A3PE600-2FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
料号： A3PE600-2FG484 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $128.5 | $128.50 |
| 10 | $115.65 | $1,156.50 |
| 100 | $102.8 | $10,280.00 |
| 500 | $92.52 | $46,260.00 |
| 1,000 | $83.27 | $83,270.00 |
A3PE600-2FG484 概述
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field, sitting above CPLDs in the programmable-logic hierarchy and below ASICs in density. The ProASIC3E family is distinctive because it uses flash technology rather than SRAM: configuration data is stored in on-chip flash cells, so the device is single-chip, instantly starts at power-up, and needs no external configuration PROM.
Key features include the 130 nm flash-based CMOS process, 600K system gates, speed grade -2, and reprogrammability without a boot device, which lowers total cost of ownership (TOC). The embedded 110592-bit RAM supports FIFOs and dual-port buffering in data-path designs.
Architecturally, ProASIC3E combines VersaTiles (fine-grained logic tiles), flash switches that are inherently non-volatile and radiation-tolerant versus SRAM alternatives, and embedded block RAM, delivering system performance up to 310 MHz on a 1.5V core.
Typical applications include industrial automation control, communications and networking line cards, aerospace/defense systems, and medical instrumentation, where instant-on, secure, non-volatile configuration and high I/O count are decisive.
Design consideration: the 1.5V core and 484-ball BGA demand careful power-plane design and controlled-impedance PCB stack-up; use Microchip Libero SoC for synthesis, place-and-route, and timing sign-off at the -2 speed grade.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3PE600-2FG484 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE600-2FG484 （相同外形与封装尺寸） ——差异在于 Package, Configuration Memory, Family, Operating Temperature, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
A3PE600-2FG484I
✅ 直接替换✓ 有现货
$79.9 / 个
查看数据手册 →A3PE600-FG484
✅ 直接替换✓ 有现货
$59 / 个
查看数据手册 →A3PE600-FG484I
✅ 直接替换✓ 有现货
$86.1 / 个
查看数据手册 →A3PE600-FGG484
✅ 直接替换✓ 有现货
$53.7 / 个
查看数据手册 →A3PE600-2FGG484I
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3P600-2FG484
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$61.5 / 个
查看数据手册 →A3PE600-2FG484 最大额定值与电气特性
| Family | ProASIC3E (Flash-based FPGA) |
| System Gates | 600,000 gates |
| Logic Cells | 13,824 |
| Number of I/Os | 270 |
| Embedded RAM | 110592 bits |
| Maximum Operating Frequency | 310 MHz |
| Process Technology | 130 nm CMOS flash |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -2 |
| 封装 | 484-ball FBGA (S-PBGA-B484) |
| Ball Pitch | 1.00 mm |
| 安装方式 | SMD/SMT |
| Operating Temperature (Commercial) | 0 C to +70 C |
| Configuration Memory | On-chip flash (non-volatile, single-chip) |
| Packaging | Tray |
| Reprogrammability | Yes (in-system reprogrammable) |
A3PE600-2FG484 484-ball fbga (s-pbga-b484) 引脚配置指南
A3PE600-2FG484（484-ball fbga (s-pbga-b484) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE600-2FG484.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE600-2FG484 适用于 6 应用s: Industrial Automation and Control, Communications and Networking Line Cards, Aerospace and Defense Systems, Medical Instrumentation, Test and Measurement Equipment, Video and Display Processing.
Industrial Automation and Control
The A3PE600-2FG484 fits industrial automation controllers because its 270 user I/Os interface with many sensors, encoders, and fieldbus transceivers simultaneously, while the 600K-gate fabric implements real-time logic and protocol bridging at up to 310 MHz. Its flash-based, single-chip configuration eliminates the external boot PROM required by SRAM FPGAs, improving uptime in electrically noisy factory environments and cutting bill-of-materials cost. Deployed between motor-drive interfaces and an industrial Ethernet MAC, the device provides deterministic glue logic and safety interlocks; the trade-off is that deterministic timing should be verified at the -2 speed grade with static timing analysis in Libero SoC. Choose the industrial-temperature A3PE600-2FG484I variant for environments outside 0 C to +70 C.
推荐
Communications and Networking Line Cards
In networking line cards, the A3PE600-2FG484 implements framer glue logic, packet-buffer management, and bus bridging using its 110592 bits of embedded RAM for FIFOs and dual-port buffering. The -2 speed grade sustains system performance up to 310 MHz, adequate for mid-rate backplane interfaces, and 270 I/Os support wide parallel data buses to PHY and MAC devices. Because ProASIC3E fabric is flash-based, configuration loads instantly at power-up, an advantage for equipment with strict link-recovery time requirements. The design consideration is signal integrity: the 484-ball FBGA with 1.00 mm pitch requires controlled-impedance routing and solid reference planes for the parallel buses; the trade-off versus newer families is lower serial bandwidth, so this device is best for parallel-bus architectures rather than multi-gigabit SerDes designs.
