A3P250-FG144T - ProASIC3 250K-Gate Flash FPGA | Microchip
料号： A3P250-FG144T ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $34.73 | $34.73 |
| 10 | $33.5 | $335.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $30.1 | $15,050.00 |
| 1,000 | $28.6 | $28,600.00 |
A3P250-FG144T 概述
A flash-based FPGA stores its configuration in on-chip flash cells rather than SRAM, so the A3P250-FG144T is a single-chip, non-volatile solution that powers up instantly without an external configuration PROM or boot flash. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital logic IC), this differentiates ProASIC3 from SRAM FPGAs such as the Xilinx Spartan family, improving security and reducing board cost.
Key features include 6144 CLBs, a system clock rate of 231 MHz, 97 user I/Os with flexible standards support, instant-on operation, and live reprogrammability. The flash fabric also provides inherent protection against configuration cloning, a frequently cited advantage in automotive and industrial designs. Low total cost of ownership (TOC) and small-footprint packaging are core family features listed by Microchip.
The ProASIC3 architecture uses a fine-grained VersTile logic element on a 130 nm flash process, with embedded SRAM blocks available for FIFOs and dual-port memories. Clock conditioning and I/O registers support high-performance synchronous designs implemented through Microchip Libero SoC design tools.
Typical applications include automotive body and powertrain control, industrial motor control and automation, portable instrumentation, and secure embedded control where instant-on and configuration security matter.
Design consideration: the 144-FBGA requires careful PCB layout with controlled-impedance routing and recommended power decoupling; verify the FG versus FGG package variant (solder-ball composition) matches your assembly process.
This page synthesizes distributor pricing, same-family drop-in variants, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3P250-FG144T ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3P250-FG144T （相同外形与封装尺寸） ——差异在于 Package, Process Technology, RoHS Status, System Gates, Family.
快速对比工具——选择替代料号进行并排对比：
A3P250-FGG144T
✅ 直接替换📋 参考替代料（不在目录中）
A3P250-FG144I
✅ 直接替换📋 参考替代料（不在目录中）
A3P250-1FG144T
✅ 直接替换✓ 有现货
$28.9 / 个
查看数据手册 →A3P250-1FGG144T
✅ 直接替换✓ 有现货
$19.2 / 个
查看数据手册 →A3P250-FG144
✅ 直接替换📋 参考替代料（不在目录中）
A3P250-FGG144I
✅ 直接替换✓ 有现货
$14.06 / 个
查看数据手册 →A3P250-FG144T 最大额定值与电气特性
| Family | ProASIC3 Flash FPGA |
| Number of Gates | 250,000 |
| Configurable Logic Blocks (CLBs) | 6144 |
| Logic Elements (LEs) | 3K LEs |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm Flash |
| Core Supply Voltage | 1.5 V |
| Number of User I/Os | 97 |
| 封装 | 144-Ball FBGA (13 x 13 mm, 1 mm pitch, 1.45 mm height) |
| 安装类型 | Surface Mount |
| Configuration Memory | Non-volatile Flash (single-chip, instant-on) |
| Temperature Grade | Automotive (T suffix) |
| Lead Free Status | Contains Lead (per DigChip) |
| RoHS 状态 | RoHS Non-Compliant (per DigChip) |
| Packaging | Tray |
A3P250-FG144T 144-ball fbga (13 x 13 mm, 1 mm pitch, 1.45 mm height) 引脚配置指南
A3P250-FG144T（144-ball fbga (13 x 13 mm, 1 mm pitch, 1.45 mm height) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3P250-FG144T.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3P250-FG144T 适用于 6 应用s: Automotive Body and Powertrain Control, Industrial Motor Control and Automation, Portable and Battery-Powered Instrumentation, Secure Embedded Control Systems, Test and Measurement Equipment, Communications and Interface Bridge Logic.
Automotive Body and Powertrain Control
The A3P250-FG144T is designed for automotive ECUs: the datasheet identifies it explicitly as part of the Automotive ProASIC3 Flash Family with the T temperature suffix. Its 250K gates and 6144 CLBs provide enough capacity for body-control logic, CAN/LIN glue logic, gateways, and powertrain supervisory functions, while 97 user I/Os interface sensors, lamps, and actuators directly. The non-volatile flash fabric delivers instant-on operation - logic is functional within microseconds of key-on, eliminating external boot ROM and its failure modes. Configuration security from flash cells protects against firmware cloning in fielded vehicles. Implemented in Libero SoC with timing closure at up to 231 MHz, it suits 12V automotive rails with appropriate level-shifting on I/O banks.
推荐
Industrial Motor Control and Automation
In industrial drives, PLC I/O modules, and motion controllers, the A3P250-FG144T provides deterministic parallel logic that microcontrollers cannot match: PWM generation, quadrature decoding, and safety interlock logic execute in hardware at up to 231 MHz. The flash-based single-chip architecture removes the configuration device required by SRAM FPGAs, improving uptime in electrically noisy factory environments where a failed boot sequence means a stopped line. With 97 I/Os in a 13 x 13 mm 144-FBGA, it consolidates discrete glue logic, reducing BOM count and board area. The 1.5 V core keeps dynamic power low for fanless industrial designs, and live reprogrammability allows field firmware updates without suspending the whole system.
