A3PE3000-1FG484 - 3M Gate ProASIC3E FPGA | Microchip
料号： A3PE3000-1FG484 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $74.5 | $74.50 |
| 10 | $67 | $670.00 |
| 100 | $61.2 | $6,120.00 |
| 500 | $55.3 | $27,650.00 |
| 1,000 | $49.8 | $49,800.00 |
A3PE3000-1FG484 概述
A Field Programmable Gate Array (FPGA) is an integrated circuit whose logic fabric can be programmed after manufacturing to implement arbitrary digital functions. The A3PE3000-1FG484 belongs to the ProASIC3E family, which is a flash-based FPGA family that combines reprogrammability with instant-on, live-at-power-up behavior. In the taxonomy of programmable logic, this part sits at FPGA level, above CPLD and below structured ASIC, while remaining a single-chip semiconductor solution for digital system integration.
Key features include 272MHz system performance, 3M system gates, 35K logic elements, 516,096 bits of true dual-port SRAM, and 341 available user I/O pins on the FG484 package. The flash configuration technology eliminates the need for external boot memory, allowing the device to power up immediately and reducing the total cost of ownership. The device is offered in a low-power 1.5V core and is supported by Microchip Libero SoC design tools.
The A3PE3000-1FG484 uses a 130nm, 7-layer-metal (6 copper) flash-based CMOS process. The flash cells are reprogrammable, enabling field upgrades and secure bitstream storage without external configuration PROMs. The ProASIC3E family includes global low-skew VersaNet networks for clocks and resets, and supports numerous single-ended and differential I/O standards as defined in the DS0098 datasheet.
Typical applications include industrial automation and control, communications infrastructure, medical imaging, automotive electronics, defense and aerospace systems, and IoT edge computing. The instant-on capability is particularly useful in safety-critical systems that must begin processing immediately after power application, while the 3M-gate density is suited to motor control, image processing, protocol bridging, and custom coprocessing tasks.
When designing with this FPGA, plan a clean 1.5V core supply with adequate decoupling on all VCC and VCCPLL balls. The 484-ball FBGA package with 1mm pitch requires a controlled BGA fanout strategy. Because the device is flash-based, power sequencing is simpler than SRAM-based FPGAs, but the recommended ramp and sequencing guidelines in the manufacturer datasheet should still be followed.
This page synthesizes distributor pricing, drop-in alternative parts, and practical PCB design guidance that are not all published in a single datasheet, enabling faster selection and design-in decisions for the A3PE3000-1FG484.
直接替换替代料： A3PE3000-1FG484 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE3000-1FG484 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Family, Core Supply Voltage, System Gates.
快速对比工具——选择替代料号进行并排对比：
A3PE3000-1FGG484I
✅ 直接替换✓ 有现货
$1336.6 / 个
查看数据手册 →A3PE3000-FG484
✅ 直接替换✓ 有现货
$139.75 / 个
查看数据手册 →A3PE3000-FG484I
✅ 直接替换✓ 有现货
$98.6 / 个
查看数据手册 →A3PE3000-1FGG484I
✅ 直接替换✓ 有现货
$1336.6 / 个
查看数据手册 →A3PE3000-2FG484I
✅ 直接替换✓ 有现货
$59.6 / 个
查看数据手册 →A3PE3000-2FGG484
✅ 直接替换✓ 有现货
$28.9 / 个
查看数据手册 →A3PE3000-1FG484 最大额定值与电气特性
| Family | ProASIC3E |
| System Gates | 3M (3.00E6) |
| Logic Elements | 35KLEs |
| User I/Os | 341 |
| RAM Bits | 516096 bits |
| True Dual-Port SRAM | Up to 504 kbits (family) |
| Core Supply Voltage | 1.5V |
| System Performance | 272MHz |
| Process Technology | 130nm, 7-layer metal (6 copper), flash-based CMOS |
| Flash-Based | Yes, Live-At-Power-Up |
| 封装 | 484-ball FBGA (FG484), 1mm pitch |
| 安装类型 | Surface Mount |
| 工作温度 | 0 to 70C |
| Configuration | Single-chip, no external boot PROM required |
| Level 0 Support | Yes |
A3PE3000-1FG484 484-ball fbga (fg484), 1mm pitch 引脚配置指南
A3PE3000-1FG484（484-ball fbga (fg484), 1mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE3000-1FG484.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE3000-1FG484 适用于 6 应用s: Industrial Automation and Motor Control, Communications Infrastructure, Medical Imaging and Diagnostic Equipment, Automotive Electronics and Infotainment, Defense and Aerospace Computing, IoT Edge Computing and Smart Sensors.
