A3P600-2FG484 - ProASIC3 FPGA, 600K Gates | Microchip
MPN: A3P600-2FG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $91.85 | $91.85 |
| 10 | $84.5 | $845.00 |
| 100 | $76.2 | $7,620.00 |
| 500 | $68.9 | $34,450.00 |
| 1,000 | $61.5 | $61,500.00 |
Drop-in alternatives for A3P600-2FG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P600-2FGG484I
✅ Drop-In✓ In Stock
$31.8 / Unit
View Datasheet →A3P600-2FG484I
✅ Drop-In📋 Reference alternative (not in catalog)
A3P600-2FGG484I
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$31.8 / Unit
View Datasheet →A3P600-FG484I
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$25.4 / Unit
View Datasheet →A3P600-FGG484
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$44.75 / Unit
View Datasheet →A3P600-FGG484I
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$55.3 / Unit
View Datasheet →A3P600-2FG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 600K |
| Logic Elements (LEs) | 7K LEs (approx.) |
| User I/Os | 235 |
| RAM Bits | 110592 |
| Core Supply Voltage | 1.5V |
| Maximum System Performance | 310 MHz |
| I/O Banks | 4 |
| Package | 484-BGA (FBGA) |
| Mounting Type | Surface Mount |
| Process Technology | 130nm CMOS |
| Configuration | Flash-based |
| RoHS Status | Compliant |
| Lead-Free | Yes |
A3P600-2FG484 484-bga (fbga) Pin Configuration Guide
Complete pinout information for A3P600-2FG484 (484-bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600-2FG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-2FG484 is suitable for 6 applications: Industrial Automation, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Devices, IoT and Edge Computing.
Industrial Automation
The A3P600-2FG484 is ideal for industrial automation due to its 600K gates and 235 I/Os, enabling implementation of motor control, PLC interfaces, and sensor processing. Its flash-based configuration provides instant-on and high reliability in harsh environments. The 1.5V core and 310 MHz performance support real-time control loops and communication protocols like EtherCAT. With four I/O banks, it can interface with various voltage levels, simplifying system integration. The FPGA's reprogrammability allows field updates and customization for different automation tasks, reducing time-to-market and inventory costs.
Recommended
Automotive Electronics
In automotive electronics, the A3P600-2FG484 can be used for body control modules, infotainment systems, and advanced driver-assistance systems (ADAS) preprocessing. Its 600K gates provide ample logic for implementing communication interfaces like CAN and LIN, while the 235 I/Os connect to sensors and actuators. The flash-based architecture ensures reliable operation across temperature extremes, and the instant-on capability is crucial for safety-critical applications. Although not AEC-Q100 qualified, the industrial temperature grade variant (A3P600-2FGG484I) offers extended temperature range for under-hood applications. The FPGA's reprogrammability enables over-the-air updates, enhancing vehicle functionality post-production.
Recommended
Communications Infrastructure
The A3P600-2FG484 is well-suited for communications infrastructure, including base stations, routers, and switches. Its 600K gates and 235 I/Os enable implementation of packet processing, protocol conversion, and interface bridging. The 310 MHz system performance supports high-speed data paths, while the four I/O banks allow interfacing with various logic levels (e.g., LVCMOS, LVDS). The flash-based configuration provides secure boot and prevents unauthorized copying, which is critical for network equipment. The FPGA's reprogrammability allows firmware updates to support evolving standards, extending product lifespan. Its low power consumption compared to SRAM-based FPGAs makes it suitable for power-constrained remote equipment.
Recommended
Aerospace and Defense
In aerospace and defense, the A3P600-2FG484 is used for avionics, satellite subsystems, and secure communication systems. Its flash-based FPGA offers radiation tolerance and immunity to configuration upsets, making it suitable for space applications. The 600K gates and 235 I/Os support complex signal processing and interface management. The instant-on capability ensures immediate operation upon power-up, critical for mission-critical systems. The device's security features protect intellectual property and prevent reverse engineering. The industrial temperature grade variant (A3P600-2FGG484I) is recommended for extreme environments. The FPGA's reprogrammability allows in-field updates, enabling adaptability to changing mission requirements.
Recommended
Medical Devices
The A3P600-2FG484 is suitable for medical devices such as patient monitors, imaging systems, and diagnostic equipment. Its 600K gates and 235 I/Os enable implementation of data acquisition, signal processing, and display interfaces. The flash-based configuration provides reliable operation and instant-on, which is essential for life-critical devices. The FPGA's low power consumption is beneficial for battery-powered portable devices. The reprogrammability allows firmware updates to improve functionality and address bugs without hardware changes. The industrial temperature grade variant (A3P600-2FGG484I) is available for devices that require extended temperature ranges. Compliance with medical standards is facilitated by the device's RoHS compliance and lead-free construction.
Recommended
IoT and Edge Computing
The A3P600-2FG484 is ideal for IoT gateways and edge computing devices that require flexible I/O and moderate logic capacity. Its 600K gates and 235 I/Os allow implementation of protocol bridging, sensor fusion, and local decision-making. The flash-based FPGA provides instant-on and low power consumption, making it suitable for battery-powered or energy-harvesting devices. The reprogrammability enables over-the-air updates to adapt to changing IoT standards. The four I/O banks support various sensor interfaces, including SPI, I2C, and UART. The device's security features protect data and prevent unauthorized access. The industrial temperature grade variant (A3P600-2FGG484I) is available for outdoor or harsh environments.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-2FG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-2FGG484 | A3P600-2FG484I | A3P600-2FGG484I | A3P600-FG484I | A3P600-FGG484 | A3P600-FGG484I |
|---|---|---|---|---|---|---|---|
| Package | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K | 600K | 600K |
| User I/Os | 235 | 235 | 235 | 235 | 235 | 235 | 235 |
| RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 | 110592 |
| Core Supply Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| Maximum System Performance | 310 MHz | 310 MHz | 310 MHz | 310 MHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Grade | Commercial | Commercial | Industrial | Industrial | Industrial | Commercial | Industrial |
Key Differentiators
- Flash-based configuration provides instant-on and secure boot (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Low power consumption compared to SRAM-based FPGAs (vs SRAM-based FPGAs (e.g., Altera Cyclone IV))
- Reprogrammability with in-system programming (ISP) (vs ASICs)
Design Notes
The A3P600-2FG484 requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with adequate current capability. Estimated: For a design with 50% logic utilization and 100 MHz clock, core current may be around 200-400 mA. Provide decoupling capacitors (0.1uF and 10uF) close to each VCC pin to minimize voltage ripple. Refer to the Microchip power application notes for detailed calculations.
For the 484-ball FBGA package, use a multi-layer PCB with dedicated power and ground planes. Ensure the thermal pad (if present) is properly connected to ground for heat dissipation. Route high-speed I/O signals with controlled impedance (e.g., 50 ohms) and minimize trace lengths. Place decoupling capacitors as close as possible to the FPGA power pins. Follow the layout guidelines in the Microchip FPGA layout application note.
Avoid exceeding the absolute maximum ratings for the core supply voltage (1.5V ±5%). Ensure all I/O banks are powered with the correct VCCIBX voltage before applying signals. Do not leave unused I/O pins floating; configure them as inputs with pull-ups or as outputs. When programming the FPGA, use the recommended programmer and follow the programming sequence to avoid configuration errors. Also, verify that the JTAG pins are not conflicting with other functions.
Compliance Information
RoHS compliant and lead-free per distributor listings. AEC-Q100 qualification not specified for this part.
