A3PE1500-1FG484 - ProASIC3E Flash FPGA 16KLE 484-BGA | Microchip
料号： A3PE1500-1FG484 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $97.37 | $97.37 |
| 10 | $92.5 | $925.00 |
| 100 | $85.9 | $8,590.00 |
| 500 | $79.8 | $39,900.00 |
| 1,000 | $74.2 | $74,200.00 |
A3PE1500-1FG484 概述
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration PROM. This places the ProASIC3E family in the broader hierarchy: FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. Unlike SRAM FPGAs, a flash FPGA is a single-chip solution that boots instantly at power-up, requires no external boot device, and offers inherently higher design security.
Key features include a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process, up to 504 kbits of true dual-port SRAM, optional soft ARM support, and low total cost of ownership through single-chip integration. The -1 speed grade supports commercial 0C to +70C operating temperature, and the 1.5V core enables low dynamic power. The FG484 package is footprint-compatible with the FG256 variant, simplifying family migration.
Technically, the ProASIC3E fabric uses VersTile logic elements and dedicated block RAM organized in minibanks with per-bank VREF support for voltage-referenced I/O standards. Abundant user I/O (280 on the FG484) supports multiple single-ended and differential standards for system interfacing.
Typical applications include ASIC replacement and prototyping, industrial control, networking and communications equipment, avionics and defense systems, and consumer designs requiring instant-on operation.
Design consideration: flash FPGAs dissipate static power continuously; estimate power with the Microchip Libero SoC power calculator before committing to the 1.5V core supply topology. Verify I/O bank voltage assignments early to avoid PCB respins.
This page synthesizes distributor pricing, same-family drop-in alternatives, design notes, and FAQ content not consolidated in the manufacturer datasheet.
直接替换替代料： A3PE1500-1FG484 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE1500-1FG484 （相同外形与封装尺寸） ——差异在于 Package, System Gates, Operating Temperature, Process Technology, Speed Grade.
快速对比工具——选择替代料号进行并排对比：
A3PE1500-1FGG484
✅ 直接替换✓ 有现货
$48.1 / 个
查看数据手册 →A3PE1500-1FGG484I
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE1500-FG484I
✅ 直接替换📋 参考替代料（不在目录中）
A3PE1500-2FG484
✅ 直接替换✓ 有现货
$210 / 个
查看数据手册 →M1A3PE1500-1FG484
✅ 直接替换📋 参考替代料（不在目录中）
A3PE3000-1FG484
✅ 直接替换✓ 有现货
$49.8 / 个
查看数据手册 →A3PE1500-1FG484 最大额定值与电气特性
| Family | ProASIC3E (Flash-based FPGA) |
| Logic Elements | 16K (approx. 1.5 million system gates) |
| User I/O | 280 |
| Embedded SRAM | 276480 bits (504 kbits true dual-port family maximum) |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| 封装 | 484-BGA (FBGA-484, 1 mm pitch) |
| 安装类型 | Surface Mount |
| Speed Grade | -1 |
| 工作温度 | 0C to +70C |
| Configuration Memory | On-chip flash (nonvolatile, single-chip) |
| Soft ARM Support | Yes (optional) |
| Logic Family | CMOS |
| Reprogrammability | Yes (in-system reprogrammable flash) |
| Footprint Compatibility | FG256 and FG484 footprint-compatible |
A3PE1500-1FG484 484-bga (fbga-484, 1 mm pitch) 引脚配置指南
A3PE1500-1FG484（484-bga (fbga-484, 1 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE1500-1FG484.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE1500-1FG484 适用于 6 应用s: ASIC Replacement and Prototyping, Avionics and Defense Systems, Networking and Communications Equipment, Industrial Control and Automation, Consumer and Computing Platforms, Embedded Processing with Soft ARM Cores.
ASIC Replacement and Prototyping
The ProASIC3E family is explicitly positioned by Microchip as a cost-effective ASIC replacement, and the A3PE1500-1FG484 fits this role because its 16K logic elements and 1.5 million system gates cover many mid-complexity ASIC designs while avoiding NRE charges and mask costs. The flash-based fabric reprograms in-system, so design iterations that would take weeks in an ASIC tape-out complete in minutes. Because configuration is nonvolatile and on-chip, the FPGA behaves like a hard-wired ASIC at power-up with no boot controller required, simplifying replacement of mask-ROM logic. For production, single-unit pricing from $97.37 (as of 2026-09-01) is economical at volumes below full-mask ASIC break-even.
推荐
Avionics and Defense Systems
Microchip datasheet material lists avionics among ProASIC3E target markets, and the A3PE1500-1FG484 contributes two properties valued there: flash configuration resists readback-based IP extraction, and the single-chip design removes the external configuration PROM that complicates reliability analysis in flight hardware. The 1.5V core limits dynamic power, easing conduction-cooled enclosure budgets common in avionics boxes. For programs with extended temperature requirements, the pin-compatible A3PE1500-1FGG484I and A3PE1500-FG484I industrial variants (same FBGA-484 footprint) allow board reuse across commercial prototype and qualified flight builds. Soft ARM support permits embedding a processor core alongside glue logic to consolidate discrete components.