推荐
Portable and Battery-Powered Instrumentation
The A3P250-FG144T's 1.5 V core on a 130 nm flash process yields low static power, important in handheld test equipment, battery data loggers, and portable medical diagnostic devices. Instant-on flash configuration means the instrument is ready the moment power is applied - no multi-hundred-millisecond SRAM boot - which improves user experience and enables duty-cycled designs that cut power between measurements. The compact 144-ball FBGA (13 x 13 mm, 1.45 mm height) fits space-limited handheld PCBs, while 97 I/Os drive displays, keypads, and sensor front ends. Its single-chip nature also simplifies mechanical sealing of the enclosure by removing external configuration memory and its connectors.
推荐
Secure Embedded Control Systems
Flash-based FPGAs resist configuration readback attacks: unlike SRAM FPGAs whose bitstream sits in an external PROM, the A3P250-FG144T stores configuration inside the chip, so the design never traverses a bus during boot. This makes it a strong fit for secure access controllers, encryption key handling glue logic, industrial anti-counterfeiting modules, and defense-adjacent control boards. The 250K-gate capacity hosts AES-style datapaths alongside control state machines, and 231 MHz system performance supports time-critical authentication logic. Because the device is also live reprogrammable, key-update state machines can be fielded without returning hardware. Design implementation in Libero SoC includes FlashLock security features of the ProASIC3 family.
推荐
Test and Measurement Equipment
Bench instruments, protocol analyzers, and automated test fixtures benefit from the A3P250-FG144T's deterministic hardware timing: trigger chains, time-to-digital logic, and channel formatting run without software jitter at clock rates up to 231 MHz. The 97 user I/Os with registered I/O cells support dense channel counts in a 13 x 13 mm footprint, and the automotive-grade temperature rating provides margin for instruments used near thermal limits. Flash configuration means the instrument presents a working front-end immediately at power-up, and IEEE-style JTAG programming through Libero SoC enables test-fixture firmware updates in the field. Replacing dozens of TTL devices with one FPGA also simplifies calibration documentation.
推荐
Communications and Interface Bridge Logic
The A3P250-FG144T serves as protocol bridge and glue logic in networking and communication boards, converting between legacy interfaces and modern controllers. With 6144 CLBs and up to 231 MHz performance, it implements UART/SPI/I2C multiplexing, parallel bus adaptation, and simple framing engines in hardware. The flash fabric is instantly active at power-on, which matters in backplane systems where a slave device must answer early enumeration, and the single-chip design removes configuration PROMs that add BOM cost per node in high-volume communication hardware. The 144-FBGA with 1 mm ball pitch is reworkable with standard BGA equipment, supporting board-level service in deployed communication racks.
推荐
推荐产品汇总
工程参考数据： A3P250-FG144T ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3P250-FGG144T | A3P250-FG144I | A3P250-1FG144T | A3P250-FG144 |
|---|---|---|---|---|---|
| Package | 144-Ball FBGA (13 x 13 mm) | 144-Ball FBGA - same footprint | 144-Ball FBGA - same footprint | 144-Ball FBGA - same footprint | 144-Ball FBGA - same footprint |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
关键差异点
- Automotive temperature grade with standard speed performance （对比 A3P250-FG144I)
- Standard speed grade at no timing penalty （对比 A3P250-1FG144T)
- Cost of RoHS non-compliance is real （对比 A3P250-FGG144T)
设计说明
The 144-ball FBGA uses a 1.0 mm ball pitch on a 13 x 13 mm body with 1.45 mm height. Design the land pattern per the package mechanical drawing in the ProASIC3 datasheet and route the dense center ball breakout with via-in-pad or dog-bone fanout on at least a 4-layer board. Verify whether your assembly line's reflow profile is compatible with the FG package's lead-containing balls; if the line is RoHS-only, switch to the A3P250-FGG144T Pb-free variant, which is pin-to-pin identical.
The A3P250 core runs from 1.5 V while I/O banks use separate supplies, so plan a multi-rail power tree and budget core current from the ProASIC3 power calculator in Libero SoC using your actual design utilization and toggle rates. Decouple all VCC/VCCI/VCCA banks with the capacitor combination recommended in the datasheet power section, placing capacitors close to the ball fanout vias. Because the flash fabric is non-volatile, no configuration power sequencing or boot-current spike from an external PROM exists, simplifying supply design versus SRAM FPGAs.
Three pitfalls recur with this part. First, order the correct package suffix: FG is lead-bearing and RoHS non-compliant per DigChip, FGG is Pb-free - a compliance audit failure is a costly rework. Second, confirm speed grade against your Libero timing report before substituting a -1 grade part such as A3P250-1FG144T. Third, since this is a mature family, verify date codes and request certificates of conformance from distributors; marketplaces report stock from non-franchise sources, so qualify suppliers before production placement.
合规信息
Per DigChip specification summary, A3P250-FG144T contains lead and is RoHS Non-Compliant. The datasheet identifies the part as belonging to the Automotive ProASIC3 Flash Family (T suffix). For RoHS-compliant builds, use the A3P250-FGG144T Pb-free/green package variant, which FindIC confirms as a complete drop-in replacement.