推荐
Aerospace and Defense Systems
Flash-based ProASIC3E devices are widely used in aerospace and defense because flash switching elements are inherently non-volatile and more tolerant of configuration upsets than SRAM-based fabrics, removing the need for continuous configuration scrubbing in many missions. The A3PE600-2FG484's 600K gates and 270 I/Os implement sensor interfaces, telemetry aggregation, and reconfigurable glue logic, while the 1.5V core keeps power budgets manageable in size-constrained avionics. The Microchip USA listings for related variants (A3PE600-2FG484IY/YI) confirm use in high-reliability programs. Use the Y-graded (military/extended-temperature) or I-graded variants for extreme environments; the commercial FG484 part is appropriate for prototypes and ground equipment. Radiation data must be taken from Microchip's formal reports rather than assumed.
推荐
Medical Instrumentation
Medical diagnostic and imaging instruments use the A3PE600-2FG484 for detector-interface timing, data-path formatting, and control logic, benefiting from 13,824 logic cells and instant-on flash configuration that shortens instrument boot time between patient examinations. The 110592-bit embedded RAM buffers ADC sample streams, and the wide 270-I/O count connects multi-channel front ends. Because flash devices power up within microseconds without external configuration memory, system availability improves, and reprogramming in the field allows feature updates without hardware changes, supporting long product lifecycles required by regulatory certification. Design caution: medical designs should lock the exact speed and temperature grade early because requalification after part substitution can require regulatory re-filing; the commercial part suits bench/lab instruments within 0 C to +70 C.
推荐
Test and Measurement Equipment
Bench and automated test equipment leverage the A3PE600-2FG484 as a reconfigurable timing, trigger, and protocol engine. Its 310 MHz capability and fine-grained VersaTile architecture implement precise trigger state machines and pattern generators, while 270 I/Os adapt to varied DUT interfaces across fixture generations. Because the fabric is reprogrammable flash, instrument firmware can be updated in the field, extending product life without hardware spins. The 110592-bit embedded RAM captures trace buffers between the analog front end and host processor. A practical benefit is single-chip boot: no configuration PROM means fewer failure points in rack systems. The trade-off is that very high capture bandwidth should be offloaded to dedicated memory since on-chip RAM is limited; plan the architecture accordingly at schematic time.
推荐
Video and Display Processing
The A3PE600-2FG484 serves video switchers, industrial displays, and broadcast glue logic by implementing pixel-pipeline formatting, scan conversion bridging, and multi-standard sync generation. The 110592-bit embedded RAM holds line buffers, and the -2 speed grade supports pixel clocks in the tens of MHz range comfortably, with 270 I/Os handling wide parallel video buses such as RGB and ITU-R interfaces. Flash configuration gives instant-on display initialization, avoiding visible blanking delays at power-up. For higher resolutions, the fabric concentrates on protocol bridging while dedicated scaler/serializer chips handle pixel-rate conversion. The design trade-off: the 1.5V core plus I/O banks need careful plane segmentation to prevent video noise coupling; verify power integrity with Microchip's ProASIC3E power estimation flow before tape-out.
推荐
推荐产品汇总
工程参考数据： A3PE600-2FG484 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE600-2FG484I | A3PE600-FG484 | A3PE600-FGG484 | A3PE600-2FGG484I | A3P600-2FG484 |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/Os | 270 | 270 | 270 | 270 | 270 | 270 |
| Speed Grade | -2 (up to 310 MHz) | -2 | Standard (-1) | Standard (-1) | -2 | -2 |
| Operating Temperature | 0 C to +70 C (commercial) | Industrial (-40 C to +100 C) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | Industrial (-40 C to +100 C) | 0 C to +70 C (commercial) |
| Configuration Type | On-chip flash, single-chip, instant-on | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
关键差异点
- Fastest timing grade in the same footprint （对比 A3PE600-FG484)
- Industrial temperature availability （对比 A3PE600-2FG484I)
- Embedded RAM for buffering （对比 A3P600-2FG484)
设计说明
The A3PE600-2FG484 requires a 1.5V core supply with separate I/O bank supplies. Estimate dynamic power using Microchip's ProASIC3E power calculation tools in Libero SoC, since flash FPGA power depends heavily on toggling activity rather than a fixed quiescent figure. Provide wide power planes with bulk capacitance at each I/O bank; Estimated: for typical designs at moderate utilization, total power remains well under 1 W, but verify per your netlist. Follow the ProASIC3E family datasheet power-up sequencing recommendations to avoid latch-up during multi-rail startup.
The 484-ball FBGA with 1.00 mm pitch typically requires a minimum 6-layer stack-up with dedicated ground planes for signal-integrity escape routing. Use via-in-pad or dog-bone escape patterns, and download the verified symbol and footprint from SnapMagic (SnapEDA) or Libero SoC rather than hand-drawing the 484-ball map. Keep parallel high-speed bus lengths matched within the interface's timing budget and maintain controlled impedance referenced to an unbroken plane.
Confirm the temperature grade before finalizing the BOM: the FG484 suffix is commercial 0 C to +70 C, while the I suffix is industrial. Mixing grades in one design creates a sourcing/configuration risk. Also remember that while ProASIC3E is single-chip flash (no external boot PROM), device programming still requires the Libero SoC toolchain and programming hardware; plan programming access in production fixtures. Verify the -2 speed grade timing with static timing analysis; do not assume standard-grade timing closure transfers automatically.
合规信息
Verified web data does not state RoHS/REACH status for A3PE600-2FG484. Note the GG suffix variants (e.g., A3PE600-2FGG484I) denote Pb-free/halogen-free ball metallurgy per Microchip naming conventions; confirm certification documents with Microchip for the exact MPN.
