A3P600L-1FGG144I - ProASIC3L Flash FPGA 600K Gates | Microchip
MPN: A3P600L-1FGG144I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $65.9 | $659.00 |
| 100 | $63.2 | $6,320.00 |
| 500 | $61.59 | $30,795.00 |
| 1,000 | $59.8 | $59,800.00 |
Drop-in alternatives for A3P600L-1FGG144I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600L-FGG144I
✅ Drop-In✓ In Stock
$33.95 / Unit
View Datasheet →A3P600L-1FGG144
✅ Drop-In✓ In Stock
$29.4 / Unit
View Datasheet →A3P600L-1FGG144YI
✅ Drop-In📋 Reference alternative (not in catalog)
A3P600L-FG144I
✅ Drop-In✓ In Stock
$35.2 / Unit
View Datasheet →A3P600L-1FG144
✅ Drop-In✓ In Stock
$25.73 / Unit
View Datasheet →A3P600L-1FGG144I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L |
| Number of Gates | 600000 |
| Logic Cells (CLBs) | 13824 |
| User I/O | 97 |
| RAM Bits | 110592 |
| Technology | CMOS Flash (non-volatile) |
| Supply Voltage (Core) | 1.14 V to 1.575 V |
| Speed Grade | -1 |
| Operating Temperature | -40C to +100C (TJ), Industrial |
| Package | 144-LBGA (FBGA-144 / FGG144) |
| Package Dimensions | 13 x 13 mm, 1.45 mm height |
| Ball Pitch | 1 mm |
| Mounting Type | Surface Mount |
| Configuration | On-chip flash, single chip, instant-on |
| Security | FlashLock Level 0/1/2 security |
| Packaging | Tray |
| RoHS Status | ROHS3 Compliant, Green |
A3P600L-1FGG144I 13 x 13 mm, 1.45 mm height Pin Configuration Guide
Complete pinout information for A3P600L-1FGG144I (13 x 13 mm, 1.45 mm height package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600L-1FGG144I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600L-1FGG144I is suitable for 6 applications: Industrial Control and Automation, Secure Military and Aerospace Systems, Low-Power Portable Instrumentation, Bridge Logic and Bus Interface, ASIC Prototyping and Emulation, Secure Embedded Sensing and IoT Edge.
Industrial Control and Automation
The A3P600L-1FGG144I fits industrial control because its 13,824 logic cells and 97 user I/Os cover typical PLC glue logic, motor-control interfaces, and sensor aggregation, while the -40C to +100C industrial temperature range survives cabinet and floor environments. Its flash configuration is live at power-up, so the FPGA participates in power-on diagnostics within microseconds - important for safety interlocks that must not wait for a configuration load. In a typical design, the device bridges fieldbus PHYs to a host MCU with 110,592 RAM bits available for FIFO buffering, and the 1.2 V core keeps standby power low in always-on installations. FlashLock security also prevents process logic from being read out of deployed units on the factory floor.
Recommended
Secure Military and Aerospace Systems
Defense and aerospace designers choose the A3P600L-1FGG144I because flash-based configuration eliminates the external boot flash readback attack surface inherent to SRAM FPGAs, and FlashLock Levels 0/1/2 lock the design against both readback and unauthorized reprogramming. The 600,000-gate fabric with 13,824 CLBs implements mission interfaces, custom bus protocols, and cryptographic wrappers, while the industrial -40C to +100C rating covers extended environmental requirements. Single-chip, instant-on operation matters for payloads that must be functional within milliseconds of power application. With no configuration device to fail, system reliability analysis also drops one component from the FIT budget, a quantified benefit in long-duration deployments.
Recommended
Low-Power Portable Instrumentation
Battery-powered instruments benefit directly from the ProASIC3L low-power architecture: the 1.2 V nominal core (1.14 V to 1.575 V range) cuts static and dynamic power versus standard-core ProASIC3 devices, extending battery runtime without changing logic capacity. The 13 x 13 mm 144-ball package keeps board area compact for handheld enclosures. In a typical portable data-logger, the FPGA handles 97 I/O channels of sensor acquisition and timing, with 110,592 RAM bits buffering samples, while instant-on flash configuration lets the instrument be measurement-ready immediately after switch-on. The absence of a configuration PROM also removes one quiescent-load component from the power budget.
Recommended
Bridge Logic and Bus Interface
As bridge logic, the A3P600L-1FGG144I implements protocol conversion between legacy and modern buses - for example, parallel peripheral buses to SPI/I2C, or custom backplanes to standard interfaces - using the 13,824 CLBs for state machines and the 110,592 RAM bits for elastic FIFOs. Flash configuration means the bridge is functional the moment power is applied, so upstream hosts never see a dead bus during a configuration window. The 97 I/Os are banked across 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards, letting one device talk to old 3.3 V peripherals and modern 1.8 V ASICs simultaneously. Timing is deterministic because no reconfiguration occurs in operation.