推荐
Networking and Communications Equipment
The 280 user I/Os of the A3PE1500-1FG484 support the dense single-ended and differential signaling found in line cards, backplane interfaces, and control planes of networking equipment. Embedded true dual-port SRAM (276,480 bits on this device) buffers packet data and implements FIFOs without external memory, and per-minibank VREF support accommodates voltage-referenced I/O standards used in legacy board architectures. The -1 speed grade handles control-plane and bridge logic clock rates while the 1.5V core keeps continuous operating power manageable in always-on equipment. The nonvolatile flash configuration enables instant-on link bring-up after hot plugging, a requirement in redundant systems.
推荐
Industrial Control and Automation
Industrial controllers benefit from the A3PE1500-1FG484's instant-on flash configuration: machinery logic is active the moment power is applied, without a microcontroller waiting through FPGA configuration. The 0C to +70C commercial rating suits cabinet-mounted equipment in conditioned environments, while the pin-compatible industrial-grade -1FGG484I variant covers harsher floor installations without PCB changes. The 16K logic elements implement motor sequencing, safety interlocks, and communication bridges, and the 280 I/Os connect sensors, encoders, and fieldbus transceivers directly. Longevity matters here - Microchip maintains the mature ProASIC3E family for industrial customers needing multi-year supply continuity for installed bases.
推荐
Consumer and Computing Platforms
Microchip positions ProASIC3E for consumer and computing markets as a single-chip alternative to ASIC or CPLD-plus-PROM combinations. The A3PE1500-1FG484 consolidates board-level glue logic, bus bridging, and interface conversion into one 1.5V-core device, cutting BOM count and assembly cost in products such as set-top platforms, printers, and display controllers. The 504-kbit true dual-port SRAM capability (276,480 bits on this density) supports video line buffers and dual-clock-domain data paths common in consumer designs. Because the flash fabric reprograms in the field, one PCB supports multiple SKUs via firmware personalization, reducing inventory complexity for high-mix consumer product lines.
推荐
Embedded Processing with Soft ARM Cores
The A3PE1500-1FG484 supports optional soft ARM implementations per the datasheet title 'ProASIC3E Flash Family FPGAs with Optional Soft ARM Support', allowing designers to embed a processor core plus custom peripherals in the 16K-element fabric. This suits smart sensor nodes, industrial gateways, and board-management controllers where a standalone MCU would leave interfacing logic unimplemented. The nonvolatile configuration means the soft processor boots autonomously at power-up without host intervention, and the embedded dual-port SRAM serves as tightly-coupled scratchpad memory for the processor subsystem. Combining control firmware and deterministic logic in one 484-ball device reduces board area versus separate MCU plus CPLD architectures.
推荐
推荐产品汇总
工程参考数据： A3PE1500-1FG484 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE1500-1FGG484 | A3PE1500-1FGG484I | A3PE1500-2FG484 | M1A3PE1500-1FG484 | A3PE3000-1FG484 |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (1 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 16K (1.5M system gates) | 16K (1.5M system gates) | 16K (1.5M system gates) | 16K (1.5M system gates) | 16K (1.5M system gates) | ~2x density (3M system gates family) |
| User I/O | 280 | 280 | 280 | 280 | 280 | 280 |
| Speed Grade | -1 | -1 | -1 | -2 (faster) | -1 | -1 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration | On-chip flash (single-chip) | On-chip flash (single-chip) | On-chip flash (single-chip) | On-chip flash (single-chip) | On-chip flash (single-chip) | On-chip flash (single-chip) |
关键差异点
- Single-chip nonvolatile flash configuration （对比 A3P600-FGG484I (SRAM-less ProASIC3 alternative families) and all SRAM FPGAs)
- Industrial-temperature drop-in path （对比 A3PE1500-1FGG484I)
- Faster speed grade option on same footprint （对比 A3PE1500-2FG484)
设计说明
Estimated: a ProASIC3E device at 1.5V core with an active design typically draws hundreds of milliwatts of combined static and dynamic power; for example, 200 mA of core current implies 0.3 W at the core rail alone. Run the Microchip Libero SoC power calculator with your actual utilization and toggle rates before sizing the 1.5V regulator, and do not rely on generic FPGA power figures. Flash FPGAs also exhibit temperature-dependent static current, so validate worst-case hot-corner consumption, not just typical, against your regulator thermal margin.
The FBGA-484 uses a 1 mm ball pitch requiring controlled-impedance escape routing; plan microvia or via-in-pad fanout for the center balls. Per the datasheet, FG256 and FG484 are footprint-compatible packages - if migration between densities is possible, design the land pattern to support both and reserve the shared power/ground ball assignments. Decouple each I/O bank supply with at least 0.1 uF plus bulk capacitance placed close to the bank balls, and assign one VREF pin per I/O minibank when using voltage-referenced standards.
Two common mistakes with this part: first, ordering the commercial 0C to +70C A3PE1500-1FG484 for an application that actually sees -40C - the industrial variants (-1FGG484I, FG484I) are pin-compatible, so select temperature grade at design time. Second, assuming drop-in compatibility with SRAM FPGAs such as Xilinx Spartan at similar density - they require external configuration devices and have different pinouts, so substitution requires a respin. Verify the FGG (lead-free) suffix against your RoHS requirement before release.
合规信息
The base FG484 suffix does not denote a RoHS finish; Microchip's FGG-suffixed variants (e.g., A3PE1500-1FGG484) are the lead-free ordering options. Confirm RoHS status on the Microchip product page for the specific ordering code.