Industrial Automation and Motor Control
The A3PE3000-1FG484 provides 3M gates and 341 user I/Os for implementing multi-axis motor control, PLC I/O bridging, and high-speed fieldbus interfaces. Its 1.5V core and flash-based live-at-power-up behavior let the controller begin executing logic immediately on power-up, reducing system boot time in safety-rated automation equipment. With 516,096 bits of true dual-port SRAM, designers can build local data buffers for Ethernet/IP, PROFINET, or Modbus TCP without external memory. The commercial 0C-70C range covers machine-room and cabinet installations. For wider ambient requirements, choose the -I suffix version. The instant-on characteristic is valuable in applications where a host processor must not be held in reset while configuration data streams from a flash device.
推荐
Communications Infrastructure
In networking and telecom line cards, the A3PE3000-1FG484 handles protocol bridging, packet parsing, and time-stamping with 272MHz system performance and 341 I/Os. The 3M gates are sufficient for small switch-fabric elements or deterministic traffic shaping logic. True dual-port SRAM blocks allow simultaneous read/write access for queue management and buffer control, which is important in high-throughput data paths. Flash-based configuration means the FPGA is ready immediately after power-up, enabling hitless protection switching and faster recovery in carrier-grade equipment. Designers must follow the datasheet I/O standards table to match 1.8V, 2.5V, or 3.3V transceivers; the BGA-484 package with 1mm pitch enables compact board layouts. Use the -2 speed grade for timing-critical 10GbE or CPRI interfaces.
推荐
Medical Imaging and Diagnostic Equipment
Medical ultrasound, CT, and MRI systems require deterministic, low-latency digital processing for image formation, filtering, and sensor interfacing. The A3PE3000-1FG484 delivers 3M gates and 516,096 bits of SRAM to implement beamforming coefficients, digital down-conversion, and image preprocessing. Its flash architecture eliminates the need for external configuration PROM on every board, reducing BOM size and improving system reliability in devices that must power on in seconds without software loading. The commercial temperature range suits controlled clinical environments. For high-reliability imaging consoles, add the M1 variant for ARM Cortex-M3 processing alongside the FPGA fabric. The 341 user I/Os allow direct connection to high-speed ADCs, LVDS sensors, and display controllers. Please verify EMC/ESD compliance per the system-level medical standard during layout.
推荐
Automotive Electronics and Infotainment
The A3PE3000-1FG484 supports automotive gateway, telematics, and infotainment bridge applications with 3M gates and a 1.5V core. Although the standard part is 0C-70C, the FG484 package family includes -I industrial variants commonly used in automotive body controllers and head units with proper thermal management. Flash-based live-at-power-up avoids the long configuration delays of SRAM FPGAs during ignition events. With 341 I/Os, it can interface to CAN transceivers, Ethernet PHYs, and LVDS display links. Use the M1 ProASIC3E family if ARM processor firmware is needed alongside FPGA logic. For production, order the FGG lead-free finish to meet RoHS/REACH requirements. Designers should follow AEC-Q100 practices and additional qualification requirements if the system demands it, as this product is not explicitly marketed as AEC-Q100 in the verified data.
