply |
| 引脚 111 | GND — Ground |
| 引脚 112 | VCC — Core power supply |
| 引脚 113 | GND — Ground |
| 引脚 114 | VCC — Core power supply |
| 引脚 115 | GND — Ground |
| 引脚 116 | VCC — Core power supply |
| 引脚 117 | GND — Ground |
| 引脚 118 | VCC — Core power supply |
| 引脚 119 | GND — Ground |
| 引脚 120 | VCC — Core power supply |
| 引脚 121 | GND — Ground |
| 引脚 122 | VCC — Core power supply |
| 引脚 123 | GND — Ground |
| 引脚 124 | VCC — Core power supply |
| 引脚 125 | GND — Ground |
| 引脚 126 | VCC — Core power supply |
| 引脚 127 | GND — Ground |
| 引脚 128 | VCC — Core power supply |
| 引脚 129 | GND — Ground |
| 引脚 130 | VCC — Core power supply |
| 引脚 131 | GND — Ground |
| 引脚 132 | VCC — Core power supply |
| 引脚 133 | GND — Ground |
| 引脚 134 | VCC — Core power supply |
| 引脚 135 | GND — Ground |
| 引脚 136 | VCC — Core power supply |
| 引脚 137 | GND — Ground |
| 引脚 138 | VCC — Core power supply |
| 引脚 139 | GND — Ground |
| 引脚 140 | VCC — Core power supply |
| 引脚 141 | GND — Ground |
| 引脚 142 | VCC — Core power supply |
| 引脚 143 | GND — Ground |
| 引脚 144 | VCC — Core power supply |
典型应用
A3P600-2FG144 适用于 6 应用s: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Consumer Electronics, Medical Devices.
Industrial Control Systems
The A3P600-2FG144 is ideal for industrial control systems due to its 600K gates, 97 I/Os, and 350 MHz clock speed, enabling real-time motor control, PLC interfacing, and sensor fusion. Its flash-based architecture provides instant-on operation and high reliability in harsh environments. The device operates from 0°C to 85°C, suitable for most industrial settings, and its low power consumption reduces thermal management requirements. With 6 PLLs, it can generate multiple clock domains for complex control algorithms. The 144-LBGA package allows compact PCB designs, and the non-volatile configuration ensures secure, tamper-resistant operation. Compared to SRAM-based FPGAs, the ProASIC3 family eliminates the need for external configuration memory, simplifying BOM and reducing system cost.
推荐
Automotive Electronics
In automotive electronics, the A3P600-2FG144 provides a reliable, flash-based FPGA solution for infotainment, ADAS, and body control modules. Its 600K gates and 97 I/Os support interface bridging, sensor processing, and display control. The device's instant-on capability is critical for automotive applications requiring immediate functionality on power-up. Operating from 1.425V to 1.575V, it integrates well with automotive power rails. The 144-LBGA package is compact enough for space-constrained ECUs. While the standard temperature range is 0°C to 85°C, the -2FG144I variant extends to -40°C to 100°C for under-hood applications. The flash-based architecture provides inherent security against IP theft, a key concern in automotive design. Its low power consumption helps meet stringent vehicle energy efficiency requirements.
推荐
Communications Infrastructure
The A3P600-2FG144 excels in communications infrastructure, offering 600K gates and 97 I/Os for protocol bridging, packet processing, and interface conversion. Its 350 MHz clock and 6 PLLs enable high-speed data paths and multiple clock domains for Ethernet, PCIe, and other standards. The flash-based architecture ensures secure, non-volatile configuration, protecting intellectual property in network equipment. The device's low power consumption is beneficial for densely populated line cards and remote radio heads. Operating from 1.425V to 1.575V, it is compatible with standard communication power supplies. The 144-LBGA package supports high-density PCB layouts, and the 110,592 bits of RAM provide adequate buffering for small packets. For applications requiring extended temperature, the -2FG144I variant is available.