Recommended
ASIC Prototyping and Emulation
For ASIC prototyping, the A3P600L-1FGG144I provides a reprogrammable, instant-on fabric where 600,000 gates accommodate moderate RTL blocks for early firmware bring-up. Flash programmability allows in-system design iteration without swapping configuration devices, and FlashLock secures pre-release IP on the prototype board. The -1 speed grade is adequate for functional prototyping where the target ASIC clock is replicated at a reduced ratio, and designers typically run the FPGA at a divided clock to relax timing closure in Libero SoC. The 97 I/Os expose internal nodes on test headers, giving hardware teams visibility that the final ASIC will not have - a core value of FPGA-based validation.
Recommended
Secure Embedded Sensing and IoT Edge
In secure edge nodes, the A3P600L-1FGG144I combines sensing aggregation with anti-tamper configuration storage: the design bitstream lives in on-chip flash and is locked by FlashLock, so an attacker cannot extract or substitute the logic image. The 13,824 CLBs implement sensor front-end sequencing, CRC/authentication pipelines, and interface to a low-power MCU host, with the 1.2 V core minimizing standby draw for battery or energy-harvesting nodes. Instant-on operation means the node can authenticate itself to the network immediately at power-up without waiting for configuration load from external memory - closing the boot-time vulnerability window present in SRAM FPGA designs.
Recommended
Recommended Products Summary
Engineering reference data for A3P600L-1FGG144I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600L-FGG144I | A3P600L-1FGG144 | A3P600L-1FGG144YI | A3P600L-1FG144 |
|---|---|---|---|---|---|
| Package | 144-LBGA (FGG144), 13 x 13 mm | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FGG144) - same | 144-LBGA (FG144) family - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Logic Cells (CLBs) | 13824 | 13824 | 13824 | 13824 | 13824 |
| User I/O | 97 | 97 | 97 | 97 | 97 |
| Core Supply Voltage | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V |
| Speed Grade | -1 | Standard (per suffix) | -1 | Y (slower/cost-optimized grade) | -1 |
| Operating Temperature | -40C to +100C (TJ) | -40C to +100C (TJ) | [DATA_NEEDED] | Industrial (-40C to +100C class) | [DATA_NEEDED] |
| RoHS | ROHS3 Compliant | ROHS3 Compliant | Compliant (Green package) | Compliant | Compliant (Green package) |
Key Differentiators
- Single-chip flash configuration, instant-on (vs SRAM FPGAs (Xilinx/Altera equivalents))
- FlashLock security with Level 0/1/2 lock (vs A3P600L-1FGG144)
- Low-power 1.2 V core family (ProASIC3L) (vs A3P600-FG144I (standard ProASIC3))
- Trade-off: -1 speed grade limits maximum clocking (vs A3P600L-1FGG144YI)
Design Notes
Power the ProASIC3L core from a rail within 1.14 V to 1.575 V, targeting the 1.2 V nominal point. Because this is a flash FPGA, static power is dominated by leakage rather than configuration-hold current, but dynamic power scales with clock frequency, toggle rate, and the square of core voltage - running at 1.14 V where timing permits measurably reduces consumption. Per Microchip's product page, the L-family's core voltage range is the main low-power lever; use Microchip's power estimator and Libero SoC SmartPower with your post-layout netlist rather than rule-of-thumb numbers before finalizing the regulator budget.
The FGG144 package uses a 1.0 mm ball pitch on a 13 x 13 mm body; specify a 0.5 mm pad, non-solder-mask-defined (NSMD) land pattern and follow the PCB land-pattern application note in the ProASIC3L family documentation. Fan out with via-in-pad or dogbone vias; with 97 user I/Os and distributed power/ground balls, a 4-layer stackup (SIG-GND-PWR-SIG) simplifies escape routing. Because I/O banks are powered independently, dedicate one plane section per bank voltage to avoid plane splits under high-speed signals.
Do not treat this like an SRAM FPGA: there is no external configuration flash to size, but programming must occur via JTAG or the specified programming interface before FlashLock is enabled - once Level 1/2 security is set, the device cannot be read back, so archive the programming file (STP/PDB) in configuration management. Also, mixing speed grades (e.g., substituting the Y grade) changes static timing results; always re-run timing-driven place-and-route in Libero SoC after any suffix change rather than assuming pin-compatibility implies timing-compatibility.
Compliance Information
Distributor data (Microchip USA) lists ROHS3 Compliant; Jotrin describes a GREEN PBGA144 package. REACH and conflict-minerals declarations not stated in provided data.