推荐
Defense and Aerospace Computing
In defense/aerospace systems, the A3PE3000-1FG484 provides secure, flash-based FPGA fabric that is resistant to configuration bitstream readback attacks because the programming data is stored on-chip. The 3M gates and 341 user I/Os support custom encryption, telemetry, sensor processing, and interface conversion. Live-at-power-up is critical for mission computers that cannot wait for configuration from an external memory. The commercial temperature range limits use to sealed or temperature-controlled avionics bays; use -I variants for wider ambient operation. Additional radiation-tolerant or hi-rel qualification is not offered standard, so select a rad-tolerant ProASIC3E derivative if needed. This page provides drop-in alternatives with the same 484-ball BGA footprint to ease second-sourcing in long-life programs.
推荐
IoT Edge Computing and Smart Sensors
The A3PE3000-1FG484 can serve as the digital brain in high-end IoT edge nodes that require deterministic real-time response, multiple sensor interfaces, and secure boot. Its 1.5V core and flash configuration simplify power supplies because no SPI NOR configuration flash is needed. With 35K logic elements and 516,096 bits of SRAM, it can process sensor fusion, run lightweight neural-network inference, or implement custom protocol stacks in parallel with an external host SoC. Instant-on operation is valuable in battery-powered or energy-harvesting systems where the processor sleeps and the FPGA must react to wake events immediately. The 341 user I/Os can connect to cameras, MEMS microphones, environmental sensors, and wireless transceivers. For lower power, explore ProASIC3L variants such as M1A3PE3000L.
推荐
推荐产品汇总
工程参考数据： A3PE3000-1FG484 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE3000-1FGG484 | A3PE3000-FG484I | A3PE3000-2FG484I |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | FBGA-484 (FG484) | FBGA-484 (FG484/FGG484) | FBGA-484 (FG484) | FBGA-484 (FG484) |
| System Gates | 3M | 3M | 3M | 3M |
| Logic Elements | 35KLEs | 35KLEs | 35KLEs | 35KLEs |
| User I/O | 341 | 341 | 341 | 341 |
| RAM Bits | 516096 bits | 516096 bits | 516096 bits | 516096 bits |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V |
| Speed Grade | -1 (272MHz system performance) | -1 (272MHz system performance) | Standard (base speed grade) | -2 (faster speed grade) |
| Operating Temperature | 0 to 70C | 0 to 70C | Industrial (typically -40C to 100C) | Industrial (typically -40C to 100C) |
关键差异点
- Live-at-power-up flash configuration （对比 SRAM-based FPGAs (e.g., Xilinx Spartan-6 or Intel MAX 10))
- -1 speed grade with 272MHz system performance in the FG484 package （对比 A3PE3000-FG484I (base speed grade))
- Commercial temperature range lowers cost （对比 A3PE3000-2FG484I (industrial -2 speed grade))
设计说明
The A3PE3000-1FG484 core operates from a 1.5V supply. Place at least one 100nF ceramic capacitor on every VCC and VCCPLL ball and add a 10uF bulk capacitor per power bank. Because the device is flash-based, no external configuration voltage is required; however, follow the power-up sequencing requirements in the DS0098 datasheet to minimize inrush current and avoid undefined I/O states.
The FG484 package is a 484-ball FBGA with 1mm pitch. Use via-in-pad or dog-bone fanout depending on board density. Keep all high-speed differential pairs routed with controlled impedance and matched length, and place ground vias near signal vias to reduce return-path inductance. The package pinout should be obtained from the official Microchip DS0098 pin table, not from third-party sources.
Do not assume all 616 family I/Os are available on the FG484 package; this part exposes 341 user I/Os. Verify bank voltage assignments according to the I/O standards used. Since the device is flash-based and can be reprogrammed in-system, take care not to drive the programming pins from high-voltage supplies during normal operation. Also confirm the operating temperature range versus your enclosure environment.
合规信息
RoHS/REACH status not explicitly provided in the verified web data. FGG suffix variants are commonly associated with lead-free finish, but this should be confirmed with the manufacturer datasheet or Microchip sales before production.