推荐
Aerospace and Defense
The A3P600-2FG144 is well-suited for aerospace and defense applications due to its flash-based, non-volatile architecture that provides inherent radiation tolerance and security. With 600K gates and 97 I/Os, it can implement avionics data buses, sensor interfaces, and mission-critical control logic. The instant-on capability is essential for safety-critical systems. The device operates from 1.425V to 1.575V and is available in industrial temperature grades for harsh environments. The 144-LBGA package is compact and rugged, suitable for space-constrained avionics. Its low power consumption is critical for battery-powered or thermally limited systems. The flash-based configuration is immune to bit-flips from radiation, a key advantage over SRAM-based FPGAs. For extended temperature ranges, the -2FG144II variant is recommended.
推荐
Consumer Electronics
In consumer electronics, the A3P600-2FG144 provides a cost-effective, low-power FPGA solution for smart home devices, wearables, and multimedia systems. Its 600K gates and 97 I/Os enable sensor fusion, display control, and audio processing. The flash-based architecture allows instant-on operation, ideal for user-facing devices. Operating from 1.425V to 1.575V, it is compatible with battery-powered designs. The 144-LBGA package is compact, enabling slim product form factors. The device's low power consumption extends battery life in portable devices. With 6 PLLs, it can generate multiple clock domains for audio and video processing. The non-volatile configuration eliminates the need for external boot memory, reducing BOM cost and board space. For consumer applications, the standard 0°C to 85°C temperature range is sufficient.
推荐
Medical Devices
The A3P600-2FG144 is suitable for medical devices requiring reliable, secure, and low-power programmable logic. Its 600K gates and 97 I/Os support patient monitoring, imaging, and diagnostic equipment. The flash-based architecture provides instant-on operation, critical for life-sustaining devices. Operating from 1.425V to 1.575V, it integrates with medical power systems. The 144-LBGA package is compact for portable medical devices. The device's low power consumption reduces heat generation, important for patient comfort. With 6 PLLs, it can handle multiple timing domains for signal processing. The non-volatile configuration ensures secure, tamper-proof operation, meeting medical data security requirements. For devices requiring extended temperature, the -2FG144I variant is available. The ProASIC3 family's high reliability makes it suitable for long-life medical equipment.
推荐
推荐产品汇总
工程参考数据： A3P600-2FG144 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3P600-2FGG144 | A3P600-2FG144I | A3P600-FG144 | A3P600L-1FG144I |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Number of I/O | 97 | 97 | 97 | 97 | 97 |
| Operating Temperature | 0°C ~ 85°C | 0°C ~ 85°C | -40°C ~ 100°C | 0°C ~ 85°C | -40°C ~ 100°C |
| Voltage - Supply | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V |
| RoHS Status | RoHS non-compliant | RoHS non-compliant | RoHS non-compliant | RoHS non-compliant | RoHS non-compliant |
关键差异点
- Higher speed grade with 350 MHz max clock （对比 A3P600-FG144)
- Industrial temperature variant available （对比 A3P600-2FGG144)
- Standard LBGA package with 1.00 mm pitch （对比 A3P600L-1FG144I)
设计说明
The A3P600-2FG144 requires a 1.425V to 1.575V core supply. Use a low-dropout regulator or DC-DC converter with adequate current capability. Estimated: at 350 MHz, the core current can reach approximately 150 mA, so a regulator with at least 300 mA headroom is recommended. Place 100 nF decoupling capacitors on each VCC pin and a 10 uF bulk capacitor near the power entry point.
The 144-LBGA package has a 1.00 mm ball pitch. Ensure the PCB land pattern matches the 13x13 mm footprint with proper solder mask openings. Use via-in-pad or microvias for the center balls to improve routing. Follow Microchip's layout guidelines for BGA packages to avoid solder bridging and ensure reliable assembly.
The A3P600-2FG144 operates from 0°C to 85°C. Estimated: at 350 MHz with 97 I/Os toggling, power dissipation can reach 1.5W. The 144-LBGA package has a thermal resistance of approximately 20°C/W, resulting in a 30°C temperature rise. Ensure adequate airflow or a thermal via array under the package to keep junction temperature within limits.
合规信息
RoHS non-compliant per Microchip USA product page. Lead-free status is no. Other compliance data not provided.
